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    Journal Name:Lecture Notes in Electrical Engineering (ISSN: 1876-1100)

    Published By: springer

    Website: www.springer.com/series/7818

    Print ISSN: 1876-1100 1876 1100

    Online ISSN: 18761100

    Aims & Scope:
    Lecture Notes in Electrical Engineering (ISSN:1876-1100)

    The book series Lecture Notes in Electrical Engineering (LNEE) publishes the latest developments in Electrical Engineering - quickly, informally and in high quality. While original research reported in proceedings and monographs has traditionally formed the core of LNEE, we also encourage authors to submit books devoted to supporting student education and professional training in the various fields and applications areas of electrical engineering. The series cover classical and emerging topics concerning:

    Communication Engineering, Information Theory and Networks

    Electronics Engineering and Microelectronics

    Signal, Image and Speech Processing

    Wireless and Mobile Communication

    Circuits and Systems

    Energy Systems, Power Electronics and Electrical Machines

    Electro-optical Engineering

    Instrumentation Engineering

    Avionics Engineering

    Control Systems

    Internet-of-Things and Cybersecurity

    Biomedical Devices, MEMS and NEMS

    电气工程讲义(LNEE)系列丛书出版了电气工程的最新发展——快速、非正式和高质量。虽然在会议录和专着中报告的原创研究传统上是 LNEE 的核心,但我们也鼓励作者提交专门支持电气工程各个领域和应用领域的学生教育和专业培训的书籍。该系列涵盖了有关以下方面的经典和新兴主题:

    通信工程、信息论与网络

    电子工程与微电子学

    信号、图像和语音处理

    无线和移动通信

    电路和系统

    能源系统、电力电子和电机

    光电工程

    仪表工程

    航空电子工程

    控制系统

    物联网和网络安全

    生物医学设备、MEMS 和 NEMS

    SCI 专刊 (Special Issue) 长期征稿

    http://www.researchi.org/

    ESCI .SCOPUS等索引. 期刊快速发表 https://blog.researchi.org/845-21st/

    与国内外部分高校,外企,科研机构有会议合作关系 每月均会提交会议论文至不同出版社出版,与多家世界知名出版集团建立了良好的合作关系,如IEEE Press, IEEE CS CPS, Springer, Elsevier, IOP, Academic Press, ASME, American Scientific Publishing, SPIE, CRC Press / Balkema, DEStech Publications, TTP and Atlantis Press等, 且可推荐优秀学术论文至知名国际期刊发表.

    欢迎广大社会工作者、教育工作者、研究生、博士生提交论文与合作 针对高校和个人作者一次性投稿多篇文章后, 后续作者在本中心投稿的文章费用 按照之前的多篇文章最低价格优惠

    SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed

    Journal list

    网址: http://www.researchi.org/ http://blog.researchi.org/

    https://www.conf.org.cn/

    EI Compendex. CPCI.SCOPUS 期刊 会议 丛书征稿

    SCOPUS. Engineering Village.Web of Science

    All the Science fit to Publish

    Website:http://www.researchi.org/

    (EI Compendex. CPCI.SCOPUS会议 丛书征稿

    SCOPUS. Engineering Village.Web of Science)

    SCI、SSCI、A&HCI、EI、CSSCI、CPCI-S(ISTP)、CPCI-SSH(ISSHP)

    Website: http://www.researchi.org/

    联系我们:

    ( QQ:1422679111 Wechat/Tel: 13212744212

    WhatsApp:+86 13212744212)

    网址: http://blog.researchi.org/ http://www.researchi.org/

    https://www.conf.org.cn/

    SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed Journals 期刊

    http://www.researchi.org/

    Indexed By: DBLP, EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP), Scopus.

    Impact Factor (IF): 2024 still computing

    ISSN-L: 18761100 1876 1100

    Update: 2021-09-10 18:10:22

    1876-08051876-08131876-08211876-083X1876-08481876-0856
    1876-08641876-08721876-08801876-08991876-09021876-0910
    1876-09291876-09371876-09451876-09531876-09611876-097X
    1876-09881876-09961876-10031876-10111876-102X1876-1038
    1876-10461876-10541876-10621876-10701876-10891876-1097
    1876-11001876-11191876-11271876-11351876-11431876-1151
    1876-116X1876-11781876-11861876-11941876-12081876-1216
    1876-12241876-12321876-12401876-12591876-12671876-1275

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.