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    ICICM 2025 - 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)

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    Website http://icicm.net/ | Edit Freely

    Category Integrated Circuits and Microsystems

    Deadline: September 10, 2025 | Date: October 17, 2025-October 19, 2025

    Venue/Country: Hefei, China

    Updated: 2024-12-20 17:44:37 (GMT+9)

    Call For Papers - CFP

    ★Full Name: 2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)

    ★Abbreviation: ICICM 2025

    **Place: Hefei, China

    **Time: October 17-19, 2025

    **Website: http://icicm.net/

    ★Co-Sponsored by:

    ==Anhui University

    ==Southeast University

    ==University of Electronic Science and Technology of China

    =Publication=

    The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.

    ***ICICM 2016-2024 has been successfully indexed by EI Compendex and Scopus already!

    ***Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing)

    ==Submission==

    1. Full paper (publication and presentation)

    2. Abstract (presentation only)

    ★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2025

    ★ Email submission: icicm_conf@vip.163.com

    More detail about submission, please visit at http://icicm.net/submission.html

    =Topics (include but not limit)=

    Track 1: Electronic Design Automation (EDA)

    • Progress of EDA algorithms

    • EDA for emerging technologies

    • Hardware-software co-design with EDA

    • EDA in High Performance Computing (HPC)

    • EDA in analog and mixed-signal design

    Track 2: Integrated Circuit and System Design

    • Digital, analog, mixed-signal IC and SOC design technology

    • IC computer-aided design technology, DFM

    • Modeling and simulation

    Track 3: Semiconductor Devices and Circuits

    • Components and circuits for wireless systems

    • Low power, RF devices and circuits

    • Silicon/Germanium Devices and Device Physics

    • Compound semiconductor devices and circuits

    Track 4: Process Technology and Manufacturing

    • Silicon integrated circuits and manufacturing

    • Interconnect, low-K, high-K and other process technologies

    • Packaging and testing technology, equipment technology

    For more topics, please visit at: http://icicm.net/call-for-papers.html

    ==Organizing Committee==

    Advisory Chairs

    Junfa Mao, Shenzhen University, China

    Yue Hao, Xidian University, China

    Conference Chairs

    Zhigong Wang, Southeast University, China

    Ning Xu, Wuhan University of Technology, China

    Conference Co-Chairs

    Yu Wang,Tsinghua University,China

    Letian Huang, University of Electronic Science and Technology of China, China

    Program Chairs

    Jiliang Zhang, Hunan University, China

    Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China

    Sheng Chang, Wuhan University, China

    Yingmei Chen, Southeast University, China

    Xiulong Wu, Anhui University, China

    Zhikuang Cai, Nanjing University of Posts and Telecommunications, China

    Zhuo Zou, Fudan University, China

    Jianguo Hu, Sun Yat-sen University , China

    Bei Yu,The Chinese University of Hong Kong, China

    Program Co-Chairs

    Junyong Deng, Xi'an University of Posts & Telecommunications, China

    Jun Xu, Nanjing University, China

    Zhixiong Di, Southwest Jiaotong University, China

    Guojie Luo, Peking University, China

    Xiaojun Zhai, University of Essex, UK

    Wei Xing, The University of Sheffield, UK

    Program Committee

    Shi Pu, Wuhan University of Technology , China

    Haizhi Song, University Of Electronic Science And Technology Of China, China

    Lu Zhu, Sun Yat-sen University, China

    Youming Zhang, Southeast University, China

    Jianshi Tang, Tsinghua University, China

    Weiguang Sheng, Shanghai Jiao Tong University, China

    Hao Gao, Austria & Eindhoven University of Technology, The Netherland

    Yun Fang, Silicon Austria Labs, Austria

    Jeff Kilby, Auckland University of Technology, New Zealand

    Zhijun Zhou, Southeast University, China

    Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China

    Wei Hu, Northwestern Polytechnical University, China

    Local Chair

    Bowen Jia, Wuhan University of Technology , China

    Student Program Chairs

    Keping Wang, Tianjin University, China

    Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China

    Fanyi Meng, Tianjin University, China

    Student Program Committee

    Li Du, Nanjing University, China

    Lei Wang, Nanjing University Of Posts And Telecommunications, China

    Xianbo Li, Sun Yat-sen University, China

    Tiehu Li, Chongqing University of Technology, China

    Moufu Kong, University of Electronic Science and Technology of China, China

    Jiaxin Liu, University of Electronic Science and Technology of China, China

    Maliang Liu, Xidian University, China

    More Organizing Committee list, please visit: https://icicm.net/committee.html

    =Contact us=

    Ms. Mila Xiao

    Email: icicm_conf@vip.163.com

    Web: http://icicm.net/

    Tel: (86)134-0855-5552


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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