ICICM 2025 - 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)
View: 210
Website http://icicm.net/ |
Edit Freely
Category Integrated Circuits and Microsystems
Deadline: September 10, 2025 | Date: October 17, 2025-October 19, 2025
Venue/Country: Hefei, China
Updated: 2024-12-20 17:44:37 (GMT+9)
Call For Papers - CFP
★Full Name: 2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)★Abbreviation: ICICM 2025**Place: Hefei, China**Time: October 17-19, 2025**Website: http://icicm.net/
★Co-Sponsored by: ==Anhui University==Southeast University==University of Electronic Science and Technology of China=Publication=The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.***ICICM 2016-2024 has been successfully indexed by EI Compendex and Scopus already!***Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing)==Submission==1. Full paper (publication and presentation) 2. Abstract (presentation only) ★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2025
★ Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html
=Topics (include but not limit)=Track 1: Electronic Design Automation (EDA)• Progress of EDA algorithms• EDA for emerging technologies• Hardware-software co-design with EDA• EDA in High Performance Computing (HPC)• EDA in analog and mixed-signal designTrack 2: Integrated Circuit and System Design• Digital, analog, mixed-signal IC and SOC design technology• IC computer-aided design technology, DFM• Modeling and simulationTrack 3: Semiconductor Devices and Circuits• Components and circuits for wireless systems• Low power, RF devices and circuits• Silicon/Germanium Devices and Device Physics• Compound semiconductor devices and circuitsTrack 4: Process Technology and Manufacturing• Silicon integrated circuits and manufacturing• Interconnect, low-K, high-K and other process technologies• Packaging and testing technology, equipment technologyFor more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==Advisory ChairsJunfa Mao, Shenzhen University, China Yue Hao, Xidian University, ChinaConference ChairsZhigong Wang, Southeast University, ChinaNing Xu, Wuhan University of Technology, China Conference Co-ChairsYu Wang,Tsinghua University,ChinaLetian Huang, University of Electronic Science and Technology of China, ChinaProgram ChairsJiliang Zhang, Hunan University, China Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, ChinaSheng Chang, Wuhan University, ChinaYingmei Chen, Southeast University, ChinaXiulong Wu, Anhui University, ChinaZhikuang Cai, Nanjing University of Posts and Telecommunications, ChinaZhuo Zou, Fudan University, ChinaJianguo Hu, Sun Yat-sen University , ChinaBei Yu,The Chinese University of Hong Kong, ChinaProgram Co-ChairsJunyong Deng, Xi'an University of Posts & Telecommunications, ChinaJun Xu, Nanjing University, ChinaZhixiong Di, Southwest Jiaotong University, ChinaGuojie Luo, Peking University, ChinaXiaojun Zhai, University of Essex, UKWei Xing, The University of Sheffield, UKProgram CommitteeShi Pu, Wuhan University of Technology , ChinaHaizhi Song, University Of Electronic Science And Technology Of China, ChinaLu Zhu, Sun Yat-sen University, ChinaYouming Zhang, Southeast University, ChinaJianshi Tang, Tsinghua University, ChinaWeiguang Sheng, Shanghai Jiao Tong University, ChinaHao Gao, Austria & Eindhoven University of Technology, The NetherlandYun Fang, Silicon Austria Labs, AustriaJeff Kilby, Auckland University of Technology, New ZealandZhijun Zhou, Southeast University, ChinaXingyuan Tong, Xi`an University Of Posts & Telecommunications, ChinaWei Hu, Northwestern Polytechnical University, ChinaLocal ChairBowen Jia, Wuhan University of Technology , ChinaStudent Program ChairsKeping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, ChinaFanyi Meng, Tianjin University, ChinaStudent Program Committee Li Du, Nanjing University, ChinaLei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, ChinaTiehu Li, Chongqing University of Technology, ChinaMoufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, ChinaMaliang Liu, Xidian University, ChinaMore Organizing Committee list, please visit: https://icicm.net/committee.html
=Contact us=Ms. Mila XiaoEmail: icicm_conf@vip.163.com Web: http://icicm.net/
Tel: (86)134-0855-5552
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.