The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025)
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Website https://www.academicx.org/ICMTT/2025/ |
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Category Microwave;Terahertz
Deadline: December 04, 2024 | Date: January 04, 2025-January 06, 2025
Venue/Country: Sanya, China
Updated: 2024-04-25 16:37:52 (GMT+9)
Call For Papers - CFP
The 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025) Website:https://www.academicx.org/ICMTT/2025/ Date:January 4-6, 2025Venue: Sanya, ChinaThe 8th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2025) will be held in Sanya, China on January 4-6, 2025. This conference will cover issues on microwave and terahertz technology. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.Sanya is superior in geography climate and natural resources. It is known as “the oriental Hawaii" and “Sunshine City” because of its special tropical scenes as well as its attractive nature. Sanya's tourist resources, richly endowed by nature, are not only special in China, but also rare in the world. It is a most fashionable place where tropical marine tourist resources are closely concentrated and lovers of swimming can enjoy their holidays in winter. Within the city, well-known tourist spots are dotted everywhere--the national Yalong Tourist Area, the Tianyahaijiao, the Great Eastern Sea, the Luhuitou Peninsula, Sanya Bay and the Luobi Grotto. Besides these, there remain the ancient Yazhou City and relics and a sculpture of the Monk Jianzhen of the Tang Dynasty, who landed ashore to avoid the storm when he was sailing eastwards to Japan.Attendance Methods1. Full Paper submissionSubmit full paper ( Regular Attendance + Paper Publication + Presentation )You are invited to submit papers and participate in our academic exchange. One author will be invited to make an oral presentation and the paper will be published by peer-reviewed open access journal and submitted to CNKI and Google Scholar for indexing.2.Abstract submissionSubmit abstract ( Regular Attendance + Abstract + Presentation )You are welcome to submit abstract for oral presentation or poster presentation.3.Regular Attendance ( No Submission Required ) You're also welcome to attend our conference (without submitting full paper or abstract).Publication and PresentationPublication: All the accepted papers will be published by a peer-reviewed open access journal that can ensure the widest dissemination of your published work. For more information, please contact us (editor1@academicx.org). Note:1. If you want to present your research results but do NOT wish to publish a paper, you may simply submit an Abstract to our Registration System. 2. Please click Template for Manuscripts (below the Registration button at the top left corner) to download the Full Paper template and prepare your article according to it. The full length of one paper is suggested to be about 15 pages (within the template format with all tables, figures and references). If your paper is over 20 pages, you will be kindly requested to pay for extra pages fees. 3. The simple Abstract submission should include the title, contents, keywords, authors names, affiliations and emails. The length is suggested to be controlled within 1 page and no more than 2 pages.4. You will receive the review results within 3-5 working days after submission. If you do not get any notification within the time limit, please contact us as soon as possible.5. You are welcome to submit papers in Chinese and please contact us for more details.Contact UsEmail: editor1@academicx.orgWhatsapp: 0086 13264702250Tel: +86 132 6470 2250QQ: 1349406763WeChat: 3025797047 Official Account: Academic Communications Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:Microwave Field and TechniquesField Analysis and Guided WavesFrequency-Domain EM Analysis TechniquesTime-Domain EM Analysis TechniquesCAD Algorithms and TechniquesLinear Device ModelingNonlinear Device ModelingNonlinear Circuit and System SimulationMicrowave Passive ComponentsTransmission Line ElementsPassive Circuit ElementsPlanar Passive Filters and MultiplexersNon-planar Passive Filters and MultiplexersActive, Tunable and Integrated FiltersFerroelectric, Ferrite and Acoustic Wave ComponentsMEMS Components and TechnologiesMicrowave Active ComponentsSemiconductor Devices and Monolithic ICsSignal GenerationFrequency Conversion and ControlHF, VHF and UHF Technologies and ApplicationsPower Amplifier Devices and CircuitsHigh-Power AmplifiersLow Noise Components and ReceiversMm-Wave and THz Components and TechnologiesMicrowave Systems and ApplicationsMicrowave PhotonicsMixed Mode and Digital Signal Processing Circuits and SystemsPackaging, Interconnects, MCMs and IntegrationInstrumentation and Measurement TechniquesBiological Effects and Medical ApplicationsArrays as Antennas and Power CombinersRadar and Broadband Communication SystemsWireless and Cellular Communication SystemsSensors and Sensor SystemsRFID TechnologiesHigh Power Microwave Industrial ApplicationsEmerging Technical Areas of MicrowaveRF NanotechnologyWireless Power TransmissionNew Technologies and ApplicationsInnovative SystemsMicrowave/RF Devices for Wireless Health Care ApplicationsTerahertz Theory and TechnologyTerahertz Devices: Electronics/Photonics/PlasmonicsTerahertz Generation, Propagation, and InteractionPassive Components and Materials Issues in TerahertzTerahertz ImagingTerahertz Sources, Detectors and ReceiversTerahertz System Architectures and Distributed NetworksTerahertz DiagnosticsTerahertz NanoelectronicsTerahertz SpectroscopyTerahertz SystemsAdvanced Materials and Concepts (E.G., Metamaterials, Memristor)Novel Concepts (E.G., Plasmonic THz, Quantum Cascade Lasers)Terahertz to Optical Metamaterials, Assemblies, and SystemsNew Frontiers and Recent Breakthroughs in Terahertz ResearchNovel Applications of TerahertzVLSI Trustworthiness and Inspection – Counterfeit IC DetectionIndustrial InspectionSecurity and MilitaryBiomedicalInformation Processing and ComputingElectronics/Information/Communication SystemsIntegration of Advanced Materials with Conventional Devices and Systems
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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