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    2024 9th International Conference on Mechanical Structures and Smart Materials (ICMSSM2024)

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    Deadline: June 15, 2024 | Date: June 16, 2024-June 17, 2024

    Venue/Country: Beijing, China

    Updated: 2024-01-27 11:28:21 (GMT+9)

    Call For Papers - CFP

    ICMSSM 2024 is the 9th edition in this series of conferences started in 2013 that are devoted to around the design and analysis of mechanical structures that incorporate smart materials. ICMSSM is a famous event worldwide that covers many dimensions of adaptive structural design, smart materials for intelligent sensing and monitoring systems, energy harvesting and storage, vibration control and damping, biomechanics.

    Following the traditions of previous successful ICMSSM conferences held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi'an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; and most recently, a virtual gathering in Bangkok in 2023.

    The paper publication

    ICMSSM 2024 will produce electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines. The ICMSSM formal proceedings will include: regular papers accepted as oral presentation, regular papers accepted as posters, papers for special sessions and workshops.

    All accepted full papers will be published in IOP Conference Series: Journal of Physics (JPCS) and submitted for major indexing service like EI-Compendex, SCOPUS and etc.

    Conference Theme

    Topics of Interest for submission include, but are not limited to:

    T1: Mechanical Science and Technology Advances

    T2: Smart Structures and Systems

    T3: Smart Materials and Surfaces

    T4: Materials Manufacturing and Processing

    T5: Methodology of Research and Analysis and Modeling

    Keynote Speakers

    Assoc. Prof. Ching Yern Chee, Universiti Malaya, Malaysia

    Prof. Sinin bin Hamdan, Universiti Malaysia Sarawak, Malaysia

    Prof. Yan Zhuge, UniSA STEM, University of South Australia, Australia

    Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

    Prof. Daolun Chen, Toronto Metropolitan University, Canada

    Prof. Alan Kin Tak, Technological and Higher Education Institute of Hong Kong

    Prof. Zhili Dong, Nanyang Technological University, Singapore

    Submission method

    1、Submit by system:


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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