Category

Deadline: June 15, 2024 | Date: June 16, 2024-June 17, 2024

Venue/Country: Beijing, China

Updated: 2024-01-27 11:28:21 (GMT+9)

Call For Papers - CFP

Following the traditions of previous successful ICMSSM conferences held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi'an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; and most recently, a virtual gathering in Bangkok in 2023.

The paper publication

ICMSSM 2024 will produce electronic formal proceedings - with ISBN number, and to be indexed in the major bibliographical search engines. The ICMSSM formal proceedings will include: regular papers accepted as oral presentation, regular papers accepted as posters, papers for special sessions and workshops.

All accepted full papers will be published in IOP Conference Series: Journal of Physics (JPCS) and submitted for major indexing service like EI-Compendex, SCOPUS and etc.

Conference Theme

Topics of Interest for submission include, but are not limited to:

T1: Mechanical Science and Technology Advances

T2: Smart Structures and Systems

T3: Smart Materials and Surfaces

T4: Materials Manufacturing and Processing

T5: Methodology of Research and Analysis and Modeling

Keynote Speakers

Assoc. Prof. Ching Yern Chee, Universiti Malaya, Malaysia

Prof. Sinin bin Hamdan, Universiti Malaysia Sarawak, Malaysia

Prof. Yan Zhuge, UniSA STEM, University of South Australia, Australia

Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore

Prof. Daolun Chen, Toronto Metropolitan University, Canada

Prof. Alan Kin Tak, Technological and Higher Education Institute of Hong Kong

Prof. Zhili Dong, Nanyang Technological University, Singapore

Submission method