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    ICMSN 2024 - 8th International Conference on Materials Sciences and Nanomaterials (ICMSN 2024)

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    Website http://www.icmsn.org | Want to Edit it Edit Freely

    Category Materials Sciences and Nanomaterials

    Deadline: June 01, 2024 | Date: July 09, 2024-July 12, 2024

    Venue/Country: Edinburgh, U.K.

    Updated: 2023-11-30 16:22:00 (GMT+9)

    Call For Papers - CFP

    *Full Name: 2024 The 8th International Conference on Materials Sciences and Nanomaterials (ICMSN 2024)

    *Abbreviation: ICMSN 2024

    ~Conference Venue: Edinburgh, United Kingdom

    ~Conference Dates: July 9-12, 2024

    ~Conference website: www.icmsn.org

    *Publication of ICMSN 2024

    The registered and presented papers will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Scopus, Chemical Abstracts Service (CAS), REAXYS, Chimica, etc.

    *Conference History

    ~ICMSN 2023-Cambridge, United Kingdom-July 11-13, 2023

    Materials Science Forum-publication in progress

    ~ICMSN 2022-London, United Kingdom-July 12-14, 2022

    Materials Science Forum (Vol. 1075) | Scopus-ISBN: 978-3-0357-1843-0

    ~ICMSN 2021-Virtual Conference-July 13-15, 2021

    Key Engineering Materials (Vol. 907) | Scopus-ISBN: 978-3-0357-1894-2

    ~ICMSN 2020-Virtual Conference-July 8-10, 2020

    Key Engineering Materials ((Vol. 878) | Ei Compendex & Scopus-ISBN: 978-3-0357-1749-5

    ~ICMSN 2019-University of Oxford, United Kingdom-July 22-24, 2019

    Materials Science Forum (Vol. 982) | Ei Compendex & Scopus-ISBN: 978-3-0357-1555-2

    ~ICMSN 2018-University of Liverpool, United Kingdom-July 11-13, 2018

    Materials Science Forum (Vol. 962) | Ei Compendex & Scopus-ISBN: 978-3-0357-1416-6

    ~ICMSN 2017-Barcelona, Spain-July 14-16, 2017

    IOP Conference Series: MSE (Vol. 230) | Ei Compendex & Scopus-ISSN: 1757-8981

    *Conference Committees

    ~Conference Chairs

    Prof. Alexander M. Korsunsky, Vice President, Trinity College, University of Oxford, UK

    Prof. Yuyuan Zhao, University of Liverpool, UK & Ningbo University of Technology, China

    ~Program Chairs

    Prof. Anja Pfennig, HTW-Berlin University of Applied Sciences, Germany

    Prof. Sotirios Grammatikos, Norwegian University of Science and Technology, Norway

    Assoc. Prof. Christ le Jaillet, CRPP-CNRS University of Bordeaux, France

    ~Publicity Chairs

    Assoc. Prof. Ludmila Kucerova, University of West Bohemia, Czech Republic

    Assoc. Prof. Steven Frederick Durrant, Instituto de Ci ncia e Tecnologia de Sorocaba, UNESP, Brazil

    Assoc. Prof. Alysson Martins A. Silva, Universidade de Brasilia, Brazil

    Dr. Mohamad Zaki Hassan, Universiti Teknologi Malaysia, Malaysia

    For more committees, please visit: http://www.icmsn.org/com.html

    *Conference Topics: (Including but not limited to)

    ~Nanomaterials

    Different Methods for Growth of Nanostructures

    Nanoengineering

    ~Electronic Materials

    Semiconductor Materials

    Conductive Metal

    ~Material Chemistry

    Classical Analytical Chemistry

    Polymer Science

    ~Materials Processing Engineering

    Metallurgy Technology

    Metalworking

    ~Structural Material

    Wrought Iron

    Reinforced Concrete

    For more topics, please visit: http://www.icmsn.org/cfp.html.

    *Submission Methods

    ~Please submit your full paper/abstract to Online Submission System: http://confsys.iconf.org/submission/icmsn2024

    ~Or you can directly send it to confernece email: icmsnatcbees.net

    Full paper template, please visit: http://www.icmsn.org/download/TTP_template.doc

    Abstract template, please visit: http://www.icmsn.org/download/Abstract_template.doc

    *Contact Us

    Conference Secretary: Ms. Elva Zhang

    Email: icmsnatcbees.net

    Tel: +86-28-87577778(Mainland China)

    +852-3155-4897(Hong Kong)

    Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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