ICAMAM 2024 - 2024 2nd International Conference on Applied Mechanics and Advanced Materials(ICAMAM 2024)
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Website http://icamam.com/ |
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Category Mechanics;Materials
Deadline: November 20, 2023 | Date: January 12, 2024-January 13, 2024
Venue/Country: Wuhan,China, China
Updated: 2023-09-22 17:15:55 (GMT+9)
Call For Papers - CFP
2024 2nd International Conference on Applied Mechanics and Advanced Materials(ICAMAM 2024)Conference official website:icamam.comVenue: WuhanFull Paper Submission Deadline: November 20, 2023Conference Date: January 12-14, 2024(Early submission, early review, early acceptance)【1】Conference introductionThe 3rd International Conference on Applied Mechanics and Advanced Materials (ICAMAM 2024) will be held in Wuhan, China during Jan. 12-14, 2024. The conference aims to provide a platform for experts, scholars, engineering and technical personnel, and technical personnel engaged in research in the fields of applied mechanics and advanced materials science to share scientific research achievements and cutting-edge technologies, strengthen academic research and discussion, and promote cooperation in the industrialization of academic achievements. During the three days of the conference, the conference sincerely invited experts and scholars from domestic and foreign universities, scientific research institutions, business people and other relevant personnel to participate in the exchange and witness the achievements and progress in this field. The conference provides audiences, poster displays, oral reports and other forms of participation, and at the same time, the conference is open to the national call for papers, and has been searched in previous journals, and all experts and scholars are welcome to actively participate and submit!【2】OrganizerSoochow Institute for Energy and Materials InnovationS 【3】Co-organizerGSRA【4】Committee(1)Conference General ChairProf. Cheng Huang, Soochow UniversityProf. Shengjun Zhou, Wuhan University(2)Conference Co-ChairProf. Zhou Liming, Jilin University(3)Technical Program Committee ChairProf. Tianzhi Luo, University of Science and Technology of China(4)Publication ChairProf. Yunqing Tang, Shandong University(5)Technical Program CommitteeProf. Teng Li, Shandong University Prof. Yong Hu, Jilin University Prof. Xinsong Yang, Sichuan University Assoc Prof. Guanggen Zeng, Sichuan UniversityProf. Xinge Zhang, Jilin UniversityAssoc Prof. Yiqi Wang, Dalian University of Technology【5】Keynote speaker(1)Prof. Luo Tianzhi, University of Science and Technology of ChinaBiography:Prof. Luo obtained his Ph.D from the Department of Materials Science and Engineering at Johns Hopkins University in 2007. He worked on cell mechanics as a Postdoc Fellow in the School of Medicine at Johns Hopkins University from 2008-2014. Since 2016, He has joined the faculty of University of Science and Technology of China where he has been working on the multiscale biomechanics, biomaterials and high-performance advanced materials. He has published more than 60 research papers in top journals, such as Nature Materials. His scientific findings were remarked in major media by world-known scientists. Moreover, he holds more than 20 patents. Over the past few years, he has been granted with several competitive funding from the Natural Science Foundation of China and Chinese Academy of Scienceetc. Additionally, he has been awarded with a number of distinguished honors and awards. (2)Prof. Shengjun Zhou, Wuhan UniversityShengjun Zhou received the Ph.D. degree from Shanghai Jiao Tong University, Shanghai, China, in 2011. He is a Professor at Wuhan University. His current research interests lie in the areas of GaN-based LEDs, photonics and semiconductors, nanoimprint lithography and direct laser writing with applications in electronic and photonic devices. He is well known as an industrial technologist. Prior to joining Wuhan University, he was a CTO at Quantum Wafer Inc. from 2011 to 2014, focusing on the development of high brightness GaN-based LEDs. He was a research fellow at University of Michigan, Ann Arbor, from 2014 to 2015. He received many academic awards including the National Youth Talent Support Program, IAAM Scientist Medal, Fellow of IAAM, Fellow of VEBLEO, IOP Publishing Outstanding Reviewer Award, IOP Publishing CHINA TOP CITED PAPER AWARD, distinguished Young Scholar of Hubei province, and Chutian Scholar of Hubei province. He has published more than 92 papers and holds over 36 patents. He is Co-chair of the Organizing Committee for IEEE ICEPT 2016 conference. He served as committee member for many conferences. 【6】PublicationAll full paper submissions to the ICAMAM 2024 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted and registered papers will be published in conference proceedings, which will be submitted to EI Compendex, SCOPUS for indexing.*The proceedings of previous conferences have been successfully searched! (Details are as follows, click to view)(1)ICAMAM 2022 has been successfully published by Journal of Physics: Conference Series(ISSN: 1742-6596)(2)ICAMAM 2022 has been indexed by Ei Compendex.(3)ICAMAM 2023 has been successfully published by Journal of Physics: Conference Series(ISSN: 1742-6596)(4)ICAMAM 2023 has been indexed by Ei Compendex.(5)ICAMAM 2023 has been indexed by Scopus.【7】Call for paper(1)Applied Mechanics and Engineering MechanicsEngineering mechanicsComputational mechanicsThermodynamicsSolid mechanicsHydromechanicsMechanics of materialsBiomechanicsElastic mechanicsFracture mechanicsStructural dynamicsParticle mechanics and material mechanicsEngineering experimental mechanics, etc.(2)Advanced materialsMaterials of constructionFunctional materialsFlexible electronic materialsBiomaterialsBiomimetic materialsEnergy materialsSilicon materialSmart materialThree-dimensional materialMicro/nano materialsSemiconductor materialNew energy materialspolymer materialRenewable materialSuperplastic materialAdvanced composite materialsnon ferrous metalOptical/electronic/magnetic materials, etc.【8】ContactConference official website:icamam.comMeeting mailbox:icamam_conf@163.comConsultation QQ:3465006475 WeChat: 19872446270Tel(Miss W):19872446270
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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