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    ICAMAM 2024 - 2024 2nd International Conference on Applied Mechanics and Advanced Materials(ICAMAM 2024)

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    Category Mechanics;Materials

    Deadline: November 20, 2023 | Date: January 12, 2024-January 13, 2024

    Venue/Country: Wuhan,China, China

    Updated: 2023-09-22 17:15:55 (GMT+9)

    Call For Papers - CFP

    2024 2nd International Conference on Applied Mechanics and Advanced Materials(ICAMAM 2024)

    Conference official

    Venue: Wuhan

    Full Paper Submission Deadline: November 20, 2023

    Conference Date: January 12-14, 2024

    (Early submission, early review, early acceptance)

    【1】Conference introduction

    The 3rd International Conference on Applied Mechanics and Advanced Materials (ICAMAM 2024) will be held in Wuhan, China during Jan. 12-14, 2024. The conference aims to provide a platform for experts, scholars, engineering and technical personnel, and technical personnel engaged in research in the fields of applied mechanics and advanced materials science to share scientific research achievements and cutting-edge technologies, strengthen academic research and discussion, and promote cooperation in the industrialization of academic achievements. During the three days of the conference, the conference sincerely invited experts and scholars from domestic and foreign universities, scientific research institutions, business people and other relevant personnel to participate in the exchange and witness the achievements and progress in this field. The conference provides audiences, poster displays, oral reports and other forms of participation, and at the same time, the conference is open to the national call for papers, and has been searched in previous journals, and all experts and scholars are welcome to actively participate and submit!


    Soochow Institute for Energy and Materials InnovationS




    (1)Conference General Chair

    Prof. Cheng Huang, Soochow University

    Prof. Shengjun Zhou, Wuhan University

    (2)Conference Co-Chair

    Prof. Zhou Liming, Jilin University

    (3)Technical Program Committee Chair

    Prof. Tianzhi Luo, University of Science and Technology of China

    (4)Publication Chair

    Prof. Yunqing Tang, Shandong University

    (5)Technical Program Committee

    Prof. Teng Li, Shandong University

    Prof. Yong Hu, Jilin University

    Prof. Xinsong Yang, Sichuan University

    Assoc Prof. Guanggen Zeng, Sichuan University

    Prof. Xinge Zhang, Jilin University

    Assoc Prof. Yiqi Wang, Dalian University of Technology

    【5】Keynote speaker

    (1)Prof. Luo Tianzhi, University of Science and

    Technology of China


    Prof. Luo obtained his Ph.D from the Department of Materials Science and Engineering at Johns Hopkins University in 2007. He worked on cell mechanics as a Postdoc Fellow in the School of Medicine at Johns Hopkins University from 2008-2014. Since 2016, He has joined the faculty of University of Science and Technology of China where he has been working on the multiscale biomechanics, biomaterials and high-performance advanced materials. He has published more than 60 research papers in top journals, such as Nature Materials. His scientific findings were remarked in major media by world-known scientists. Moreover, he holds more than 20 patents. Over the past few years, he has been granted with several competitive funding from the Natural Science Foundation of China and Chinese Academy of Scienceetc. Additionally, he has been awarded with a number of distinguished honors and awards.

    (2)Prof. Shengjun Zhou, Wuhan University

    Shengjun Zhou received the Ph.D. degree from Shanghai Jiao Tong University, Shanghai, China, in 2011. He is a Professor at Wuhan University. His current research interests lie in the areas of GaN-based LEDs, photonics and semiconductors, nanoimprint lithography and direct laser writing with applications in electronic and photonic devices. He is well known as an industrial technologist. Prior to joining Wuhan University, he was a CTO at Quantum Wafer Inc. from 2011 to 2014, focusing on the development of high brightness GaN-based LEDs. He was a research fellow at University of Michigan, Ann Arbor, from 2014 to 2015. He received many academic awards including the National Youth Talent Support Program, IAAM Scientist Medal, Fellow of IAAM, Fellow of VEBLEO, IOP Publishing Outstanding Reviewer Award, IOP Publishing CHINA TOP CITED PAPER AWARD, distinguished Young Scholar of Hubei province, and Chutian Scholar of Hubei province. He has published more than 92 papers and holds over 36 patents. He is Co-chair of the Organizing Committee for IEEE ICEPT 2016 conference. He served as committee member for many conferences.


    All full paper submissions to the ICAMAM 2024 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted and registered papers will be published in conference proceedings, which will be submitted to EI Compendex, SCOPUS for indexing.

    *The proceedings of previous conferences have been successfully searched! (Details are as follows, click to view)

    (1)ICAMAM 2022 has been successfully published by Journal of Physics: Conference Series(ISSN: 1742-6596)

    (2)ICAMAM 2022 has been indexed by Ei Compendex.

    (3)ICAMAM 2023 has been successfully published by Journal of Physics: Conference Series(ISSN: 1742-6596)

    (4)ICAMAM 2023 has been indexed by Ei Compendex.

    (5)ICAMAM 2023 has been indexed by Scopus.

    【7】Call for paper

    (1)Applied Mechanics and Engineering Mechanics

    Engineering mechanics

    Computational mechanics


    Solid mechanics


    Mechanics of materials


    Elastic mechanics

    Fracture mechanics

    Structural dynamics

    Particle mechanics and material mechanics

    Engineering experimental mechanics, etc.

    (2)Advanced materials

    Materials of construction

    Functional materials

    Flexible electronic materials


    Biomimetic materials

    Energy materials

    Silicon material

    Smart material

    Three-dimensional material

    Micro/nano materials

    Semiconductor material

    New energy materials

    polymer material

    Renewable material

    Superplastic material

    Advanced composite materials

    non ferrous metal

    Optical/electronic/magnetic materials, etc.


    Conference official


    Consultation QQ:3465006475 WeChat: 19872446270

    Tel(Miss W):19872446270

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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