ICMEA 2023 - 6th International Conference on Materials Engineering and Applications (ICMEA 2023)
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Website http://www.icmea.org |
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Category Materials Engineering and Applications
Deadline: August 30, 2022 | Date: January 13, 2023-January 15, 2023
Venue/Country: Singapore, Singapore
Updated: 2022-04-13 16:15:32 (GMT+9)
Call For Papers - CFP
The 6th International Conference on Materials Engineering and Applications (ICMEA 2023)Singapore & Online | January 13-15, 2023www.icmea.orgPublication and indexAccepted papers with registration will be published into Materials Science Forum (ISSN: 0255-5476), which is indexed by EI Compendex and Scopus etc.Publication HistoryICMEA 2020: IOP Conference Series: Materials Science and Engineering Vol. 894 | Indexed by Scopus.ICMEA 2019: IOP Conference Series: Materials Science and Engineering Vol. 540 | Indexed by Ei Compendex, Scopus.ICMEA 2018: IOP Conference Series: Materials Science and Engineering Vol. 348 | Indexed by Ei Compendex, Scopus.More information, you can visit: http://www.icmea.org/2018.htmlTopics1. Materials Science And Engineering, Materials Processing TechnologyMetallic Alloys, Tool Materials, Superplastic Materials, Ceramics and Glasses, Composites, Amorphous Materials, Nanomaterials, Biomaterials, Multifunctional Materials, Smart Materials, Engineering Polymers, Functional materials, Nuclear fuel materials, Biomaterals, sensors and surfaces, Thin Film Chalcogenide Photovoltaic Materials, Nuclear Materials IV, Magnetic Materials, Multi Functional Magnetic Materials, Superconducting Materials, Structured Materials, Spintronics Materials and Devices, Hard/Soft Magnetic Materials, Crosscutting materials2.Materials Properties, Measuring Methods And ApplicationsDuctility, Crack Resistance, Fatigue, Creep-resistance, Fracture Mechanics, Mechanical Properties, Electrical Properties, and Magnetic Properties, Corrosion, Erosion, Wear Resistance, Non-Destructive Testing, Reliability Assessment, Toxicity, Working Properties of Materials and Products, Large Scale Applications, Electronics Applications.SpeakersProf. Jae-Jin Shim, Yeungnam University, South KoreaProf. Takashige Omatsu (Fellow of JSAP, OSA, SPIE), Chiba University, JapanProf. Anja Pfennig, HTW-Berlin University of Applied Sciences, GermanyFor more information, please visit: http://www.icmea.org/keynote.htmlContact usMs. Violet XieE-mail: icmeacbees.netTell: +86-28-87577778 (Mainland China)+852-3155-4897 (Hong Kong)
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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