MEIM 2022 - The 3rd International Conference on Mechanical Engineering and Intelligent Manufacturing 2022 (MEIM 2022)

Website www.icmeim.net | Edit Freely

Category EI Compendex；Scopus

Deadline: March 01, 2022 | Date: June 10, 2022-June 12, 2022

Venue/Country: NANCHANG, China

Updated: 2022-03-16 12:29:16 (GMT+9)

Call For Papers - CFP

Website URL：www.icmeim.net

Start Date / End Date: June 10th-12th, 2022

Location: Nanchang, China

Submission Deadline: first round: March 1st

1.About the conference:

The 3rd International Conference on Mechanical Engineering and Intelligent Manufacturing (MEIM 2022) in 2022 is scheduled to be held in Nanchang, China from June 10th to 12th, 2022. This conference will focus on research areas such as mechanical engineering and intelligent manufacturing. The aim of the discussion is to provide a platform for experts, scholars, engineering and technical personnel, and technical research and development personnel engaged in mechanical engineering and intelligent manufacturing research to share scientific research results and cutting-edge technologies, understand academic development trends, broaden research ideas, strengthen academic research and discussion, and promote industrialization and cooperation of academic achievements. We sincerely welcome experts and scholars from universities and scientific research institutions at home and abroad, business people and other relevant personnel to participate in the conference and exchange.

2.Organizations

Organizer:

East China Jiaotong University

Host：

School of Mechanical, Electrical and Vehicle Engineering, East China Jiaotong University

Key Laboratory of Vehicles and Equipment of Ministry of Education, East China Jiaotong University

Guangdong AIS Institute of Information Academic Exchange

Conference Chairmen：

Prof. Hesheng Liu, East China Jiaotong University

Prof. Changming Li, Suzhou University of Science and Technology

Prof. Yinquan Yu, East China Jiaotong University

3.Date & Location

Date: June 10th-12th, 2022

Venue: Nanchang, China

4.Speakers

Prof. Yaguo Lei, Xi'an Jiaotong University

Prof. Yaguo Lei received his B.E. degree and the Ph.D. degree both in mechanical engineering from Xi’an Jiaotong University, P. R. China, in 2002 and 2007, respectively. He is currently a professor in mechanical engineering of Xi’an Jiaotong University, P. R. China. He worked at the University of Duisburg-Essen, Germany as an Alexander von Humboldt fellow and at the University of Alberta, Canada as a postdoctoral research fellow. He is also a fellow of IET and ISEAM, a senior member of IEEE, a member of ASME, and senior members of CMES, ORSC and CAA, and the associate editor/ the editorial board member of IEEE TIE, MSSP, NC&A, MST, etc.

His research interests include health condition monitoring and intelligent maintenance, big-data era intelligent fault diagnostics and prognostics, reliability evaluation and remaining useful life prediction, mechanical signal analysis and processing, and mechanical system dynamic modeling. Prof. Lei has pioneered many signal processing techniques and intelligent models for diagnosing mechanical faults such as gearboxes, bearings, rotor systems etc, with over 80 peer-reviewed papers published on signal processing and fault diagnostics, which have been broadly cited by hundreds of researchers in this field.

Prof. Tao Ye, Southern University of Science and Technology

Professor Ye of the Department of Electronic and Electrical Engineering of Southern University of Science and Technology is a doctoral supervisor, national distinguished expert (national key talent introduction project), adjunct professor of the Department of Electrical and Computer Engineering of Carnegie Mellon University. He graduated from the Department of Electronic Engineering of Tsinghua University in 1993 and received his Ph.D. from Stanford University in 2004. 

His main research directions are integrated circuits, EDA, brain-like neural circuits, artificial intelligence chips, Internet of Things communication chips and sensor devices. With more than 20 years of experience in the field of integrated circuit design and EDA, especially in the application specific integrated circuit (ASIC) and mix-signal IC (Mix-Signal IC), Prof Ye has a wealth of academic and industrial experience. He was the Technical Director of the Hong Kong Logistics and Supply Chain Management Technology R&D Centre (LSCM), one of the five government R&D centres in Hong Kong, and led a number of Hong Kong Government Innovation and Technology Fund projects as Project Leader and Principal Investigator. He has participated in the design of the world's first miniature low-power RFID tag chip and RFID reader chip, which combines RFID with mobile phone mobile platforms, so that RFID technology can eventually be extended to user terminals, and generate huge market opportunities in the fields of product anti-counterfeiting, authentication and payment. At the same time, Prof Ye also participated in the formulation and implementation of world standards and protocols for Internet of Things technology, and pioneered and developed a variety of key technologies for the Internet of Things. Prof Ye boasts deep experience in collaborating with business industries and the academic realm, having held engineering leaders and consulting positions at Synopsys Inc., Analog Devices Inc., Magma Design Automation Inc., Silicon Architects and various Silicon Valley companies, as well as adjunct professor at the Chinese Academy of Sciences, the University of Hong Kong, the Hong Kong University of Science and Technology, and the Chief Scientist of the Internet of Things Center of the Hong Kong University of Science and Technology.

A Prof. Wei Yao, National National University of Singapore, Singapore

Assistant Professor Yao holds a PhD from University of Cambridge, UK. Currently assistant professor, Department of Mechanical Engineering, National University of Singapore, PhD supervisor. Se has long been engaged in the preparation, forming and multifunctional characteristics of advanced structural and functional materials, and has made breakthroughs in the research on the integrated design and manufacture of functional materials-structures based on additive manufacturing in recent years. A Prof. Yao has presided over the Tier 1 Research Project of the Singapore Education Board, the Singapore Science and Technology Board Young Scholars Research Project, the National University of Singapore Basic Research Fund, and the Singapore Science and Technology Board and the United Kingdom Rolls-Royce Cooperation Project. With a good accumulation in the design and manufacture of additive manufacturing for mechanical, electromagnetic and acoustic metamaterials, Prof. Yao is also Editor-in-Chief of Material today Communications and Assistant Editor-in-Chief of Materials & Design. She has published more than 30 high-quality SCI search papers, google scholar H index 15, including engineering and comprehensive top journals Advanced Materials, Acta Materialia, Small, Applied Materials Today, ACS Applied Materials & interfaces, Applied Physics Letters, etc.

Prof, Yihui Zhang, Tsinghua University

Prof Zhang got his Ph.D. in Engineering Mechanics from Tsinghua University, China  (6/2011), M.S. in Engineering Mechanics, Tsinghua University, China  (6/2008) and B.S. in Engineering Mechanics, Nanjing University of Aeronautics & Astronautics, China  (6/2006).

His main areas of research is Mechanically-guided 3D assembly; Unusual soft materials; Stretchable and flexible electronics; Mechanics of smart materials and structures. Zhang group’s research bridges the broad areas of solid mechanics, materials science and engineering, electrical engineering and biomedical engineering.  His group is dedicated to addressing the grand challenges in the frontiers of science and technologies through creative uses of mechanics principles and cross-fertilization among diverse disciplines, which drives the development of new mechanics theories and computational models of advanced materials and structures, as well as novel designs and fabrication approaches of materials and systems with unprecedented properties.  

Assistant Researcher, Han Zhang, Institute of Acoustics, Chinese Academy of Sciences

With the overall transformation and upgrading of the international manufacturing industry, especially considering the increasing maturity of additive manufacturing (3D printing) technology and equipment, the theory and methods of metamaterial design have flourished. Acoustic wave/elastic wave metamaterials use microstructure as the basic unit to regulate the excitation, transmission and coupling of waves, artificially obtaining macroscopic characteristics that break through the limitations of natural laws, and realizing arbitrary regulation of wave propagation. The emergence of such "new materials" in basic disciplines and applied research has atrracted great attention. Metamaterial design and fabrication is an advanced multidisciplinary issue. This report mainly introduces the frontier development of metamaterial design and advanced manufacturing in intelligent manufacturing, and the usage of multi-objective optimization algorithm to solve the key problems. Through reverse operation, intelligent algorithms overcome the problems of limited prior knowledge, the multiphysics conditions that restrict each other, and overly complex preparation requirements in traditional methods, pushing forward the technological innovation and subversive innovation of metamaterial design and preparation for different applications, especially the promotion of rapid application of acoustic stealth, seismic protection, super-resolution imaging and detection, and intelligent structures in transportation equipment, structural health monitoring, wearable devices, bionics and medical treatment.

5.Publication

All submissions will be peer reviewed, and the accepted papers will be published and submitted to  EI Compendex (Web of Science) for indexing. 

*All submissions must not be less than 4 pages in length.

最终所有录用的论文将由EI目录系列期刊出版，见刊后由期刊社提交至EI, Scopus检索，目前该期刊EI检索非常稳定。

6.Call for papers

The topics of interest for submission include, but are not limited to:

Topic 1: Mechanical engineering

1). Mechanical dynamics and vibration

2). Mechanical strength

3). Mechanical transmission applications

4). Mechanical design

5). Rolling

6). Foundry technology and equipment

7). Welding technology and equipment

8). Plastics processing technology and equipment

9). Heat treatment technology and equipment

10). Cutting technology and equipment

11). Special processing technology and equipment

12). Machine assembly process

13). Non-metallic processing

14). CNC technology and CNC machine tools

15). Fluid power transmission and control

16). Instrumentation

17). Vehicle dynamic performance simulation

18). Energy machinery and equipment

19). Chemical machinery and equipment

20). Textile machinery and equipment

21). Food machinery

22). Agricultural machinery manufacturing

23). Mining Machinery Engineering

24). Metallurgical machinery and its automation

25). Construction machinery and equipment

26). Aircraft structure and design

27). Spacecraft structure and design

28). Aircraft manufacturing technology

29). Intelligent electromechanical and robotics

30). Precision manufacturing and measurement

Topic 2: Intelligent manufacturing

1). Intelligent control system

2). New sensing technology

3). Dynamic mechanical analysis, optimization and control

4). Industrial robots and automated production

5). Green manufacturing

And other related topics...

Manuscripts reviewed by experts from the conference organizing committee will be accepted and published on conference proceedings. The published papers will then be submitted for EI, SCOPOUS, abstracting/indexing. Authors are assured of quick and accurate indexing.

Submission Methods

1.The submitted papers must not be under consideration elsewhere.

2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM-https://www.ais.cn/attendees/paperSubmit/QMFRF3

3.Please submit the full paper, if presentation and publication are both needed.

4.Please submit the abstract only, if you just want to make presentations.

5.Templates Downlow：http://www.icmeim.net/download

6.Should you have any questions, or you need any materials in English, please contact us at contactmeim.com

Note: 

1) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.

2) All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.

7.Registration

Items---Registration fee (By US Dollar)

Regular Registration (4-6 pages)---500 USD / 3200 RMB per paper

Extra Pages (Begin at Page 7)---50 USD / 300 RMB per extra page

Manuscript numbers ≥ 3---450 USD/ 2900 CNY/per paper (5 pages)

Attendees without Papers---180 USD / 1200 RMB per person

Attendees without Papers (Groups）---150 USD / 1000 RMB per person (≥3 persons)

Purchase Extra Journal---75 USD / 500 RMB per book

8.Schedule

Schedule

June 1st---13:00-18:00---Registration

---18:00-20:00---Dinner

June 2nd---09:00-09:30---Opening Ceremony and Speech

---09:30-12:00---Keynote Speeches

---12:00-14:00---Lunch

---14:00-18:00---Keynote Speeches and Oral Presentations

---18:00-20:00---Banquet

June.7th---09:00-12:00---Academic Investigation 

9.Contact Us

Conference Secretary: Ms. lv

Tel: +86-13798148224 (cellphone)

WeChat: 13798148224

QQ: 3326203643