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    AEMCSE 2022 - 2022 5th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2022)

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    Website http://aemcse.org/ | Edit Freely

    Category Electronic Materials,Computers,Software Engineering

    Deadline: February 11, 2022 | Date: April 22, 2022-April 24, 2022

    Venue/Country: Wuhan, China, China

    Updated: 2022-01-20 16:44:21 (GMT+9)

    Call For Papers - CFP

    2022 5th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2022)

    The 2022 5th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2022) [第五届先进电子材料、计算机与软件工程国际学术会议(AEMCSE 2022)]will be held in Wuhan, China during April 22-24, 2022.

    Important Dates

    Submission Deadline: February 11, 2022

    Registration Deadline: April 10, 2022

    Conference Date: April 22-24, 2022

    Publication

    All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of AEMCSE 2022 will be published in conference proceedings and will be submitted to EI Compendex and Scopus for indexing.

    * The conference has been successfully held for four sessions, and all papers hired in previous sessions have been searched by EI Compendex!

    Call For Paper

    1.Computers Engineering | 计算机工程

    ▪Operating Systems

    ▪Quantum Computing Theory

    ▪Scientific Computing

    ▪Computer Programming

    ▪Database Management Systems

    ▪Evolutionary Computation

    ▪Logic Programming

    ▪Machine Learning

    ▪Software Engineering

    ▪Symbolic Mathematics

    ▪Digital Signal Processing (DSP)

    ▪Advanced Adaptive Signal Processing

    ▪Computer Vision & VR

    ▪Multimedia & Human-computer Interaction

    ▪AI & Neural Networks

    ▪Communication Signal processing

    ▪SP for Internet and Wireless Communications

    * Other related topics..

    2.Software Engineering | 软件工程

    ▪Software Architecture

    ▪Software design method

    ▪Software testing technology

    ▪Automated software design and synthesis

    ▪Component-based software engineering

    ▪Computer-supported collaborative work

    ▪Programming language and software engineering

    ▪Computer network

    ▪Information and communication security

    ▪Multimedia technology application

    ▪Artificial intelligence and recognition

    ▪Embedded software and applications

    ▪Automatic control

    ▪Cloud computing technology

    ▪Storage technology

    ▪Big data analysis and processing

    * Other related topics..

    3.Advanced Electronic Materials | 先进电子材料

    ▪Dielectric material

    ▪Semiconductor material

    ▪Piezoelectric and ferroelectric materials

    ▪Conductive metals and their alloys

    ▪Magnetic material

    ▪Optoelectronic materials

    ▪Electromagnetic shielding materials

    * Other related topics..

    Submission Methods

    1.The submitted papers must not be under consideration elsewhere.

    2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

    https://www.ais.cn/attendees/index/JQQEZ3

    3.Please submit the full paper, if presentation and publication are both needed.

    4.Please submit the abstract only, if you just want to make presentations.

    5.Templates Download: Templates

    https://www.ais.cn/attendees/material/JQQEZ3

    6.Should you have any questions, or you need any materials in English, please contact us at AEMCSE@163.com.

    Conference Secretary: Ms. Huang

    E-mail:AEMCSE@163.com

    Cellphone:+86-18124944750

    QQ:2152116918

    WeChat:18124944750


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.