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    TSP 2030 - Tech Science Press 出版社 SCIE EI Journals期刊

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    Category ACM IEEE Conference Publishing 会议系列征稿; Tech Science Press 出版社 SCIE EI Journals期刊

    Deadline: August 20, 2030 | Date: August 22, 2030-August 24, 2030

    Venue/Country: wuhan, China

    Updated: 2021-10-14 11:03:55 (GMT+9)

    Call For Papers - CFP

    Tech Science Press 出版社 SCIE EI Journals 期刊

    SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex 期刊

    SCIE EI Journals 期刊

    CMES-Computer Modeling in Engineering & Sciences

    ISSN: 1526-1492 (print)

    ISSN: 1526-1506 (online)

    CMC-Computers, Materials & Continua

    ISSN: 1546-2218 (print)

    ISSN: 1546-2226 (online)

    FDMP-Fluid Dynamics & Materials Processing

    ISSN: 1555-256X (print)

    ISSN: 1555-2578 (online)

    Molecular & Cellular Biomechanics

    ISSN: 1556-5297 (print)

    ISSN: 1556-5300 (online)

    与国内外部分高校,外企,科研机构有会议合作关系 每月均会提交会议论文至不同出版社出版,与多家世界知名出版集团建立了良好的合作关系,如IEEE Press, IEEE CS CPS, Springer, Elsevier, IOP, Academic Press, ASME, American Scientific Publishing, SPIE, CRC Press / Balkema, DEStech Publications, TTP and Atlantis Press等, 且可推荐优秀学术论文至知名国际期刊发表.

    欢迎广大社会工作者、教育工作者、研究生、博士生提交论文与合作 针对高校和个人作者一次性投稿多篇文章后, 后续作者在本中心投稿的文章费用 按照之前的多篇文章最低价格优惠

    SCOPUS / Web of Science (SCIE/SSCI/AHCI) /EI Compendex/ SJR / PubMed Journal list


    QQ:1422679111 WhatsApp:+86 13212744212

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.