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    SECMP 2022 - 2022 International Conference on Semiconductors, Electromagnetics and Condensed Matter Physics (SECMP 2022)

    View: 145

    Website /www.se-cmp.net/ | Edit Freely

    Category EI;Scopus

    Deadline: January 04, 2022 | Date: January 07, 2022-January 09, 2022

    Venue/Country: Xiamen, China

    Updated: 2021-09-23 17:21:39 (GMT+9)

    Call For Papers - CFP

    CONFERENCE INFORMATION:

    Website:/www.se-cmp.net/

    Conference Date: January 7- 9,2022

    Venue:Xiamen, China

    First round Submission Deadline: October 12, 2021

    Indexing:EI/Scopus

    2022 International Conference on Semiconductors, Electromagnetics and Condensed Matter Physics (SECMP 2022) will be held from January 7th to 9th in Xiamen China. SECMP 2022 is organized by AEIC Academic Exchange Information Center. It dedicates to create a platform for academic communications between specialists and scholars in the fields of Semiconductors, Electromagnetics and Condensed Matter Physics. The conference will create a path to establish a research relation for the authors and listeners with opportunities for collaboration and networking among the universities and institutions for promoting research and developing technologies.

    We cordially invite you to submit paper and attend SECMP 2022. Looking forward to your participation!

    1.Keynote Speakers

    Prof. Houlin Li

    Southeast University, China

    Prof. MingYan

    Shanghai University, China

    2.CALL FOR PAPER

    The topics of interest for submission include, but are not limited to:

    Semiconductors---Electromagnetics ---Condensed Matter Physics

    Semiconductor spin physics and topological phenomena

    Semiconductor nanometers and devices

    Wide/narrow band gap semiconductor

    Compound semiconductor

    Magnetic semiconductor

    Organic semiconductor

    Photoelectric and photovoltaic devices

    Semiconductor physics

    Semiconductor quantum computing

    Microwave photonic device physics

    Semiconductor materials and device reliability

    Semiconductor manufacturing and application

    Emerging semiconductor technology

    Electromagnetic theory

    Electromagnetic education

    Electromagnetic field calculation

    Electromagnetic measurement

    Electromagnetic packaging

    Electromagnetic modeling of devices and circuits

    The electromagnetic properties of the material,

    EMC/EMI/electromagnetic pulse

    Inverse scattering

    metamaterials

    Phased array and adaptive array

    Printed and conformal antennas

    Radar cross section and asymptotic techniques

    Stochastic and nonlinear electromagnetism

    Reflector antenna

    biomagnetism

    Brain oscillations and Internet connections

    Magnetoencephalography

    Electromagnetic theory

    Electromagnetic education

    Electromagnetic field calculation

    Electromagnetic measurement

    Electromagnetic packaging

    Electromagnetic modeling of devices and circuits

    The electromagnetic properties of the material,

    EMC/EMI/electromagnetic pulse

    Inverse scattering

    metamaterials

    Phased array and adaptive array

    Printed and conformal antennas

    Radar cross section and asymptotic techniques

    Stochastic and nonlinear electromagnetism

    Reflector antenna

    biomagnetism

    Brain oscillations and Internet connections

    Magnetoencephalography

    *Other related topics

    3.Publication

    1.EI All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex / Scopus for indexing.

    *paper template(Download),No less than 4 pages.

    *Only English manuscripts will be accepted. If you need translation service, please send the Chinese manuscripts directly to the conference email or contact with Winnie Nie.(icsecmp@163.com)

    4.Submission Methods

    1.The submitted papers must not be under consideration elsewhere.

    2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

    3.Please submit the full paper, if presentation and publication are both needed.

    4.Please submit the abstract only, if you just want to make presentations.

    5.Registration

    For the publication on ICNA 2021 conference proceedings:

    Item---Registration fee (By RMB) ---Registration fee (By US Dollar)

    Regular Registration for Paper---3200RMB/per paper (4-6pages)---500 USD/per paper (4 -6pages)

    Manuscript numbers ≥ 3---2900RMB/per paper (4-6pages)---450 USD/ per paper (4-6 pages)

    Extra Pages (Begin at Page 7)---300RMB/per extra page---50 USD/ per extra page

    Attendees without Submission---1200RMB/per person---180 USD / per person

    Attendees without Submission (Groups)---1000RMB/per person(≥ 3 person)---150 USD / per person(≥ 3 person)

    6.Program

    Schedule

    January 7---13:00-17:00---Registration

    January 8---09:00-12:00---Speeches of Keynote Speakers

    12:00-14:00---Lunch

    14:00-17:30---Oral Presentations

    18:00-19:30---Banquet

    January 9---09:00-18:00---Academic Investigation

    7.CONTACT US

    Conference Secretary: Winnie Nie

    E-mail: icsecmp@163.com

    F-Tel: +86-17335783240 (Wechat)

    QQ:744887019


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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