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    MYPUB 2030 - 【IEEE Xplore/ACM出版】【Springer 出版社】【Trans Tech Publications Ltd.出版】【EDP Sciences.出版】【EI.SCOPUS.CPCI检索】.物理,数学,数学建模,信息技术,计算机科学.地质.能源.环境.材料 .的所有方面

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    Website http://www.researchi.org/conf.html | Edit Freely

    Category 【IEEE Xplore/ACM出版】【Springer 出版社】【Trans Tech Publications Ltd.出版】【EDP Sciences.出版】【EI.SCOPUS.CPCI检索】.物理,数学,数学建模,信息技术,计算机科学.地质.能源.环境.材料 .的所有方面【ACM出版. Trans Tech Publications Ltd出版社. EI快速检索】; 电气,控制,计算,通讯,网络工程 材料.化工.生物.所有基础和应用方面 IEEE Xplore/ EI Compendex, Scopus ;物理,数学,数学建模,信息技术, 计算机科学

    Deadline: November 10, 2030 | Date: November 14, 2030-November 18, 2030

    Venue/Country: wuhan, China

    Updated: 2021-07-13 18:50:27 (GMT+9)

    Call For Papers - CFP

    EI Compendex. CPCI.SCOPUS会议 丛书征稿

    SCOPUS. Engineering Village. Web of Science

    网址:http://www.researchi.org/

    与国内外部分高校,外企,科研机构有会议合作关系 每月均会提交会议论文至不同出版社出版,与多家世界知名出版集团建立了良好的合作关系,如IEEE Press, IEEE CS CPS, Springer, Elsevier, IOP, Academic Press, ASME, American Scientific Publishing, SPIE, CRC Press / Balkema, DEStech Publications, TTP and Atlantis Press等, 且可推荐优秀学术论文至知名国际期刊发表.

    欢迎广大社会工作者、教育工作者、研究生、博士生提交论文与合作 针对高校和个人作者一次性投稿多篇文章后, 后续作者在本中心投稿的文章费用 按照之前的多篇文章最低价格优惠

    网址:http://www.researchi.org/

    Advances in Intelligent Systems and Computing ISSN: 2194-5357

    Published By : 施普林格出版社 (Springer)

    Website:https://link.springer.com/bookseries/11156

    索引/检索收录: DBLP, EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP), Scopus.

    主题:几乎涵盖了所有学科,例如工程,自然科学,计算机和信息科学,ICT,经济学,商业,电子商务,环境,医疗保健,生命科学

    Smart Innovation, Systems and Technologies ISSN: 2190-3018

    Published By : 施普林格出版社 (Springer)

    Website:https://link.springer.com/bookseries/8767

    索引/检索收录: DBLP, EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP), Scopus.

    主题:机器人技术,创新的机器和机构,精密农业的工程应用.人工智能.计算机.仿真

    Lecture Notes in Mechanical Engineering ISSN: 2195-4356

    Published By : 施普林格出版社 (Springer)

    Website:https://link.springer.com/bookseries/11236

    索引/检索收录: CPCI (ISI Web of Science, 即ISTP), Scopus.

    主题:机械工程的所有方面

    Lecture Notes in Civil Engineering ISSN: 2366-2557

    Published By : 施普林格出版社 (Springer)

    Website:https://link.springer.com/bookseries/15087

    索引/检索收录: DBLP, EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP), Scopus.

    主题:建筑与结构力学.建筑材料.混凝土.钢和木材结构.岩土工程.地震工程.沿海工程.海洋与海洋工程;船舶和浮动结构.水利水文水资源工程.环境工程与可持续发展.结构健康与监测.测绘与地理信息系统.室内环境.交通运输.风险分析.安全保障

    EAI/Springer Innovations in Communication and Computing ISSN: 2522-8595

    Published By : 施普林格出版社 (Springer)

    Website:https://www.springer.com/series/15427

    索引/检索收录: DBLP, EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP), Scopus.

    主题:通信和计算领域全方向

    Key Engineering Materials ISSN: 1662-9795

    Published By :Trans Tech Publications Ltd

    Website:https://www.scientific.net/KEM/Details

    索引/检索收录:EI Compendex(Conference Article), Scopus , CPCI (ISI Web of Science, 即ISTP)

    主题:高级工程材料的综合与研究,建模,加工和应用的所有基础和应用方面

    Materials Science Forum ISSN: 1662-9752

    Published By :Trans Tech Publications Ltd

    Website:https://www.scientific.net/MSF/Details

    索引/检索收录:EI Compendex(Conference Article), Scopus , CPCI (ISI Web of Science, 即ISTP)

    主题:材料.化工.生物.所有基础和应用方面

    IOP Conference Series: Journal of Physics (JPCS)

    Online ISSN: 1742-6596

    Print ISSN: 1742-6588

    Published By :IOP Publishing

    Website:https://iopscience.iop.org/journal/1742-6596

    索引/检索收录:EI Compendex(Conference Article), Scopus , CPCI (ISI Web of Science, 即ISTP),

    主题:物理,数学,数学建模,信息技术, 计算机科学

    IOP Conference Series: Materials Science and Engineering (MSE)

    Online ISSN: 1757-899X

    Print ISSN: 1757-8981

    Published By :IOP Publishing

    Website:https://iopscience.iop.org/1757-899X/

    索引/检索收录:EI Compendex(Conference Article), Scopus , CPCI (ISI Web of Science, 即ISTP),

    主题:地质.能源.环境.材料

    IOP Conference Series: Earth and Environmental Science (EES)

    Online ISSN: 1755-1315

    Print ISSN: 1755-1307

    Published By :IOP Publishing

    Website:https://iopscience.iop.org/1755-1315/

    索引/检索收录:Scopus , CPCI (ISI Web of Science, 即ISTP),

    主题:材料科学.相关

    E3S Web of Conferences eISSN:2267-1242

    Published By : EDP Sciences

    Website:https://www.e3s-conferences.org/

    索引/检索收录:Scopus,EI Compendex CA类型, INSPEC, CPCI (ISI Web of Science, 即ISTP).

    主题:土壤科学,水文学,海洋学,气候学,地质学,地理学,能源工程(生产,分配和存储),可再生能源,可持续发展,自然资源管理,环境健康.

    SHS Web of Conferences eISSN: 2261-2424

    Published By : EDP Sciences

    Website:https://www.shs-conferences.org/

    索引/检索收录:Scopus,CPCI (ISI Web of Science, 即ISTP).

    主题:社会学、经济、心理学、历史、地理、语言学等.

    AIP Conference Proceedings ISSN: 0094-243X

    Published By :AIP(American Institute of Physics)

    Website:https://aip.scitation.org/journal/apc

    索引/检索收录:Scopus, Conference Proceedings Citation Index (ISI Web of Science, 即ISTP), INSPEC.

    主题:物理,数学,化学,材料科学和工程 .

    ScitePress出版社

    Published By: SCITEPRESS DigitalLibrary

    Website:https://www.scitepress.org/HomePage.aspx

    理工科 .人文社科

    索引/检索收录:EI Compendex,Scopus,Conference Proceedings Citation Index- Science (CPCI-S) or Conference Proceedings Citation Index- Social Science & Humanities (CPCI-SSH)

    IEEE.Institute of Electrical and Electronics Engineers

    ACM.Associine for Computer Mair coolinghinery

    ISBN BOOK系列

    索引/检索收录:Scopus.EI Compendex. CPCI

    BASIC & CLINICAL PHARMACOLOGY & TOXICOLOGY

    ISSN:1742-7835

    Published By: WILEY BLACKWELL PUBLISHING, INC

    检索类型为:SCI Meeting Abstract (SCI 会议摘要)

    征稿范围:医学工程,健康,环保,医药,生物,卫生相关的各学科

    期刊信息链接:hhttps://onlinelibrary.wiley.com/journal/17427843

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    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.