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    DIFCON 2021 - Digital Futures International Congress (DIFCON 2021)

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    Website https://mmudifcon.com/ | Want to Edit it Edit Freely

    Category Engineering & Technology; Communication; Language; Education; Social Sciences; Computer Sciences; Information Technology; Information Systems; Internet of Things (IoT); Artificial Intelligence (AI); Intelligent Computing; Law; Legal; Creative Multimedia; Creative Industries; Technology & Innovation Management

    Deadline: May 21, 2021 | Date: June 21, 2021-June 23, 2021

    Venue/Country: Virtual Conference, Indonesia

    Updated: 2021-05-01 14:53:04 (GMT+9)

    Call For Papers - CFP

    *CALL FOR PAPER!*

    *Digital Futures International Congress (DIFCON 2021) is co-organized by Multimedia University (MMU) and Research Synergy Foundation (RSF)*. DIFCON provides a multidisciplinary platform for gathering scholars from different disciplinary backgrounds to disseminate ongoing research related to digital futures of our society, following the “2030 Agenda for Sustainable Development''.

    The virtual conference will be held on *21-23 June 2021*.

    * Prospective authors are invited to submit manuscripts reporting original unpublished research and recent developments in the topics related to the conference.

    * All manuscripts must be written in English and be formatted as per the template in the submission guideline.

    Co-Located Conference of DIFCON:

    1. Multimedia University Engineering Conference (MECON 2021) (Engineering)

    2. International Conference on Communication, Language, Education and Social Sciences (CLESS21) (Language and Social Science)

    3. International Conference on Computing, Information Technology and Intelligent Computing (CITIC 2021) (Computing)

    4. 1st International Conference on Law and Digitalisation 2021 (ICLD21) (Law)

    5. International Conference of Creative Multimedia (ICCM2021) (Creative Multimedia)

    6. International Conference on Technology and Innovation Management 2021 (ICTIM 2021) (Management)

    This conference not only gives you a global forum to share and exchange ideas, research, and work. But also, provide a wider network and research ecosystem for further collaboration and projects.

    *Please be noted that the Abstract Submission Deadline: May 21, 2021*

    All the conference submission process will ONLY be done through "Scholarvein" Integrated and Easy Conference Management Operating System (CMOS). Kindly visit https://mmudifcon.com for detailed information.

    Registration Fee: 125 USD for paper presentation.

    Publication output:

    -All accepted ABSTRACTS will be published in electronic conference proceeding book with ISBN.

    -ALL Eligible Conference Paper will be given recommendation to submit to F1000Research (Taylor & Francis Group) Platform – RSF Gateway (https://f1000research.com/rsf). Once accepted (an Article Processing Charge /APC is required by F1000Research to be payable by an author – see https://f1000research.com/for-authors/article-processing-charges) . Articles that pass F1000 Open peer review will be indexed in SCOPUS and other bibliographic indexers. See Publication Opportunity section for more information.

    For more details of the step by step procedure in paper submission, please visit https://mmudifcon.com or send queries to the committee email infoatmmudifcon.com or contact through Whatsapp on number +62811227479 / +628112331733

    All interested parties are welcome to participate in this conference. Moreover, SCIENTIFIC OPPORTUNITY and PROJECT will be offered ONLY for participants who join in the conference.

    We are looking forward to your participation.

    Best regards,

    DIFCON committee

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    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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