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    EEI-CN 2021 - 2021 3rd International Conference on Electrical Engineering and Informatics and Communications and Networking Forum (EEI-CN)

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    Website http://cn.icoeei.org | Want to Edit it Edit Freely

    Category Electrical Engineering and Informatics and Communications and Networking Forum

    Deadline: June 12, 2021 | Date: June 18, 2021-June 20, 2021

    Venue/Country: Dali, China

    Updated: 2021-04-30 16:43:41 (GMT+9)

    Call For Papers - CFP

    2021 3rd International Conference on Electrical Engineering and Informatics and Communications and Networking Forum (EEI-CN)

    CONFERENCE INFORMATION:

    Website:cn.icoeei.org

    Conference Date:June 18-20, 2021

    Venue:Dali, China

    Submission Deadline:May 17, 2021

    Indexing:EI Compendex/Scopus

    The 3rd International Conference on Electronic Engineering and Informatics and Communication and Networking Forum (EEI-CN 2021), organized by AEIC Academic Exchange Center, will be held in Dali, China, from June 18-20, 2021. The EEI-CN 2021 will provide a forum for experts, professors, scholars and engineers from domestic and foreign universities, scientific research institutes, enterprises and institutions to share their professional experiences, expand their professional networks, and face each other in the field of "signal processing", "computer science and engineering", "communication engineering" and "system control".

    The conference provides an international platform for experts, professors, scholars and engineers from universities, research institutes, enterprises and institutions at home and abroad to share their professional experiences, expand their professional networks, exchange new ideas face to face and present their research results, discuss the key challenges and research directions facing the development of this field, promote the development and application of theories and technologies in universities and enterprises, and establish business or research contacts and find global partners for their future careers. We warmly welcome experts and scholars from universities and research institutions at home and abroad to submit papers and attend the conference!

    EEI 2020:EI indexing records

    https://static.ais.cn/resource/editor/202012/356201229101432828.jpg

    1. Organizer

    AEIC

    2. Guest structure

    Conference Chair

    Prof. Quanxin Zhu

    Hunan Normal University, China

    Assoc. Prof. GHAMGEEN IZAT RASHED

    Wuhan University-School of Electrical Engineering and Automation

    Keynote speakers

    Prof. Yang Yue

    Institute of Modern Optics, Nankai University, China

    Prof. Quanxin Zhu

    Hunan Normal University, China

    Prof. Philip T Moore, School of Information Science and engineering, Lanzhou University, China

    3.CALL FOR PAPER

    The topics of interest for submission include, but are not limited to:

    * Signal processing

    * Computer science and engineering

    * System control

    * Photonics and optics

    * Electronics and integration

    * Power technology

    * Electromagnetism

    * Communication technology

    4.Publication

    1. EI

    All accepted papers of EEI-CN 2021 will be published in Journal of Physics: Conference Series (ISSN: 1742-6588) , it will be submitted to EI Compendex, Scopus for indexing.

    2. SCI

    *High quality papers will be recommended for publication in SCI journal.

    Journal 1(IF 0.814):Journal of Engineered Fibers and Fabrics, ISSN 1558-9250, regular issue

    Journal 2(IF 1.574):Thermal Science, ISSN 0354-9836, regular issue

    Journal 3(IF 1.197):Reviews on Advanced Materials Science, ISSN 1606-5131, regular issue

    Journal 4(IF 3.057):Materials, ISSN 1996-1944, regular issue

    Journal 5(IF 3.119):RSC Advances, ISSN2046-2069, regular issue

    For more information and detail please visit AEIC homepage. Other services of publication and translation please contact us.

    5.Submission Methods

    1.The submitted papers must not be under consideration elsewhere.

    2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

    https://www.ais.cn/attendees/paperSubmit/JUBEVQ

    3.Please submit the full paper, if presentation and publication are both needed.

    4.Please submit the abstract only,if you just want to make presentations.

    5.Should you have any questions, or you need any materials in English, please contact us at eeicn2021at163.com.

    6.Registration

    For the publication on EEI-CN 2021 conference proceedings:

    Items……Registration fee (By RMB) ……Registration fee (By US Dollar)

    Regular Registration(4-6 pages)……3200RMB/per paper……500 USD/per paper

    Team Registration(4-6 pages) ≥ 3/per paper……2900RMB/per paper……450 USD/ per paper

    Extra Pages (Begin at Page 7)……300RMB/per extra page……50 USD/ per extra page

    Attendees without Papers……1200RMB/per person……180 USD / per person

    Attendees without Papers (Groups)……1000RMB/per person(≥ 3 persons)……150 USD / per person(≥ 3 persons)

    Purchase Extra Journal……500RMB/book……75 USD/book

    7.Program

    Schedule

    Jun 18……13:00-18:00……Registration

    Jun 18……18:00-19:30……Dinner

    Jun 19……09:00-12:00……Speeches of Keynote Speakers

    Jun 19……12:00-14:00……Lunch

    Jun 19……14:00-17:30……Oral Presentations

    Jun 19……18:00-19:30……Banquet

    Jun 20……09:00-18:00……Academic Investigation

    8.CONTACT US

    Conference Secretary: Iris Wang

    E-mail: eeicn2021at163.com

    Tel: +86-13502443374

    (Wechat)QQ: 1013709317

    9.History

    EEI2019

    http://cn.icoeei.org/mxLJtdIp

    EEI2020

    http://cn.icoeei.org/XQiynYvN


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.