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    SINGAPORE--ICDES 2022 - The 7th International Conference on Design Engineering and Science(ICDES 2022)

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    Website https://www.icdes.org/ | Edit Freely

    Category design; modeling; artificial intelligence; design automation

    Deadline: August 25, 2021 | Date: February 25, 2022-February 27, 2022

    Venue/Country: Singapore, Singapore

    Updated: 2021-04-27 17:15:14 (GMT+9)

    Call For Papers - CFP

    Call for Paper

    The 7th International Conference on Design Engineering and Science(ICDES 2022)

    Feb. 25-27, 2022 | Singapore

    Web: https://www.icdes.org/

    The 7th International Conference on Design Engineering and Science(ICDES 2022) will be hosted in Singapore during Feb. 25-27, 2022, in conjunction with IC4M 2022. ICDES 2022 is organized by Hong Kong Society of Mechanical Engineers.

    With the continuous success of ICDES, we believe that ICDES 2022 will be more exciting and obviously the main annual Design Engineering and Science conference aimed at presenting current research. The idea of the conference is for the scientists, scholars, engineers and students from the universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the universities and the industry.

    The whole conference committee cordially invite you to this outstanding conference. We look forward to receiving your paper in either research or development of acquired knowledge in order to disseminate to the wider audience.

    We look forward to seeing you in Singapore on the 25th-27th, February, 2022.

    ●Topics of interest include,but are not limited to the followings:

    (1) Design Methodology

    Design process, Evaluation of design, Design assurance, Conceptual design,Ethics in design, Design strategy, Reliability, Mechatronics design, Product Design

    (2) Design and Development

    Design of mechanical elements, Mechanical synthesis, Robotics, Linkage, Cammechanism, Die cast, Biomedical device, Control system design, Welfaredevice, Vehicle dynamics design, Thermal design, Strength of materials,Human engineering, Lightweight materials and composites, Vehicle safety design, Design of mobility systems

    (3) Design and Production

    Design management, Life cycle design, Producibility, Production planning,Inverse manufacturing, Reverse engineering, Recycling technology, Machinetool, Automation design, KANSEI, Additive manufacturing, Prototyping and Testing

    (4) CAD/CAM/CAE

    Computer graphics, 2D/3D-CAD, CAM, Database, Tool path design, Expertsystem,Rapid prototyping, Finite element method, Optimization method,Dynamical simulation, Modeling, Artificial Intelligence

    (5) Accuracy and Measurement

    Surface characteristics, Tribology, Tolerance, Truncation, On-machinemeasurement,Industrial standard

    (6) Design Education

    Creative design education, Project based learning, CAI, Virtual reality, e-learning,Technologytransfer, On hand learning, Robot contest, Active learning

    (7) Others Related to Design Engineering and Science and Workshop with theDesign Society and the Design Education SIG.

    ●Paper Submission

    Submission Email: icdes@smehk.org

    You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDES2022

    ●Call for participants

    1,Presenter: If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdes@smehk.org

    2,Listener: You are welcome to attend this great event. You need to complete the registration as Listener before the registration dealdine. Send email to icdes@smehk.org for further information.

    3,Reviewer: We sincerely welcome experts in the areas of Design Engineering and Science join the conference as reviewer.

    ●Contact Us

    Amber Cao

    Email: icdes@smehk.org

    Tel:+852-30506862( Hong Kong)

    Web: https://www.icdes.org/


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.