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    ICICM 2021 - 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)

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    Website http://www.icicm.net/ | Edit Freely

    Category Integrated Circuits and Microsystems

    Deadline: September 10, 2021 | Date: October 22, 2021-October 24, 2021

    Venue/Country: Nanjing, China

    Updated: 2021-08-26 15:06:52 (GMT+9)

    Call For Papers - CFP

    Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus

    Abbreviation: ICICM 2021

    Time: October 22-24, 2021

    Place: Nanjing,China

    Website: http://www.icicm.net/

    ==Submission

    (For early submission, it will get the feedback within 1 month)

    ==Publication: Conference Proceeding

    ==Indexed by: Ei Compendex, and Scopus, etc.

    ==Submission email: icicm@young.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)

    ==Find the tempalte with the link: http://icicm.net/files/Template.doc

    ★Co-sponsored by★

    University of Electronic Science and Technology of China, China

    Technology of China and Southeast University, China

    ★ICICM Committees★

    Advisory Chairs

    David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)

    Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)

    Conference Chairs

    Zhigong Wang, Southeast University, China

    Li Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter)

    Program Chairs

    Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)

    Zou Zhuo, Fudan University, China(Senior Member of IEEE)

    Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden

    Steering Committee Chair

    Huang Le Tian, University of Electronic Science and Technology of China, China

    For more members, please visite conference website: http://www.icicm.net/committee.html

    ★History★

    Papers of ICICM2020 can be checked in IEEE Xplore!

    Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2

    Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

    Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

    Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

    Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

    Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

    Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

    Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

    Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

    ★Topics★

    Digital, Analog, Mixed Signal IC and SOC design technology

    Silicon integrated circuits and manufacturing

    Low-power, RF devices & circuits

    IC Computer-Aided –Design technology, DFM

    Silicon/germanium devices and device physics

    Interconnect, Low K, High K and other process technologies

    Unconventional and nano-electronics

    Organic semiconductor devices and technologies

    Compound semiconductor devices and circuits

    Displays, sensors and MEMS

    Semiconductor materials and material characterization

    Packaging and testing technology

    Solar cell & other devices for new energy sources

    Modeling and simulation

    Equipment technology

    Reliability

    Displays, sensors and MEMS

    Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

    ★Conference Contact★

    Ms Zeng

    Email: icicm@young.ac.cn

    Tel: +86-28-87777577

    Web: www.icicm.net


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.