ICICM 2021 - 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)
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Website http://www.icicm.net/ |
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Category Integrated Circuits and Microsystems
Deadline: September 10, 2021 | Date: October 22, 2021-October 24, 2021
Venue/Country: Nanjing, China
Updated: 2021-08-26 15:06:52 (GMT+9)
Call For Papers - CFP
Full Name: 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021)--EI Compendex, Scopus Abbreviation: ICICM 2021Time: October 22-24, 2021Place: Nanjing,ChinaWebsite: http://www.icicm.net/==Submission(For early submission, it will get the feedback within 1 month)==Publication: Conference Proceeding==Indexed by: Ei Compendex, and Scopus, etc.==Submission email: icicmyoung.ac.cn (Or you still can submit to the submission system https://easychair.org/conferences/?conf=icicm2021)==Find the tempalte with the link: http://icicm.net/files/Template.doc★Co-sponsored by★University of Electronic Science and Technology of China, ChinaTechnology of China and Southeast University, China★ICICM Committees★Advisory Chairs David Z. Pan, The University of Texas at Austin, United States (IEEE Fellow, SPIE Fellow)Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow) Conference Chairs Zhigong Wang, Southeast University, ChinaLi Qiang, University of Electronic Science and Technology of China, China(Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter) Program Chairs Fei Yuan, Ryerson University, Canada(Senior Member of IEEE and IET Fellow)Zou Zhuo, Fudan University, China(Senior Member of IEEE)Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden Steering Committee ChairHuang Le Tian, University of Electronic Science and Technology of China, ChinaFor more members, please visite conference website: http://www.icicm.net/committee.html★History★Papers of ICICM2020 can be checked in IEEE Xplore!Electronic ISBN: 978-1-7281-8978-9 | USB ISBN: 978-1-7281-8977-2Papers of ICICM2019 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3★Topics★Digital, Analog, Mixed Signal IC and SOC design technologySilicon integrated circuits and manufacturingLow-power, RF devices & circuitsIC Computer-Aided –Design technology, DFMSilicon/germanium devices and device physicsInterconnect, Low K, High K and other process technologiesUnconventional and nano-electronicsOrganic semiconductor devices and technologiesCompound semiconductor devices and circuitsDisplays, sensors and MEMSSemiconductor materials and material characterizationPackaging and testing technologySolar cell & other devices for new energy sourcesModeling and simulationEquipment technologyReliabilityDisplays, sensors and MEMSAdvance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)★Conference Contact★Ms ZengEmail: icicmyoung.ac.cnTel: +86-28-87777577Web: www.icicm.net
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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