MMEAT 2021 - The 2021 7th International Conference on Materials, Mechanical Engineering and Automation Technology (MMEAT 2021)
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Website http://mmeat.cn/ |
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Category Materials;Mechanical Engineering;Automation Technology
Deadline: June 15, 2021 | Date: June 18, 2021-June 20, 2021
Venue/Country: Dali, China, China
Updated: 2021-05-27 10:59:15 (GMT+9)
Call For Papers - CFP
Website URL :http://mmeat.cn/Start Date / End Date: June 18-20, 2021Location: Dali, China.Submission Deadline: Visit the website for more details1. About the conference:The 2021 7th International Conference on Materials, Mechanical Engineering and Automation Technology (MMEAT 2021) will be held on June 18-20, 2021 in Dali, China. MMEAT 2021 is to bring together innovative academics and industrial experts in the field of materials, mechanical engineering and automation technology to a common forum. The primary goal of the conference is to promote research and developmental activities in information technology and computer science and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in materials, mechanical engineering and automation technology and related areas.2. PublicationAll submissions will be peer reviewed, and the accepted papers will be published in the Conference proceedings and will be submitted to EI、SCOPUS for indexing. 3. Submission GuidesA. Full Paper (for Presentation and Publication)Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.B. Abstract (Presentation only)Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.C. English Template(Download) *All submissions must not be less than 4 pages in length.(authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)D. Submission Methods1.Please send the full paper & abstract to AIS SUBMISSION SYSTEM.4. Call for papersTopics include but are not limited to the following areas:New Materials and Advanced MaterialsMaterials of lighting sourceSemi-conductor materialsInsulating materialsElectronic materialsNon-ferrous Metal materialIron and SteelComposites / Thin FilmsMicro / Nano MaterialsCeramicOptical/Electronic/Magnetic MaterialsEarthquake Materials and DesignBiomaterialsNew Functional MaterialsEnvironmental Friendly MaterialsSmart/Intelligent Materials/Intelligent SystemsPolymeric MaterialsBuilding MaterialsNew materials, New Technology and New ProductsCorrosion of Materials and Surface treatment technologyMechanical Behavior & Fracture New Energy Materials Tooling Testing and Evaluation of MaterialsResearch and Development of Composite MaterialsResearch and Development of New materialsMechanical EngineeringMechanical Dynamics and VibrationMechanical StrengthMechanical Friction, Wear and Lubrication Mechanical DesignRolling Casting Technology and EquipmentWelding Technology and Equipment Plastic Processing Technology and EquipmentHeat treatment technology and Equipment Cutting Technology and EquipmentSpecial Processing Technology and Equipment The Machine Assembly ProcessNon-metallic ProcessingFluid Power Transmission and Control InstrumentationPower Mechanical EngineeringVehicle EngineeringCNC Technology and Numerical Control MachinesAgricultural Machinery ManufacturingMining Machinery EngineeringChemical Machinery and Equipment Textile Machinery and EquipmentFood MachineryMetallurgical Machinery and AutomationConstruction Machinery and EquipmentAircraft Structure and DesignAircraft Manufacturing TechnologySpacecraft Structure and DesignControl, Automation and Information TechnologyControl System Modeling and Simulation technologyIntelligent Optimization Agorithms and ApplicationsFluid Power Transmission and ControlProduction Process SimulationNetwork ControlElectric AutomationVehicle Control SystemsComputer Integrated ManufacturingMicroelectronics TechnologyEmbedded SystemsThe Photoelectron IT and SystemIntelligent Traffic ControlComputer System StructureSoftware Development and ApplicationComputer Application Technology5、RegistrationItems ---Registration fee (By US Dollar) Regular Registration (4 pages)---500 USD / 3200 RMB per paperExtra Pages (Begin at Page 5)---50 USD / 300 RMB per extra pageAttendees without Papers---180 USD / 1200 RMB per personAttendees without Papers (Groups)---150 USD / 1000 RMB per person (≥3 persons)Purchase Extra Journal---75 USD / 500 RMB per book6. ScheduleScheduleJune.18---13:00-17:00---Registration (Hotel)June.19---09:00-12:00---Keynote SpeechJune.19---12:00-14:00---Lunch TimeJune.19---14:00-17:30---Oral SessionJune.19---18:00-19:30---BanquetJune.20---09:00-12:00---Academic Investigation 7.Contact UsConference Secretary: Arista LiTel: +86-13922151347WeChat: 86-13922151347
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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