ICICM 2020 - 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)
View: 1398
Website http://www.icicm.net/ |
Edit Freely
Category Integrated Circuits; Microsystems
Deadline: September 15, 2020 | Date: October 23, 2020-October 25, 2020
Venue/Country: Nanjing, China
Updated: 2020-08-21 18:36:23 (GMT+9)
Call For Papers - CFP
IEEE--2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)--Ei Compendex, Scopus, and CPCITime: October 23-25, 2020Place: Nanjing, Chinahttp://www.icicm.net/==Publication: All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.==Submission email:icicmyoung.ac.cn (Or you still can submit to the submission system on website)==Find the tempalte with the link: http://icicm.net/Template.doc (Word) http://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex)★Keynote SpeakersProf. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, CanadaProf. Fei Yuan,Ryerson University, Canada★Invited SpeakersProf. Sheng-Lyang Jang,National Taiwan University of Science and Technology, TaiwanProf. Dai Yong-Sheng,Nanjing University of science & Technology, China★ICICM CommitteesAdvisory ChairProf. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, CanadaConference ChairsProf. Zhigong Wang, Southeast University, ChinaProf. Li Qiang, University of Electronic Science and Technology of China, ChinaProf. Gene Eu Jan, National Taipei University, TaiwanProgram ChairsProf. Fei Yuan, Ryerson University, CanadaProf. Zou Zhuo, Fudan University, ChinaProf. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden Assoc. Prof. Keping Wang, Southeast University, ChinaSteering Committee ChairsProf. Huang Le Tian, University of Electronic Science and Technology of China, ChinaProf. Dai Yong-Sheng, Nanjing University of Science & Technology, China Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, TaiwanTechnical CommitteeProf. Xiaoxiao Wang, BeiHang University, ChinaProf. Bo Yan, University of Electronic Science & Technology of China, ChinaProf. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, IndiaAssis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi ArabiaAssoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, IranAssoc. Prof. Tiejun Chen, Yiyang Medical College, ChinaAssis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, ChinaProf. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, ChinaAssis. Prof. Yu Bai, California State University Fullerton, USAProf. Jinzhao Wu, Guangxi University for Nationalities, ChinaProf. Shiwei Feng, Beijing University of Technology, ChinaAssoc. Prof. Wei Ni, Hefei University of Technology, ChinaProf. Xingyuan Tong, Xi'an University of Posts & Telecommunications,ChinaProf. Jinyan Wang, Peking University, ChinaProf. Zhi-Jian Xie, NC A&T State University, USAProf. S. Ushakumari, College of Engineering Trivandrum, IndiaProf. Lu Tang, Southeast University, ChinaProf. Haizhi Song, University of Electronic Science and Technology of China, ChinaProf. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, ChinaProf. Shiwei Feng, Beijing University of Technology,ChinaAssoc.Prof. Quanzhen Duan,Tianjin University of Technology, ChinaAssoc.Prof. Yue Ming Ding,Tianjin University of Technology,ChinaProf.Shengming Huang,Tianjin University of Technology, ChinaProf. Fei Yuan, Ryerson University, CanadaAssoc. Prof. Guolin Sun, Beihang University, ChinaAssoc. Prof. Yuan-Hao Huang, National Tsing Hua University,TaiwanAsst. Prof. Dr. Najam Muhammad Amin, Bahria University, PakistanProf. Dr.Qifeng Xu, Fuzhou University, ChinaFor more members, please visit conference website: http://www.icicm.net/committee.html★HistoryPapers of ICICM2019 can be checked in IEEE Xplore!Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3★TopicsDigital, Analog, Mixed Signal IC and SOC design technologySilicon integrated circuits and manufacturingLow-power, RF devices & circuitsIC Computer-Aided –Design technology, DFMSilicon/germanium devices and device physicsInterconnect, Low K, High K and other process technologiesUnconventional and nano-electronicsOrganic semiconductor devices and technologiesCompound semiconductor devices and circuitsDisplays, sensors and MEMSSemiconductor materials and material characterizationPackaging and testing technologySolar cell & other devices for new energy sourcesModeling and simulationEquipment technologyReliabilityDisplays, sensors and MEMSAdvance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)★Support1, Technical Support from IEEE2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China★Conference Schedule1) October 23, 2020—Registration & Material Collecting 2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations3) October 25, 2020—Papers Presentations★Conference ContactMs Daisy TsengEmail: icicmyoung.ac.cnTel: +86-28-87777577
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.