ICOPEN 2019 - SPIE--2019 International Conference on Optical and Photonic Engineering (icOPEN 2019)--Scopus, Ei Compendex
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Website http://www.icopen.net |
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Category Optical;Photonic Engineering
Deadline: April 05, 2019 | Date: July 16, 2019-July 20, 2019
Venue/Country: Phuket, Thailand
Updated: 2019-03-18 11:06:01 (GMT+9)
Call For Papers - CFP
icOPEN 2019SPIE--2019 International Conference on Optical and Photonic Engineering (icOPEN 2019)--Scopus, Ei CompendexPhuket, Thailand16 - 20 July, 2019http://www.icopen.net/Publication:icOPEN 2019 conference proceedings will be published by SPIE, which will be included in SPIE Digital Library, provided to the Web of Science Conference Proceedings Citation Index-Science, Scopus, Ei Compendex, and others, to ensure maximum awareness of the Proceedings.Specific topics of interest include, but are not limited to, the following: 3D Computer Vision3D Image Acquisition and DisplayBiomedical Optics and ImagingDiffractive and Freeform OpticsDigital Holography and Quantitative Phase ImagingFiber Optics and Sensing TechnologyHigh Resolution Optical MetrologyImage Processing and Deep LearningInformation-rich MetrologyLaser Micro-nano Processing and PatterningNon-Destructive Testing and InspectionOptical component and System SimulationOptical Functional Materials and DevicesOptical ArtPhotomechanicsTerahertz Science and TechnologyUltrafast Lasers and ApplicationsFor more information, please visit http://icopen.net/index.htmlSubmission Methods:Participant needs to submit the abstract before the deadline first. After the abstract passed the review, if you wish to publish your paper, please submit the full paper of the same abstract before the deadline. Full Paper (publication and oral presentation)Abstract (oral presentation only)Electronic Submission System http://www.icopen.net/sub.htmlContacts:Conference Secretary: Tinny LeeEmail: secretaryicopen.netTel: +86-13281280917
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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