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    ICSTA 2021 - 2021 International Conference on Sensing Technology and Applications (ICSTA 2021)

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    Website http://www.staic.org/ | Want to Edit it Edit Freely

    Category Sensing Technology;Applications;ICSTA 2021

    Deadline: April 16, 2021 | Date: April 23, 2021-April 25, 2021

    Venue/Country: Chengdu, China, China

    Updated: 2021-03-11 10:59:26 (GMT+9)

    Call For Papers - CFP

    CONFERENCE INFORMATION:

    Website:http://www.staic.org/

    Conference Date:Apr. 23-25, 2021

    Venue:Chengdu, China

    Submission Deadline: April 19, 2021

    Notification: within 1 week after submission

    Indexing:EI,Scopus,CNKI

    The 2021 International Conference on Sensing Technology and Applications(ICSTA 2021)will be held on April 23 to 25, 2021 in Chengdu China. The meeting focused on the research fields of "Sensing Technology" and "Sensing Applications". The aim is to provide a common forum for researchers, scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, developments and applications in the area of sensing technology, to explore the development path of ecological civilization construction, and to cope with new opportunities and challenges.

    We cordially invite you to submit paper and attend ICSTA 2021. Looking forward to your participation!

    1.General Chair

    Prof. Zhi Gao

    Wuhan University

    2.Keynote Speakers

    Prof. Zhi Gao

    Wuhan University, China

    Prof. Bingguo Liu

    Harbin Institute of Technology, China

    Prof. Qingyang Wei

    University of Science and Technology Beijing, China

    Prof. Xinhua Tang

    Southeast University, China

    Prof. Yang Chai

    The Hong Kong Polytechnic University, China

    Keep updating…

    3.CALL FOR PAPER

    3D Printed Sensors

    Applications of Sensors (automotive, medical, environmental monitoring, consumer, alarm and security, military, nautical, aeronautical and space sensor systems, robotics, and automation)

    Biosensors

    Chemical & Biological Sensor System

    Electromagnetic Sensors

    Fabrication Technology

    Fiber Optic Sense Technology

    Health monitoring and fault diagnosis

    Human Activity Monitoring

    Imaging Sensors

    Immunosensors

    Lab-on chip

    Mechanical sensors (inertial, pressure, and tactile)

    Modeling and Simulation of Novel Devices

    Motion and Location Tracking

    Multi-sensor and Sensor-network Systems

    Nanomaterials and Electrics Technology for Sensors

    Optical Sensors (radiation sensors, optoelectronic/photonic sensors, and fibres)

    Physical Sensor System

    Polymer Materials for Sensors

    Pressure & Strain Sensors

    Semiconductor Materials for Sensors

    Sensor Modeling & Characterization

    Sensor Network and Application

    Sensors and Actuators

    Sensors Signal Processing

    Smart Sensors

    Structural Sensing

    Temperature,Humidity and Gas Sensors

    Theory and New Approach

    Ultrasonic, Acoustic, Magnetic Sensors

    Vision Sensing

    Wireless Sensors and WSN

    4.Publication

    All papers, both invited and contributed, will be reviewed by two or three experts from the committees. All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex, Scopus, CNKi for indexing.

    5. Participation Types:

    Package A: Only Attendance

    Package B: Abstract Submission+Oral Presentation

    Package C: Abstract Submission+Poster Presentation

    Package D: Full Paper Publicaiton+Oral/Poster Presentation+Attendance

    Note: If you need paper publication and presentation both, please submit full paper.

    If you need to make presentation without publication, please submit abstract only.

    Submission Methods

    For Chinese native speakers,

    If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM

    If you choose Package A, B or C, please register via REGISTRATION SYSTEM .

    For English speakers,

    Please send your full paper or abstract directly to: contact_icstaat163.com.

    6.Registration Fee

    Item---Registration fee (By RMB) ---Registration fee (By US Dollar)

    Publication +Attendance---3200RMB/per paper(4-6 pages)---500 USD/per paper (4-6 pages)

    Manuscript numbers ≥ 3---2900RMB/per paper (4-6 pages)---450 USD/ per paper (4-6 pages)

    Extra Pages (Begin at Page 7)---300RMB/per extra page---50 USD/ per extra page

    Presentation+Attendance---1500RMB/per person---250USD/per person

    Attendance Only---1200RMB/per person---180 USD / per person

    Attendees without Submission (Groups)---1000RMB/per person(≥ 3 persons)---150 USD / per person(≥ 3 persons)

    7.Program

    Date---Time---Activities

    4.23 (Friday)---09: 00-18: 00---Registration

    4.24 (Saturday)---08: 50-09: 00---Open Ceremony

    4.24 (Saturday)---09: 00-12: 00---Keynote Speeches

    4.24 (Saturday)---12: 00-14: 00---Lunch

    4.24 (Saturday)---14: 00-18: 00---Oral Session

    4.25(Sunday)---09:00-18:00---Academic Investigation

    * The detailed conference program will be released about one month before the conference

    CONTACT US

    Conference Secretary:Hailey Dong

    E-mail: contact_icstaat163.com

    Tel: +86-17320189207 (Wechat)

    QQ: 2640905300


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.