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    ICCS 2021 - 3rd International Conference on Circuits and Systems (ICCS 2021)

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    Category Circuits and Systems

    Deadline: May 30, 2021 | Date: October 29, 2021-October 31, 2021

    Venue/Country: Chengdu, China

    Updated: 2021-01-21 11:40:23 (GMT+9)

    Call For Papers - CFP

    Full name: 2021 IEEE 3rd International Conference on Circuits and Systems (ICCS 2021)--Ei Compendex, Scopus

    Abbreviation: ICCS 2021

    Chengdu, China | October 29-31, 2021

    More details, please visit:

    2021 IEEE 3rd International Conference on Circuits and Systems will take place in Chengdu, China, during Oct. 29-31, 2021. ICCS 2021 is sponsored by IEEE and IEEE CDEA Chengdu Chapter, hosted by University of Electronic Science and Technology of China.

    【Conference Proceedings】

    Accepted and presented papers will be published into the conference proceedings, which will be online and indexed by EI Compendex and Scopus.

    SCI Journal

    Special Issue on Circuits and Systems for Internet of Things (IoT)

    Excellent papers will be recommended to be published by Microelectronics Journal (ISSN: 0026-2692)

    CiteScore: 2.7 Impact Factor: 1.405

    Indexing: SCI, EI, Scopus

    【ICCS History】

    >> ICCS 2020 | IEEE Conference Proceedings (online soon)

    ISBN: 978-1-7281-9122-5

    >> ICCS 2017 | IEEE Conference Proceedings (EI Compendex & Scopus index)

    ISBN: 978-1-5090-6480-9

    IEEE Xplore Online:

    【Call for Papers】

    including but not limited:

    • Analog signal processing

    • Analog circuits and filters

    • Switched capacitor and switched current techniques

    • Analog and mixed signal processing

    • Data conversion and sigma-delta modulation

    • Low-power and low-voltage circuits

    • Radio frequency circuits

    • Log-domain circuits

    • Visual signal processing and communications

    • Linear and nonlinear circuits and systems

    • Chaos and applications

    • Distributed circuits and systems

    • Power electronics and systems

    • Biomedical circuits and systems

    • Analog and digital ICs

    • Low power design

    • VLSI physical design

    • Testing: analog, digital and mixed

    • High level synthesis and hardware/software co-design

    • Modelling, simulation and CAD tools

    • Microsystems and applications

    • Processor architectures

    • Deep sub/micron design

    • Information theory

    • Coding and modulation

    • Turbo codes and iterative decoding

    • Equalization, synchronization and channel estimation

    • Space-Time coding and processing

    • Multiple access techniques


    Online Submission System:

    E-mail Submission:

    - Contact us -

    Ms. Tina T. Wang


    TEL: +86-028-8652-8629

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.