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    CIMIA 2021 - International Conference on Intelligent Manufacturing and Industrial Automation(CIMIA 2021)

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    Category Intelligent Manufacturing;Industrial Automation;CIMIA 2021

    Deadline: March 19, 2021 | Date: March 26, 2021-March 28, 2021

    Venue/Country: Guilin, China, China

    Updated: 2021-01-28 12:18:49 (GMT+9)

    Call For Papers - CFP



    Conference Date:March 26-28, 2021

    Venue:Guilin, China

    Submission Deadline: 12th March 2021

    Indexing:EI Compendex/ Scopus

    International Conference on Intelligent Manufacturing and Industrial Automation(CIMIA 2021)will be held on 26 March 2021 in Guilin, China.

    CIMIA 2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Intelligent Manufacturing and Industrial Automation. Conference topics mainly include but are not limited to 3D printing, Additive Manufacturing, Artificial Intelligence Application, Automation Equipment etc. CIMIA 2021 welcomes all high-quality research papers and presentations from related research fields.

    Guest structure

    Conference Chair

    Prof. Duc Truong Pham

    University of Birmingham, United Kingdom

    Organising Committees

    Prof. Galina Ilieva, University of Plovdiv Paisii Hilendarski, Bulgaria

    Prof. Ramesh Kuppuswamy, University of Cape Town, South Africa

    Prof. Enzo Morosini Frazzon, Federal University of Santa Catarina, Brazil

    Dr. Haidong Shao, Hunan University, China

    Prof. Marcelo S. Alencar, Visiting Professor, Senai Cimatec, Brazil

    Dr.Radu Godina, Assistant Professor , Universidade NOVA de Lisboa, Portugal

    Prof. Francesco Longo, University of CalabriaVia, Italy

    Prof. Jinglong Chen, Xi'an Jiaotong University, China

    Prof. Ping Jiang, Huazhong University of Science and Technology, China

    Prof. Doriana Marilena D'Addona, University of Naples Federico II, Italy

    Technical Programme Committees

    Dr. Nanya Li, Karlsruhe Institute of Technology, Germany

    Prof. Moh'd Sami Ashhab, Hashemite University, Jordan

    Prof. Kheng-Lim Goh, Newcastle University, Singapore

    Prof. Dong Liu, Dalian University of Technology, China

    Dr. Egon Ostrosi, Université de Technologie de Belfort-Montbéliard, France

    Prof. Mohan Kolhe, University of Agder, Norway

    Prof. Jitender Kumar Chhabra, National Institute of Technology, Kurukshetra, India

    Prof. Yusri Bin Yusof, Universiti Tun Hussein Onn Malaysia, Malaysia

    Keynote speaker

    Prof. Duc Truong Pham

    University of Birmingham, United Kingdom

    Prof. Weiming Shen

    Huazhong University of Science and Technology, China

    Prof. Jihong Yan

    Harbin Institute of Technology, China

    Prof. Fei Tao

    Beihang University, China

    Prof. Victor Chang

    Teesside University, United Kingdom

    Keep updating


    The topics of interest for submission include, but are not limited to:

    3D printing

    Additive Manufacturing

    Artificial Intelligence Application

    Automation Equipment

    Computer Science

    Computer-aided Manufacturing

    Control and Automation Engineering

    Digital Twin


    Edge Computing

    Electric Automation

    Electrical Engineering

    Electronic Technology

    Human Machine Integration

    Industrial Big Data

    Industrial Networks

    Industrial Robots

    Industrial Technology

    Information Technology

    Intelligent Design

    Intelligent Information Systems

    Intelligent Materials and Applications

    Intelligent Technology

    Internet of Things

    Machine Vision

    Manufacturing Systems and Technologies

    Materials Science

    Numerical Control

    Power and Energy

    Recognition and Sensing


    Virtual Technology


    *All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After peer-review, all accepted papers of ECIE 2021 will be published by Journal of Physics: Conference Series (ISSN: 1742-6588), and then submit to EI Compendex and Scopus for retrieval.

    *High quality papers will be recommended for publication in SCI journal.

    Participation Types:

    Package A: Only Attendance

    Package B: Abstract Submission+Oral Presentation

    Package C: Abstract Submission+Poster Presentation

    Package D: Full Paper Publicaiton+Oral/Poster Presentation +Attendance

    Note: If you need paper publication and presentation both, please submit full paper.

    If you need to make presentation without publication, please submit abstract only.

    Submission Methods:

    If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM

    If you choose Package A, B or C, please register via REGISTRATION SYSTEM .

    Registration Fee

    Item---Registration fee (By RMB) ---Registration fee (By US Dollar)

    Publication+Presentation+Attendance---3200RMB/per paper(6 pages)---490 USD/per paper (6 pages)

    Additional Paper Publication---2900RMB/per paper(6 pages)---450 USD/ per paper (6 pages)

    Extra Pages (Begin at Page 5)---300RMB/per extra page---50 USD/ per extra page

    Presentation+Attendance---1500RMB/per person---250USD/per person

    Attendance Only---1200RMB/per person---180 USD / per person

    Attendees without Submission (Groups)---1000RMB/per person(≥ 3 persons)---150 USD / per person(≥ 3 persons)




    Mar. 26 (Friday)---13:00-18:00---Registration

    Mar. 27(Saturday)---09:00-12:00---Keynote Session

    Mar. 27(Saturday)---12:00-14:00---Lunch

    Mar. 27(Saturday)---14:00-18:00---Invited Session

    Mar. 27(Saturday)---18:00-19:30---Dinner

    Mar. 28(Sunday)---09:00-18:00---Technical Session


    Conference Secretary: Leah Li


    Tel: +86 17737319063 (Wechat)

    QQ: 978640953


    1. Welcome Prof. Duc Truong Pham from Birmingham University join CIMIA 2021 as Keynote Speaker!

    2. Welcome Prof. Jihong Yan from Harbin Insititute University join CIMIA 2021 as Keynote Speaker!

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.