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    IOTAIMA 2021 - 2021 2nd International Conference on Internet of Things, Artificial Intelligence and Mechanical Automation (IoTAIMA 2021)

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    Website http://iotaima.org | Want to Edit it Edit Freely

    Category Internet of Things;Artificial Intelligence;Mechanical Automation

    Deadline: April 28, 2021 | Date: May 14, 2021-May 16, 2021

    Venue/Country: Hangzhou, China

    Updated: 2021-04-30 11:46:27 (GMT+9)

    Call For Papers - CFP

    2021 2nd International Conference on Internet of Things, Artificial Intelligence and Mechanical Automation (IoTAIMA 2021)[第二届物联网、人工智能与机械自动化国际学术会议] will be held on May 14-16, 2021 in Hangzhou, China. IoTAIMA 2021 will provide a forum within the international academic and engineering community in the field of Internet of Things, Artificial Intelligence and Mechanical Automation.

    The annually-held IoTAIMA conference aims to gather professors, researchers, scholars and industrial pioneers all over the world. IoTAIMA is the premier forum for the presentation and exchange of past experiences and new advances and research results in the field of theoretical and industrial experience. The conference welcomes contributions which promote the exchange of ideas and rational discourse between educators and researchers all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to IoTAIMA 2021.

    1.Conference Chair

    Prof. Ke Zhang, Vice dean of the School of Mechanical Engineering, Shanghai Institute of Technology, China

    2.Keynote Speakers

    Prof. Qixin Cao, Shanghai Jiao Tong University, China

    Prof. Li Guo, Hunan University, China

    Prof. Huailin Zhao, Shanghai Institute of Technology, China

    3. Publication

    For full papers submitted to IoTAIMA 2021, after the peer reviewing process by at least 2-3 experts. All the accepted papers will be published by Journal of Physics: Conference Series(ISSN: 1742-6596), which will be submitted to EI Compendex, Scopus for indexing.

    4. Call for paper

    IoTAIMA 2021 is intended to foster the dissemination of state-of-the-art research in the area of Internet of Things, Artificial Intelligence and Mechanical Automation and the fundamental interaction between them.

    We invite submissions on a wide range of research topics, spanning both theoretical and systems research. The topics of interest include, but are not limited to:

    Radio Frequency Identification

    Micro - Electro - Mechanical Systems

    Machine-to-Machine/Man

    New Sensing Technology

    Artificial intelligence

    Intelligent perception systems

    Intelligent control system

    Unmanned system control technology

    Human-machine-environment natural interaction and interaction

    Intelligent manufacturing

    Micro-Machining

    Industrial robots and automatic production line

    Mechanical control

    Automation

    Automatic control

    Mechatronics

    5. Paper submission

    (1) Submitted papers should be written in English, including all figures, tables, references, and appendices. ordinary length limits is 4-12 pages.

    (2) Only original papers will be considered. the manuscripts must not be previously published or accepted for publication elsewhere. must not be under review by any other conference or publication during the review cycle.

    (3) Full Paper/Publication: Full paper submission is required before submission deadline if you request paper publication.

    Abstract/Oral Presentation only: If publication is not needed, then please only submit abstract.

    *Please submit your paper(word+pdf) to Online Submission System

    6. Details of the attending registration

    For Presenter and Participant who are interested in attending IoTAIMA 2021 with no publication, please complete the registration before the registration deadline. Online Registration System:https://www.ais.cn/attendees/paperSubmit/AUIJNJ

    7.Contact us

    Email: iotaimaat163.com

    QQ: 1393050893

    Tel: +86-19872496992


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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