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    EMIE 2021 - 2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021)

    View: 608

    Website http://icemie.org/ | Want to Edit it Edit Freely

    Category Electronic Materials;nformation Engineering;EMIE2021

    Deadline: April 02, 2021 | Date: April 09, 2021-April 11, 2021

    Venue/Country: Xi´an, China, China

    Updated: 2021-03-29 12:49:20 (GMT+9)

    Call For Papers - CFP

    Conference Title: 2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021)

    Website URL : http://icemie.org/

    Start Date / End Date: April 09-11, 2021

    Location: Xi´an, China.

    Submission Deadline: Visit the website for more details

    1. About the conference:

    2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021) will be held on April 09-11, 2021 in Xi´an, China. EMIE 2021 provides an enabling platform for Electronic Materials and Information Engineering experts to exchange new ideas and present research results.This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. We sincerely invite you to participate in EMIE 2021 and look forward to seeing you in Xi´an!

    2. Publication

    All accepted conference papers will be published by Journal of Physics: Conference Series (ISSN: 1742-6588), and then submit to EI Compendex, Scopus for retrieval.

    3. Important Dates

    Paper Submission:Visit the website for more details

    Notification of Acceptance:About 1-2 weeks after the submission

    Registration Deadline: April 9,2020

    Conference Dates: April 09-11, 2020

    4. Submission Guides

    A. Full Paper (for Presentation and Publication)

    Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.

    B. Abstract (Presentation only)

    Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

    C. English Template(Download)

    *All submissions must not be less than 4 pages in length.

    (authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)

    D. Submission Methods

    Please send the full paper & abstract to AIS SUBMISSION SYSTEM.

    5.

    (a) electronic materials

    1. semiconductor materials

    2. Conductive metals and their alloys

    3. Electromagnetic shielding materials

    4. Dielectric materials

    5. Piezoelectric and ferroelectric materials

    6. Magnetic materials

    7. optoelectronic materials

    8. Battery

    9. Microelectronic materials

    10. power electronics

    11. Advanced power semiconductors

    12. Distributed generation, fuel cells and renewable energy systems

    13. Electromagnetic compatibility

    14. Wearable electronic materials

    15. electronic packaging

    16. Two-dimensional material flexible optoelectronic devices

    17. integrated circuits

    18. sensors

    19 electronic information computer materials

    (b) Information engineering:

    20. Information and communication engineering

    21. Artificial intelligence

    22. Bioinformatics

    23. Software engineering

    24. VLSI design and manufacturing

    25. Photonic technology

    26. Parallel and distributed computing

    27. Data mining

    28. cryptography

    29. algorithm and data structure

    30. Figure and combination

    31. E-commerce and E-learning

    32. Geographic Information System (GIS)

    33. Networking

    34. Signal processing

    35. Embedded system

    36. Communication and wireless systems

    37. Multimedia systems and applications

    38. Emerging technologies

    (c) Other related topics

    6. Registration

    Items Registration fee (By US Dollar)

    Regular Registration (4-6 page450 USD / 3200 RMB per paper

    Additional Paper (4-6 pages)430 USD / 2900 RMB per paper

    Extra Pages (Begin at Page 7)50 USD / 300 RMB per extra page

    Attendees without Papers180 USD / 1200 RMB per person

    Attendees without Papers (Groups)150 USD / 1000 RMB per person (≥3 persons)

    Purchase Extra Journal75 USD / 500 RMB per book

    7. Schedule

    Schedule

    April 0913:00-17:00Registration (Hotel)

    April 1009:00-12:00Keynote Speech

    April 1012:00-14:00Lunch Time

    April 1014:00-17:30Oral Session

    April 1018:00-19:30Banquet

    April 1109:00-12:00Academic Investigation

    8. Contact Us

    Conference Secretary: Arista Li

    E-mail: emie2021atyeah.net

    Tel/WeChat: +86-13922

    QQ: 3326203643


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.