EMIE 2021 - 2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021)
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Website http://icemie.org/ |
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Category Electronic Materials;nformation Engineering;EMIE2021
Deadline: April 02, 2021 | Date: April 09, 2021-April 11, 2021
Venue/Country: Xi´an, China, China
Updated: 2021-03-29 12:49:20 (GMT+9)
Call For Papers - CFP
Conference Title: 2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021)Website URL : http://icemie.org/Start Date / End Date: April 09-11, 2021Location: Xi´an, China.Submission Deadline: Visit the website for more details1. About the conference:2021 International Conference on Electronic Materials and Information Engineering (EMIE 2021) will be held on April 09-11, 2021 in Xi´an, China. EMIE 2021 provides an enabling platform for Electronic Materials and Information Engineering experts to exchange new ideas and present research results.This conference also promotes the establishing of business or research relations among global partners for future collaboration. We hope that this conference could make significant contribution to the update of knowledge about these latest scientific field. We sincerely invite you to participate in EMIE 2021 and look forward to seeing you in Xi´an!2. PublicationAll accepted conference papers will be published by Journal of Physics: Conference Series (ISSN: 1742-6588), and then submit to EI Compendex, Scopus for retrieval.3. Important DatesPaper Submission:Visit the website for more detailsNotification of Acceptance:About 1-2 weeks after the submissionRegistration Deadline: April 9,2020Conference Dates: April 09-11, 20204. Submission GuidesA. Full Paper (for Presentation and Publication)Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.B. Abstract (Presentation only)Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published. C. English Template(Download) *All submissions must not be less than 4 pages in length.(authors will be charged extra 40 USD/page if the manuscript length is more than 6 pages)D. Submission MethodsPlease send the full paper & abstract to AIS SUBMISSION SYSTEM.5. (a) electronic materials1. semiconductor materials2. Conductive metals and their alloys3. Electromagnetic shielding materials4. Dielectric materials5. Piezoelectric and ferroelectric materials6. Magnetic materials7. optoelectronic materials8. Battery9. Microelectronic materials10. power electronics11. Advanced power semiconductors12. Distributed generation, fuel cells and renewable energy systems13. Electromagnetic compatibility14. Wearable electronic materials15. electronic packaging16. Two-dimensional material flexible optoelectronic devices17. integrated circuits18. sensors19 electronic information computer materials(b) Information engineering:20. Information and communication engineering21. Artificial intelligence22. Bioinformatics23. Software engineering24. VLSI design and manufacturing25. Photonic technology26. Parallel and distributed computing27. Data mining28. cryptography29. algorithm and data structure30. Figure and combination31. E-commerce and E-learning32. Geographic Information System (GIS)33. Networking34. Signal processing35. Embedded system36. Communication and wireless systems37. Multimedia systems and applications38. Emerging technologies(c) Other related topics6. RegistrationItems Registration fee (By US Dollar) Regular Registration (4-6 page450 USD / 3200 RMB per paperAdditional Paper (4-6 pages)430 USD / 2900 RMB per paperExtra Pages (Begin at Page 7)50 USD / 300 RMB per extra pageAttendees without Papers180 USD / 1200 RMB per personAttendees without Papers (Groups)150 USD / 1000 RMB per person (≥3 persons)Purchase Extra Journal75 USD / 500 RMB per book7. ScheduleScheduleApril 0913:00-17:00Registration (Hotel)April 1009:00-12:00Keynote SpeechApril 1012:00-14:00Lunch TimeApril 1014:00-17:30Oral SessionApril 1018:00-19:30BanquetApril 1109:00-12:00Academic Investigation 8. Contact UsConference Secretary: Arista LiE-mail: emie2021yeah.netTel/WeChat: +86-13922QQ: 3326203643
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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