ICEDME 2021 - 2021 4th International Conference on Electron Device and Mechanical Engineering

Website http://www.icedme.org/ | Edit Freely

Category Electron Device；Mechanical Engineering；ICEDME2021

Deadline: March 15, 2021 | Date: March 19, 2021

Venue/Country: online conferences, China

Updated: 2021-03-04 18:20:13 (GMT+9)

Call For Papers - CFP

Website：http://www.icedme.org/

Conference Date: March 19, 2021

Conference Venue: online conferences

ABOUT ICEDME 2021:

2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME 2021) is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.

ICEDME 2021 is organized by AEIC Academy Exchange Information Center and Association Franco-Chinoise en Sciences & Technologies (AFCST). It is a yearly International conference which the experts of this kind of field from different areas and countries will be invited to give the relevant speech. ICEDME 2021 is to provide a platform for researchers, professionals and other experts from around the world to present their research results in Electron Device and Mechanical Engineering.

SPONSOR：

Association Franco-Chinoise

en Sciences & Technologies (AFCST)

AEIC Academy Exchange Information Center

CALL FOR PAPER：

The 2021 4th International Conference on Electron Device and Mechanical Engineering（ICEDME 2021）serves as good platforms for academics, researchers, and engineers to meet and exchange innovative ideas and information on all aspects of Electron Device and Mechanical Engineering. We are delighted to invite you to participate in ICEDME2021.

Topics of interest for submission include, but are not limited to:

Electronic and Embedded Systems

Modern Circuit Theory and Applications

DSP real-time encoding technology and signal

Micro-optoelectronic Device Technology

Biomedical electronics and bioinformatics

Nano electro mechanical System

Signal and multimedia processing

Circuits, devices and systems

Assembly and packaging

Photonics and optoelectronics

Communication engineering

Analysis of power quality and system stability

Wireless/Mobile communication and computing

Software specification and software assurance

Electric energy processing

Analog circuits and digital circuits

Antenna and propagation

Simulation of propagation

Electromagnetic and photonics

Signal processing

Modulation, coding, and channel analysis

Electro-optical phenomena of semiconductors

Power electronics and energy systems

Microwave theory and techniques

Battery management system

Circuits and electronics

Wind power generation

Microwave and millimeter

Power electronics

Signal integrity design for high-speed digital systems

Robotics and atomization engineering

Remote control and techniques of GPS

Digital Electronic Technology

Solar power generation

Analog Electronic Technology

HVDC Transmission Technology

Microcomputer Principle and Application

Microcomputer Control Technology

Power Electronic Technology

Signals and Systems

Automatic Control Principle

Power System Analysis

Automatic Control System

Insulation Technology

High Voltage Technology

Antenna Technology

Electromagnetic and Photonics

Microelectronics

Electronic Circuits

Computational Electromagnetics and Electromagnetic Simulation Technology

Techniques of laser and applications of electro-optics

Computer relaying integrated optics and electro-optics devices

PUBLICATION：

1. All papers will be reviewed by two or three experts from the committees. All accepted full papers will be published in Conference Publishing Services (CPS) and will be submitted to EI Compendex and Scopus for indexing.

[The Proceedings of Icedme 2020 has been successfully published and indexed by both Ei Compendex and Scopus. The screenshot is as follows.]

EI Compendex

SCOPUS

【The 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020) was sucessfully held during May 20, 2020 Online.】

>>For more history: www.icedme.org

2. SCI journal（Submission with notes of conference acronyms will enjoy priority in review and acceptance.）

Excellent papers will be recommended directly to the following or other suitable SCI journals

Journal 1：Journal of Materials Science: Materials in Electronics（ISSN: 0957-4522, IF=2.195, regular issue）

Journal 2：Thermal Science（ISSN: 0354-9836, IF=1.541, special issue）

Submission should be in WORD（.doc）format only, and specified templates will be given after evaluation.

Online submission 【AIS online submission】

For more information about SCI papers and journals, please feel free to contact Editor Li（WeChat/Mobile phone): 18127812811/ Editor Lin（WeChat/Mobile phone): 13922157504.

SUBMISSION METHODS:

A. Full Paper (for Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be publsihed in the conference proceedings.

B. Abstract (Presentation only)

Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

C. EI Template (Download)

*All submissions must not be less than 4 pages in length.

(authors will be charged extra 50 USD/page if the manuscript length is more than 4 pages)

D. Submission Methods

Please send the full paper & abstract to SUBMISSION SYSTEM.(word and pdf)

PROGRAM：

Schedule

Mar.19---14:00-15:30---Speeches of Keynote Speakers

Mar.19---15:30-17:00---Oral Presentations

CONTACT US

Conference Secretary: Sylvia Chen

E-mail: ICEDME126.com

Tel: +86-13922153442 (Wechat)

WeChat: 13922153442

QQ: 1054394179

The Secretary office of ICEDME 2021 will collect contributions and finish daily organizing work. All paper review process will be completed by Program Committee Member and invited experts.

If you have any question or inquiries, please feel free to contact us.