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    ECIE 2021 - International Conference on Electronics, Circuits and Information Engineering(ECIE 2021)

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    Website http://www.confecie.org/ | Want to Edit it Edit Freely

    Category Electronics;Circuits;Information Engineering;ECIE 2021;

    Deadline: January 15, 2021 | Date: January 22, 2021-January 24, 2021

    Venue/Country: Zhengzhou, China, China

    Updated: 2020-11-11 16:32:30 (GMT+9)

    Call For Papers - CFP

    CONFERENCE INFORMATION:

    Website:http://www.confecie.org/

    Conference Date:January 22-24, 2021

    Venue:Zhengzhou, China

    Submission Deadline: Nov. 27, 2020

    Indexing:EI Compendex/ Scopus

    International Conference on Electronics, Circuits and information Engineering(ECIE 2021)will be held on January 22-24 in Zhengzhou, China.

    ECIE2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits and information Engineering. Conference topics mainly include, but not are limited to Digital electronics, Analogue Electronics, Microelectronics, Circuit design, Integrated circuits, Optoelectronics, Semiconductor devices, Embedded systems and Information Engineering etc. ECIE 2021 welcome all high-quality research papers and presentations from related research fields.

    Guest structure

    Conference Chair

    Prof. Farhad Shahnia

    Murdoch University

    International Organising Committees

    Prof. Kamal Kumar Sharma, Lovely Professional University, Punjab

    Dr. Kaichen XU, Osaka Prefecture University, Japan

    Prof. Taraprasanna Dash, Siksha 'O' Anusandhan, India

    Prof. M.Hassaballah, South Valley University, Egypt

    Dr. Michal Hodoň, University of Zilina, Slovakia

    Dr. Michael Waltl, Vienna University of Technology, Austria

    Dr. Prabhat Ranjan, Manipal University Jaipur, India

    Dr. Liviu Octavian Mafteiu-Scai, West University of Timisoara, Romania

    Dr. Viktor Sverdlov, Vienna University of Technology, Austria

    Prof. Yanfeng Jiang, Jiangnan University, China

    Prof. Pascal Lorenz, University of Haute Alsace, France

    Dr. Shahrizal Jelani, UCSI University, Malaysia

    Dr. Farzin Shama, Islamic Azad University, Iran

    Dr. S.A. Edalatpanah, University of Guilan, Iran

    Dr. Froilan Mobo, Philippine Merchant Marine Academy, Philippines

    Prof. S. Rajesh, Mepco Schlenk Engineering College, Sivakasi

    Prof. Ang Chun Kit, UCSI University, Malaysia

    Prof. Dariusz Jacek Jakobczak, Koszalin University of Technology, Poland

    Dr. Anand Nayyar, Duy Tan University, Vietnam

    Dr. Malka N. Halgamuge, The University of Melbourne, Australia

    Dr. Kar Heng Lee, TBSS CENTER FOR ELECTRICAL AND ELECTRONICS ENGINEERING, Singapore

    Dr. Ajay B Gadicha, Sant Gadge Baba Amravati University, Amravati, India

    Dr. Sérgio Ivan Lopes, Instituto Politécnico de Viana do Castelo, Portugal

    Keynote speaker

    Prof. Farhad Shahnia---Prof. Pham The Bao---Prof. Yanchao Mao

    Murdoch University---Saigon University---Zhengzhou University

    Australia---Viet Nam---China

    Dr. Anand Nayyar---Prof. Panagiotis Papadimitriou

    Duy Tan university---University of Macedonia

    Viet Nam---Greece

    Keep updating

    CALL FOR PAPER

    The topics of interest for submission include, but are not limited to:

    Digital electronics

    Analogue electronics

    Microelectronics

    Integrated circuits

    Optoelectronics

    Embedded systems

    Analog Circuits and Signal Processing

    Bioengineering Circuits and Systems

    Biomedical Circuits and Systems

    Circuit & System Design

    Circuits and Systems for Communications

    Circuit Simulation & Modeling

    Semiconductor Devices and Circuits

    Digital Circuits and Signal Processing

    Device Simulation & Modeling

    Digital Communications

    Electronic Design Automation

    Integrated Circuit and System Design

    Low-Power and Harvesting Techniques

    Low-Power, RF Devices & Circuits

    Linear & Nonlinear Circuits and Systems

    Multimedia Systems and Signal Processing

    Neural Network Circuits and Systems

    Nanoelectronic Circuits

    Photonic and Optoelectronic Circuits

    Power and Energy Circuits and Systems

    Power Electronics and Applications

    RF and Wireless Circuits and Systems

    Sensing and Sensor Networks

    Test and Reliability

    VLSI Systems, Applications and Computer Aided Network Design

    Emerging Technologies

    Information and Communication Engineering

    Artificial Intelligence

    Bioinformatics

    Software Engineering

    VLSI Design and Fabrication

    Photonic Technologies

    Parallel and Distributed Computing

    Data Mining

    Cryptography

    Algorithms and Data Structures

    Graphs and Combinatorics

    E-commerce and E-learning

    Geographical Information Systems (GIS)

    Networking

    Signal Processing

    Embedded System

    Communication and Wireless Systems

    Multimedia Systems and Applications

    Emerging Technologies

    Blockchain

    Internet of Things

    Publication

    *All papers, both invited and contributed,

    will be reviewed by two or three experts from the committees. After peer-review, all accepted papers of ISAIMS 2020 will be published by conference proceedings, and then submit to EI Compendex, Scopus for retrieval.

    *High quality papers will be recommended for publication in SCI journal.

    Participation Types:

    Package A: Only Attendance

    Package B: Abstract Submission+Oral Presentation

    Package C: Abstract Submission+Poster Presentation

    Package D: Full Paper Publicaiton+Oral/Poster Presentation +Attendance

    Note: If you need paper publication and presentation both, please submit full paper.

    If you need to make presentation without publication, please submit abstract only.

    Submission Methods:

    If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEM

    If you choose Package A, B or C, please register via REGISTRATION SYSTEM .

    Registration Fee

    Item---Registration fee (By RMB) ---Registration fee (By US Dollar)

    Publication+Presentation+Attendance---3000RMB/per paper (4 pages)---450 USD/per paper (4 pages)

    Additional Paper Publication---2800RMB/per paper(4 pages)---430 USD/ per paper (4 pages)

    Extra Pages (Begin at Page 5)---300RMB/per extra page---50 USD/ per extra page

    Presentation+Attendance---1500RMB/per person---250USD/per person

    Attendance Only---1200RMB/per person---180 USD / per person

    Attendees without Submission (Groups)---1000RMB/per person(≥ 3 persons)---150 USD / per person(≥ 3 persons)

    Program

    Schedule

    Date---Time---Activities

    Jan. 22(Friday)---13:00-17:00---Registration

    Jan. 23(Saturday)---09:00-12:00---Keynote Session

    Jan. 23(Saturday)---12:00-14:00---Lunch

    Jan. 23(Saturday)---14:00-18:00---Invited Session

    Jan. 23(Saturday)---18:00-19:30---Dinner

    Jan. 24(Sunday)---09:00-18:00---Technical Session

    CONTACT US

    Conference Secretary: Leah Li

    E-mail: contactecieat163.com

    Tel: +86 17737319063 (Wechat)

    QQ: 978640953

    最新动态:(简单的会议新闻通知,必须提供)

    1. Welcome Prof. Panagiotis Papadimitriou from University of Macedonia, Greece join ECIE 2021 as Keynote Speaker!

    2. Welcome Prof. Farhad Shahnia from Murdoch University, Australia join ECIE 2021 as Committee Chair!

    3. ECIE 2021 conference registration system opens now!


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.