ECIE 2021 - International Conference on Electronics, Circuits and Information Engineering(ECIE 2021)
View: 812
Website http://www.confecie.org/ |
Edit Freely
Category Electronics;Circuits;Information Engineering;ECIE 2021;
Deadline: January 15, 2021 | Date: January 22, 2021-January 24, 2021
Venue/Country: Zhengzhou, China, China
Updated: 2020-11-11 16:32:30 (GMT+9)
Call For Papers - CFP
CONFERENCE INFORMATION:Website:http://www.confecie.org/ Conference Date:January 22-24, 2021Venue:Zhengzhou, ChinaSubmission Deadline: Nov. 27, 2020 Indexing:EI Compendex/ ScopusInternational Conference on Electronics, Circuits and information Engineering(ECIE 2021)will be held on January 22-24 in Zhengzhou, China.ECIE2021 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits and information Engineering. Conference topics mainly include, but not are limited to Digital electronics, Analogue Electronics, Microelectronics, Circuit design, Integrated circuits, Optoelectronics, Semiconductor devices, Embedded systems and Information Engineering etc. ECIE 2021 welcome all high-quality research papers and presentations from related research fields.Guest structureConference ChairProf. Farhad ShahniaMurdoch UniversityInternational Organising CommitteesProf. Kamal Kumar Sharma, Lovely Professional University, PunjabDr. Kaichen XU, Osaka Prefecture University, JapanProf. Taraprasanna Dash, Siksha 'O' Anusandhan, IndiaProf. M.Hassaballah, South Valley University, EgyptDr. Michal Hodoň, University of Zilina, SlovakiaDr. Michael Waltl, Vienna University of Technology, AustriaDr. Prabhat Ranjan, Manipal University Jaipur, IndiaDr. Liviu Octavian Mafteiu-Scai, West University of Timisoara, RomaniaDr. Viktor Sverdlov, Vienna University of Technology, AustriaProf. Yanfeng Jiang, Jiangnan University, ChinaProf. Pascal Lorenz, University of Haute Alsace, FranceDr. Shahrizal Jelani, UCSI University, MalaysiaDr. Farzin Shama, Islamic Azad University, IranDr. S.A. Edalatpanah, University of Guilan, IranDr. Froilan Mobo, Philippine Merchant Marine Academy, PhilippinesProf. S. Rajesh, Mepco Schlenk Engineering College, SivakasiProf. Ang Chun Kit, UCSI University, MalaysiaProf. Dariusz Jacek Jakobczak, Koszalin University of Technology, PolandDr. Anand Nayyar, Duy Tan University, VietnamDr. Malka N. Halgamuge, The University of Melbourne, AustraliaDr. Kar Heng Lee, TBSS CENTER FOR ELECTRICAL AND ELECTRONICS ENGINEERING, SingaporeDr. Ajay B Gadicha, Sant Gadge Baba Amravati University, Amravati, IndiaDr. Sérgio Ivan Lopes, Instituto Politécnico de Viana do Castelo, PortugalKeynote speakerProf. Farhad Shahnia---Prof. Pham The Bao---Prof. Yanchao MaoMurdoch University---Saigon University---Zhengzhou UniversityAustralia---Viet Nam---ChinaDr. Anand Nayyar---Prof. Panagiotis PapadimitriouDuy Tan university---University of MacedoniaViet Nam---GreeceKeep updatingCALL FOR PAPERThe topics of interest for submission include, but are not limited to:Digital electronicsAnalogue electronicsMicroelectronicsIntegrated circuitsOptoelectronicsEmbedded systemsAnalog Circuits and Signal ProcessingBioengineering Circuits and SystemsBiomedical Circuits and SystemsCircuit & System DesignCircuits and Systems for CommunicationsCircuit Simulation & ModelingSemiconductor Devices and CircuitsDigital Circuits and Signal ProcessingDevice Simulation & ModelingDigital CommunicationsElectronic Design AutomationIntegrated Circuit and System DesignLow-Power and Harvesting TechniquesLow-Power, RF Devices & CircuitsLinear & Nonlinear Circuits and SystemsMultimedia Systems and Signal ProcessingNeural Network Circuits and SystemsNanoelectronic CircuitsPhotonic and Optoelectronic CircuitsPower and Energy Circuits and SystemsPower Electronics and ApplicationsRF and Wireless Circuits and SystemsSensing and Sensor NetworksTest and ReliabilityVLSI Systems, Applications and Computer Aided Network DesignEmerging TechnologiesInformation and Communication EngineeringArtificial IntelligenceBioinformaticsSoftware EngineeringVLSI Design and FabricationPhotonic TechnologiesParallel and Distributed ComputingData MiningCryptographyAlgorithms and Data StructuresGraphs and CombinatoricsE-commerce and E-learningGeographical Information Systems (GIS)NetworkingSignal ProcessingEmbedded SystemCommunication and Wireless SystemsMultimedia Systems and ApplicationsEmerging TechnologiesBlockchainInternet of Things Publication*All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After peer-review, all accepted papers of ISAIMS 2020 will be published by conference proceedings, and then submit to EI Compendex, Scopus for retrieval.*High quality papers will be recommended for publication in SCI journal. Participation Types:Package A: Only Attendance Package B: Abstract Submission+Oral PresentationPackage C: Abstract Submission+Poster PresentationPackage D: Full Paper Publicaiton+Oral/Poster Presentation +AttendanceNote: If you need paper publication and presentation both, please submit full paper.If you need to make presentation without publication, please submit abstract only.Submission Methods:If you choose Package D, please submit the full paper (word+pdf) to SUBMISSION SYSTEMIf you choose Package A, B or C, please register via REGISTRATION SYSTEM .Registration FeeItem---Registration fee (By RMB) ---Registration fee (By US Dollar) Publication+Presentation+Attendance---3000RMB/per paper (4 pages)---450 USD/per paper (4 pages)Additional Paper Publication---2800RMB/per paper(4 pages)---430 USD/ per paper (4 pages)Extra Pages (Begin at Page 5)---300RMB/per extra page---50 USD/ per extra pagePresentation+Attendance---1500RMB/per person---250USD/per personAttendance Only---1200RMB/per person---180 USD / per personAttendees without Submission (Groups)---1000RMB/per person(≥ 3 persons)---150 USD / per person(≥ 3 persons)ProgramScheduleDate---Time---ActivitiesJan. 22(Friday)---13:00-17:00---Registration Jan. 23(Saturday)---09:00-12:00---Keynote SessionJan. 23(Saturday)---12:00-14:00---LunchJan. 23(Saturday)---14:00-18:00---Invited SessionJan. 23(Saturday)---18:00-19:30---DinnerJan. 24(Sunday)---09:00-18:00---Technical SessionCONTACT USConference Secretary: Leah LiE-mail: contactecie163.comTel: +86 17737319063 (Wechat)QQ: 978640953 最新动态:(简单的会议新闻通知,必须提供)1. Welcome Prof. Panagiotis Papadimitriou from University of Macedonia, Greece join ECIE 2021 as Keynote Speaker!2. Welcome Prof. Farhad Shahnia from Murdoch University, Australia join ECIE 2021 as Committee Chair!3. ECIE 2021 conference registration system opens now!
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.