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    ICEAT 2021 - The International Conference on Electronics Application Technology (ICEAT 2021)

    View: 543

    Website http://iceat.org/ | Edit Freely

    Category Electronics Application Technology

    Deadline: March 25, 2021 | Date: June 11, 2021-June 13, 2021

    Venue/Country: Singapore, Singapore

    Updated: 2021-02-19 16:46:20 (GMT+9)

    Call For Papers - CFP

    Full name: IEEE--2021 The International Conference on Electronics Application Technology (ICEAT 2021)--Ei Compendex, Scopus

    2021 The International Conference on Electronics Application Technology (ICEAT 2021), will be held in Singapore during June 11-13, 2021. ICEAT 2021 aimed at promoting research worldwide and publishes basic and advanced research work from all branches of Electronics Materials, Electrical Engineering, Electronics Systems, Electronics Applications.

    Publication and Indexing:

    Accepted and presented papers in ICEAT 2021 will be published in IEEE Conference Proceedings, which will be included in IEEE Xplore and indexed by Ei Compendex and Scopus.

    Submission ways:

    Please send your full paper or abstract to submission system: http://confsys.iconf.org/submission/iceat2021

    Call for Papers:

    ●Antennas and Microwaves

    ●Electronics Materials and Devices

    ●Communication and Networks

    ●Power and Electrical Engineering

    For more topics, please visit: http://iceat.org/cfp.html

    Conference secretary:

    Ms. Amber Lin: iceat@sciei.org

    Tell: +86 182-0777-7775 (Chinese&English)


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.