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    ICMEE 2021 - 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2021)

    View: 470

    Website http://icmee.org/ | Edit Freely

    Category Mechanical and Electronics Engineering

    Deadline: November 25, 2020 | Date: May 10, 2021-May 12, 2021

    Venue/Country: Osaka, Japan

    Updated: 2020-08-24 18:13:18 (GMT+9)

    Call For Papers - CFP

    2021 The 6th International Conference on Mechanical and Electronics Engineering is to be held in (Osaka International Convention Center, Osaka, Japan) during (May 10-12, 2021)-

    ICMEE 2021 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.

    Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc

    { History }

    The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6

    The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6

    The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6

    The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6

    The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31

    { Submission Method }

    1. Send your manuscript directly to conference official email: icmee@outlook.com

    2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2021

    { Conference Scope }

    The works that will be presented and published at conference will focus on, but are not limited to, the following topics:

    Mechanical Engineering

    Acoustics and Noise Control Marine System Design

    Aerodynamics Material Engineering

    Applied Mechanics Material Science and Processing

    Automation, Mechatronics and Robotics Mechanical Design

    Automobiles Mechanical Power Engineering

    Automotive Engineering Mechatronics

    ...etc

    { Venue }

    Osaka International Convention Center, Osaka, Japan

    Add: 5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN

    { Contact }

    Ms. Serene Lo

    icmee@outlook.com

    +86-028-83208181


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.