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    AEMCSE 2021 - 【IEEE Xplore、EI、Scopus】2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2021)

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    Website http://aemcse.org | Edit Freely

    Category (I) Computers Engineering;(II) Software Engineering;(III) Advanced Electronic Materials

    Deadline: January 05, 2021 | Date: March 26, 2021-March 28, 2021

    Venue/Country: Changsha, China, China

    Updated: 2020-10-28 18:57:38 (GMT+9)

    Call For Papers - CFP

    【IEEE Xplore、EI、Scopus】2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2021)

    Website URL:http://aemcse.org

    Start Date / End Date: March 26-28, 2021

    Location: Changsha, China

    Official Email:aemcse2021@163.com

    1.About the conference:

    The 2021 4th International Conference on Advanced Electronic Materials, Computers and Software Engineering(AEMCSE 2021) will be held in Changsha, China during March 26-28, 2021.

    2.Publication

    All accepted papers of AEMCSE 2021 will be published in the conference proceedings by IEEE CS CPS (Conference Publishing Services), which will be submitted to IEEE Xplore, EI Compendex, Scopus for indexing.

    3.Important Dates

    Notification Date: 1-2 weeks after submission

    Conference Date:March 26-28, 2021

    4.Call For Papers

    Other related topics (http://aemcse.org/a/Call_For_Papers/)

    (I) Computers Engineering

    Operating Systems

    Quantum Computing Theory

    Scientific Computing

    Computer Programming

    Database Management Systems

    Evolutionary Computation

    Logic Programming

    Machine Learning

    Software Engineering

    Symbolic Mathematics

    Digital Signal Processing (DSP)

    Advanced Adaptive Signal Processing

    Computer Vision & VR

    Multimedia & Human-computer Interaction

    AI & Neural Networks

    Communication Signal processing

    SP for Internet and Wireless Communications

    (II) Software Engineering

    Software Architecture

    Software design method

    Software testing technology

    Automated software design and synthesis

    Component-based software engineering

    Computer-supported collaborative work

    Programming language and software engineering

    Computer network

    Information and communication security

    Computer Graphics and Human Machine Interaction

    Multimedia technology application

    Artificial intelligence and recognition

    Embedded software and applications

    Automatic control

    Distributed Computing and Grid Computing

    Cloud computing technology

    Storage technology

    Big data analysis and processing

    (III) Advanced Electronic Materials

    Dielectric material

    Semiconductor material

    Piezoelectric and ferroelectric materials

    Conductive metals and their alloys

    Magnetic material

    Optoelectronic materials

    Electromagnetic shielding materials

    5.Contact Us

    Ms. Huang

    QQ: 2152116918

    Wechat: 15819926753

    Tel: +86-15819926753

    Mr. Zheng

    QQ: 2556533101

    Wechat: 18420103136

    Tel: +86-18420103136


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.