ICID 2020 - 2020 International Conference on Intelligent Design (ICID 2020)
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Category 2020 International Conference on Intelligent Design ;ICID 2020
Deadline: December 06, 2020 | Date: December 11, 2020-December 13, 2020
Venue/Country: Xi’an, Shaanxi, China, China
Updated: 2020-11-20 12:38:08 (GMT+9)
Call For Papers - CFP
Website URL : http://www.icid2020.org/Start Date / End Date: Dec. 11-13, 2020Location: Xi’an, Shaanxi, ChinaSubmission Deadline: Dec. 06, 2020About the Conference:Supervisor: China Innovative Design Industry Strategic AllianceSupportor: Xi’an Science and Technology BureauOrganizers: Silk Road Innovative Design Industry Alliance, Management Committee of Xi’an Beilin University-based Innovation Industrial District, Xi’an Design UnionCo-organizers: Xi’an Design Union, AEIC Academic Exchange Information Center, Institute of Modern Industrial Design, Zhejiang University, Xi'an Jiaotong University, Northwestern Polytechnical University, Northwest A&F University, Xidian University, Chang'an University, Xi’an Technological University, Xi’an University of Technology, Xi’an University of Architecture and Technology, Shaanxi University of Science & Technology, Xi’an University of Science and Technology, Xi’an Polytechnic University, Xi’an Shiyou University, Shaanxi Fashion Engineering University, Lanzhou University of Technology, Shenzhen Technology University, Wuhan University of Science and Technology, Xihua University, University of Science and Technology Liaoning, Shenyang Jianzhu University, Shaanxi Industrial Design and Research Institute Co. LTD2020 International Conference on Intelligent Design (ICID 2020)is organized by Silk Road Innovation Industry Alliance, Management Committee of Xi'an Beilin University-based Innovation Industrial District and Xi'an Design Union, supported by Xi'an Science and Technology Bureau. ICID 2020 will be held on Dec 11-13, 2020 in Xi'an, China. ICID 2020 is to bring together innovative academics and industrial experts in the field of electromechanical, industry, environment, architecture and intelligent design to a common forum. The primary goal of the conference is to promote research and developmental activities in environment, industry, architecture, electromechanical. And another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Intelligent Design and related areas.Publication:All accepted full papers will be published by IEEE Computer Society (Conference Publishing Services) and will be submitted to IEEE Xplore, EI Compendex, Scopus, Inspec for indexing.Important Dates:Paper Submission:Dec. 06, 2020Notification of Acceptance:About 1-2 weeks after the submissionRegistration Deadline: Dec. 09, 2020Conference Dates: Dec. 11-13, 2020Submission Guides:1.The submitted papers must not be under consideration elsewhere.2.All papers to be considered by ICID 2020 can be submitted to contacticid2020.org.3. Please submit the full paper, if presentation and publication are both needed.4. Please submit the abstract only, if you just want to make oral presentation.5. Should you have any questions, please contact us at contacticid2020.orgCall For Papers:Key Words:1. Intelligent Electromechanical Design2. Intelligent Industrial Design3. Environmental Design4. Architectural DesignMore topics, please visit: http://www.icid2020.org/PFnUVFARRegistration:For the publication on conference proceedings: Items ---Fee (By RMB) Regular Registration (4 pages)---3000 RMB / per paperExtra Pages (Begin at Page 5)---300 RMB / per extra pageAttendees without Papers---1200 RMB / per personAttendees without Papers (Groups ≥ 3 people)---1000 RMB / per person (≥ 3 people)Contact Us:Conference Secretary: Ms. HuangE-mail: contacticid2020.orgTel:(+86)13922150841 (cellphone)WeChat: keomszhuQQ: 1623956325AEIC Website: www.keoaeic.org
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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