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    ICID 2020 - 2020 International Conference on Intelligent Design (ICID 2020)

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    Category 2020 International Conference on Intelligent Design ;ICID 2020

    Deadline: December 06, 2020 | Date: December 11, 2020-December 13, 2020

    Venue/Country: Xi’an, Shaanxi, China, China

    Updated: 2020-11-20 12:38:08 (GMT+9)

    Call For Papers - CFP

    Website URL :

    Start Date / End Date: Dec. 11-13, 2020

    Location: Xi’an, Shaanxi, China

    Submission Deadline: Dec. 06, 2020

    About the Conference:

    Supervisor: China Innovative Design Industry Strategic Alliance

    Supportor: Xi’an Science and Technology Bureau

    Organizers: Silk Road Innovative Design Industry Alliance, Management Committee of Xi’an Beilin University-based Innovation Industrial District, Xi’an Design Union

    Co-organizers: Xi’an Design Union, AEIC Academic Exchange Information Center, Institute of Modern Industrial Design, Zhejiang University, Xi'an Jiaotong University, Northwestern Polytechnical University, Northwest A&F University, Xidian University, Chang'an University, Xi’an Technological University, Xi’an University of Technology, Xi’an University of Architecture and Technology, Shaanxi University of Science & Technology, Xi’an University of Science and Technology, Xi’an Polytechnic University, Xi’an Shiyou University, Shaanxi Fashion Engineering University, Lanzhou University of Technology, Shenzhen Technology University, Wuhan University of Science and Technology, Xihua University, University of Science and Technology Liaoning, Shenyang Jianzhu University, Shaanxi Industrial Design and Research Institute Co. LTD

    2020 International Conference on Intelligent Design (ICID 2020)is organized by Silk Road Innovation Industry Alliance, Management Committee of Xi'an Beilin University-based Innovation Industrial District and Xi'an Design Union, supported by Xi'an Science and Technology Bureau. ICID 2020 will be held on Dec 11-13, 2020 in Xi'an, China.

    ICID 2020 is to bring together innovative academics and industrial experts in the field of electromechanical, industry, environment, architecture and intelligent design to a common forum. The primary goal of the conference is to promote research and developmental activities in environment, industry, architecture, electromechanical. And another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in Intelligent Design and related areas.


    All accepted full papers will be published by IEEE Computer Society (Conference Publishing Services) and will be submitted to IEEE Xplore, EI Compendex, Scopus, Inspec for indexing.

    Important Dates:

    Paper Submission:Dec. 06, 2020

    Notification of Acceptance:About 1-2 weeks after the submission

    Registration Deadline: Dec. 09, 2020

    Conference Dates: Dec. 11-13, 2020

    Submission Guides:

    1.The submitted papers must not be under consideration elsewhere.

    2.All papers to be considered by ICID 2020 can be submitted to

    3. Please submit the full paper, if presentation and publication are both needed.

    4. Please submit the abstract only, if you just want to make oral presentation.

    5. Should you have any questions, please contact us at

    Call For Papers:

    Key Words:

    1. Intelligent Electromechanical Design

    2. Intelligent Industrial Design

    3. Environmental Design

    4. Architectural Design

    More topics, please visit:


    For the publication on conference proceedings:

    Items ---Fee (By RMB)

    Regular Registration (4 pages)---3000 RMB / per paper

    Extra Pages (Begin at Page 5)---300 RMB / per extra page

    Attendees without Papers---1200 RMB / per person

    Attendees without Papers (Groups ≥ 3 people)---1000 RMB / per person (≥ 3 people)

    Contact Us:

    Conference Secretary: Ms. Huang


    Tel:(+86)13922150841 (cellphone)

    WeChat: keomszhu

    QQ: 1623956325

    AEIC Website:

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.