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    ICBEI 2020 - 2020 International Conference on Building Electrical and Intelligent(ICBEI2020)

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    Website http://www.icbei.org/ | Want to Edit it Edit Freely

    Category 2020 International Conference on Building Electrical;Intelligent;ICBEI2020

    Deadline: July 01, 2020 | Date: July 02, 2020-July 04, 2020

    Venue/Country: Dali, China

    Updated: 2020-03-04 11:30:13 (GMT+9)

    Call For Papers - CFP

    Conference Title: 2020 International Conference on Building Electrical and Intelligent(ICBEI 2020)

    Website URL : http://www.icbei.org/

    Start Date / End Date: July 17-19, 2020

    Location: Dali, China

    Submission Deadline: Visit the website for more details

    1. About the conference:

    2020 International Conference on Building Electrical and Intelligent(ICBEI 2020)will be held on July 17-19 in Dali, China. ICBEI 2020 is to bring together innovative academics and industrial experts in the field of Building Electrical and Intelligent to a common forum. The primary goal of the conference is to promote research and developmental activities in Building Electrical and Intelligent and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world.

    We warmly invite you to participate in ICBEI 2020 and look forward to seeing you in Dali!

    2. Publication

    【EI】

    JPCS.png

    All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICBEI 2020 will be published by Journal of Physics: Conference Series (JPCS) and will be submitted to EI、Scopus for indexing.

    *Template Download:click

    【SCI journal】

    SCI journal(Submission with notes of conference acronyms will enjoy priority in review and acceptance.)

    Excellent papers will be recommended directly to the following or other suitable SCI journals

    Journal 1:Electrical Engineering(ISSN: 0948-7921, IF=1.296, regular issue)

    Journal 2:Pattern Analysis and Applications (ISSN: 1433-7541, IF=1.41, regular issue)

    Journal 3:Computer Communications (ISSN: 0140-3664, IF=2.766, special issue)

    Submission should be in WORD(.doc)format only, and specified templates will be given after evaluation.

    Online submission 【AIS online submission】

    For more information about SCI papers and journals, please feel free to contact Editor Li(WeChat/Mobile phone): 18127812811/ Editor Lin(WeChat/Mobile phone): 13922157504.

    For more information and detail please visit AEIC homepage. Other services of publication and translation please click.

    3. Important Dates

    Paper Submission:Visit the website for more details

    Notification of Acceptance:About 1-2 weeks after the submission

    Registration Deadline: July 15, 2020

    Conference Dates: July 17-19, 2020

    4. Submission Guides

    2020 International Conference on Building Electrical and Intelligent(ICBEI 2020)accepts original and unpublished papers.

    A. Full Paper (for Presentation and Publication)

    Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings.

    B. Abstract(Presentation only)

    Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.

    C. Submission Methods

    1.The submitted papers must not be under consideration elsewhere.

    2.Please send the full paper(word+pdf) to SUBMISSION SYSTEM

    3.Please submit the full paper, if presentation and publication are both needed.

    4.Please submit the abstract only, if you just want to make presentations.

    Note:

    1)Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.

    2)All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.

    5. Call For Papers

    1. Application of Internet of things in smart home

    2. Building power supply and distribution technology

    3. Electrical lighting technology

    4. Heating, gas supply, ventilation and air conditioning works

    5. Water supply and drainage science and Engineering

    Click on more topics

    6. Registration

    Items --Fee(RMB)--Registration fee (By US Dollar)

    Regular Registration(6 pages)--3000 RMB/per paper--450 USD/per paper

    Additional Paper(6 pages)--2800 RMB/per paper--430 USD/ per paper

    Extra Pages (Begin at Page 7)--300 RMB/per extra page--50 USD/ per extra page

    Attendees without Papers--1200 RMB/per person--230 USD / per person

    Attendees without Papers (Groups)--1000 RMB/per person(≥ 3 persons)--200 USD / per person(≥ 3 persons)

    Purchase Extra Journal--500 RMB/book--75 USD/book

    7. Schedule

    July 17--13:00-17:00--Registration

    July 18--09:00-12:00--Speeches of Keynote Speakers

    July 18--12:00-14:00--Lunch

    July 18--14:00-17:30--Oral Presentations

    July 18--18:00-19:30--Banquet

    July 19--09:00-18:00--Academic Investigation

    8. Contact Us

    Conference Secretary: Carrie Liu

    E-mail: contactaticbei.org

    Tel: +86-13902289287(Wechat)

    QQ: 669768471

    AEIC website:www.keoaeic.org


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.