ICMTT 2021 - The 6th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2021)
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Website http://www.seminarjan.org/conference/ICMTT2021/ |
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Category Microwave; Terahertz Technology
Deadline: December 05, 2020 | Date: January 05, 2021-January 07, 2021
Venue/Country: Hainan, China
Updated: 2020-03-01 20:33:49 (GMT+9)
Call For Papers - CFP
The 6th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2021)Conference Date: January 5-7, 2021Conference Venue: Sanya, ChinaWebsite: http://www.seminarjan.org/conference/ICMTT2021/Online Registration System: http://www.seminarjan.org/RegistrationSubmission/default.aspx?ConferenceID=1316Email: ic_vicky163.comThe 6th Int'l Conference on Microwave and Terahertz Technology (ICMTT 2021) will be held in Sanya,China during January 5-7, 2021. This conference will cover issues on microwave and terahertz technology. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.If you wish to serve the conference as an invited speaker, please send email to us with your CV. We'll contact with you asap.Publication and PresentationPublication: Open Access Journal, please contact us for detailed informationIndex: CNKI and Google Scholar Note: If you want to present your research results but do NOT wish to publish a paper, you may simply submit an Abstract to our Registration System.Contact UsEmail: ic_vicky163.comTel: +86 132 6470 2250QQ: 1349406763WeChat: 3025797047Twitter: conf_CommitteeAttendance Methods1.Submit full paper (Regular Attendance+Paper Publication+Presentation)You are welcome to submit full paper, all the accepted papers will be published by Open access journal.2. Submit abstract (Regular Attendance+Abstract+Presentation)3. Regular Attendance (No Submission Required)Conference TopicsMicrowave Field and TechniquesField Analysis and Guided WavesFrequency-Domain EM Analysis TechniquesTime-Domain EM Analysis TechniquesCAD Algorithms and TechniquesLinear Device ModelingNonlinear Device ModelingNonlinear Circuit and System SimulationMicrowave Passive ComponentsTransmission Line ElementsPassive Circuit ElementsPlanar Passive Filters and MultiplexersNon-planar Passive Filters and MultiplexersActive, Tunable and Integrated FiltersFerroelectric, Ferrite and Acoustic Wave ComponentsMEMS Components and TechnologiesMicrowave Active ComponentsSemiconductor Devices and Monolithic ICsSignal GenerationFrequency Conversion and ControlHF, VHF and UHF Technologies and ApplicationsPower Amplifier Devices and CircuitsHigh-Power AmplifiersLow Noise Components and ReceiversMm-Wave and THz Components and TechnologiesMicrowave Systems and ApplicationsMicrowave PhotonicsMixed Mode and Digital Signal Processing Circuits and SystemsPackaging, Interconnects, MCMs and IntegrationInstrumentation and Measurement TechniquesBiological Effects and Medical ApplicationsArrays as Antennas and Power CombinersRadar and Broadband Communication SystemsWireless and Cellular Communication SystemsSensors and Sensor SystemsRFID TechnologiesHigh Power Microwave Industrial ApplicationsEmerging Technical Areas of MicrowaveRF NanotechnologyWireless Power TransmissionNew Technologies and ApplicationsInnovative SystemsMicrowave/RF Devices for Wireless Health Care ApplicationsTerahertz Theory and TechnologyTerahertz Devices: Electronics/Photonics/PlasmonicsTerahertz Generation, Propagation, and InteractionPassive Components and Materials Issues in TerahertzTerahertz ImagingTerahertz Sources, Detectors and ReceiversTerahertz System Architectures and Distributed NetworksTerahertz DiagnosticsTerahertz NanoelectronicsTerahertz SpectroscopyTerahertz SystemsAdvanced Materials and Concepts (E.G., Metamaterials, Memristor)Novel Concepts (E.G., Plasmonic THz, Quantum Cascade Lasers)Terahertz to Optical Metamaterials, Assemblies, and SystemsNew Frontiers and Recent Breakthroughs in Terahertz ResearchNovel Applications of TerahertzVLSI Trustworthiness and Inspection - Counterfeit IC DetectionIndustrial InspectionSecurity and MilitaryBiomedicalInformation Processing and ComputingElectronics/Information/Communication SystemsIntegration of Advanced Materials with Conventional Devices and Systems
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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