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TSP 2020 - 2020 43rd International Conference on Telecommunications and Signal Processing (TSP)

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Website http://tsp.vutbr.cz/ | Edit Freely

Category Information Systems; Network Services; Network Technologies; Telecommunication Systems; Modelling, Simulation and Measurement; Analog Signal Processing; Audio, Speech and Language Processing; Biomedical Signal Processing; Digital Signal Processing; Image and Video Signal Processing; Bioimpedance; Fractional Calculus; 5G; 6G; IoT

Deadline: March 15, 2020 | Date: July 07, 2020-July 09, 2020

Venue/Country: Milan, Italy

Updated: 2020-02-17 01:22:58 (GMT+9)

Call For Papers - CFP

2020 43rd International Conference on Telecommunications and Signal Processing (TSP)

July 7-9, 2020, Milan, Italy

Web: http://tsp.vutbr.cz/

Full Paper Submission: March 9, 2020 (extended deadline, 23 extra days)

Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):

• Special Issue Selected Papers from the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) of an Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 2.217)

• International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals

GENERAL INFORMATION:

You are kindly invited to participate in the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 7-9, 2020, in Milan, Italy. The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.

OPENING KEYNOTE SPEAKER:

We are glad to announce the following Opening Keynote Speaker:

• Prof. Dr. Ian F. Akyildiz, IEEE & ACM Fellow – Ken Byers Chair Professor in Telecommunications, Georgia Institute of Technology, USA (http://bwn.ece.gatech.edu/IFA/)

The next generation of wireless communication networks, or 6G, will fulfill a fully connected world and provide ubiquitous wireless connectivity for all. Transformative solutions are expected to drive the surge to accommodating a drastically growing number of intelligent devices and services.

Major technological breakthroughs to achieve the goals in 6G include:

(i) a network operating at the Terahertz (THz) bandwidth much wider spectrum resources,

(ii) the Internet of NanoThings,

(iii) the Internet of BioNanoThings,

(iv) cell-free massive MIMO communication networks to accommodate more users,

(v) intelligent communication environments that enable a wireless propagation environment with active signal transmission and reception,

(vi) an all-spectrum reconfigurable front-end for dynamic spectrum access,

(vii) quantum communications for extremely fast computation and processing of parallel data streams,

(viii) pervasive artificial intelligence, (ix) ambient backscatter communications for energy savings,

(x) the Internet of Space Things enabled by CubeSats, and

(xi) network automation for error-free network operations.

In this roadmap talk, use cases for these enabling techniques as well as recent advancements on related topics are highlighted, and open problems with possible solutions are discussed, followed by a development timeline outlining the worldwide efforts in the realization of 6G.

TOPICS:

TSP 2020 has opened Call for Full Paper Submissions with an EXTENDED deadline set for March 9, 2020 (23 extra days). We look forward to your innovative contributions in any of the following areas:

AREA 1: Telecommunications

1. Information Systems

2. Network Services

3. Network Technologies

4. Telecommunication Systems

5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

6. Analog Signal Processing

7. Audio, Speech and Language Processing

8. Biomedical Signal Processing

9. Digital Signal Processing

10. Image and Video Signal Processing

For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .

WORKSHOPS AND SPECIAL SESSIONS:

Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2020 Conference. The following Workshop and Special Sessions were approved so far:

• WS1: 2nd International Workshop on Signal Processing Techniques for Ground Penetrating Radar Applications (SPT4GPRA) organized by Dr. Fabio Tosti, PhD, Prof. Dr. Amir M. Alani, PhD (both University of West London (UWL), London, UK), Prof. Dr. Evert Slob, PhD (Delft University of Technology, Delft, The Netherlands), and Dr. Francesco Soldovieri, PhD (National Research Council, Naples, Italy)

• WS2: International Workshop on Advanced Network Technologies and IoT organized by Assoc. Prof. Jorge Crichigno (University of South Carolina, U.S.A.), Assoc. Prof. Gautam Srivastava (Brandon University, Canada), and Prof. Dr. Neset Hikmet (University of South Carolina, U.S.A.)

• SS1: Special Session on Multimodal Signal Processing and Classification organized by Prof. Dr. Corneliu Burileanu and Assoc. Prof. Dr. Anamaria Radoi (both with the University Politehnica of Bucharest, Romania)

• SS2. Special Session on Photonic Fibre Networks and their Applications (Theory, Design, Modelling, Simulations, Operation, Trials) organized by Dr. Josef Vojtech (CESNET a.l.e., Czech Republic) and Dr. Tomas Horvath (CESNET a.l.e. and Brno University of Technology, Czech Republic)

Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.

ORGANIZERS:

The TSP 2020 is IEEE technically co-sponsored Conference organized in cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, Czech Republic

• Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary

• Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic

• Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey

• Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey

• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia

• Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey

• National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan

• Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan

• Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic

• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain

• Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria

• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France

• University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)

• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia

• University of Patras, Physics Department, Patras, Greece

• VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic

• West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

COMMITTEES:

• Honorary Chair - Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder

• General Co-Chair - Norbert Herencsár, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member

• General Co-Chair - Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, IEEE Senior Member

• Publications & Student Paper Contest Chair - Jiří Hošek, Brno University of Technology, Czech Republic – IEEE Member

• Publicity & Social Media Chair - Aslihan Kartci, Brno University of Technology, Czech Republic – IEEE Member

• Finance Chair - Nándor Mátrai, Asszisztencia Congress Bureau, Hungary – Managing Director

• Registrations Chair - Csilla Fülöp, Asszisztencia Congress Bureau, Hungary – Project Manager

Steering Committee:

• Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE Senior Member

• Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataró, Tecnocampus, Spain – Full Professor, Dean

• Izzet Cem Göknar, Işik University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow

• Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member

• Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor

• Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member

• Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member

• Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member

• Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member

• Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member

• Jiří Mišurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair

• Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow

• Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member

• Serdar Özoguz, Istanbul Technical University, Turkey – Full Professor, Associate Chair

• Jakub Pęksiński, West Pomeranian University of Technology, Poland

• Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member

• Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member

• Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member

• Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow

• Zdeněk Smékal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member

• Attila Vidács, Budapest University of Technology and Economics, Hungary – Deputy Head of Department

• Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member

• Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member

IMPORTANT DATES:

• Full Paper Submissions: March 15, 2020 (extended deadline)

• Notification of Paper Acceptance: April 15, 2020

• Final Paper Submission: April 30, 2020

• Authors' Early Registration and Payment: May 10, 2020

• Authors' Late Registration and Payment: May 20, 2020

• Conference: July 7-9, 2020

CONTACTS:

Web: http://tsp.vutbr.cz/

E-mail: tsp@feec.vutbr.cz

Follow us on:

- Facebook https://www.facebook.com/tspconf/

- Twitter https://twitter.com/tspconf/

TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference.


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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