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    ICAMMCE 2020 - The 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020)

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    Website http://www.icammce.com/ | Edit Freely

    Category The 2020 5th International Conference on Advances in Materials, Mechatronics ; Civil Engineering ;ICAMMCE2020

    Deadline: March 01, 2020 | Date: March 02, 2020-March 04, 2020

    Venue/Country: Suzhou, China

    Updated: 2019-12-05 15:43:52 (GMT+9)

    Call For Papers - CFP

    Website URL: http://www.icammce.com/

    Start Date / End Date: March 20-22, 2020

    Location: Suzhou, China

    Submission Deadline: February 5, 2020

    1. About the conference:

    The 2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020) will be held on March 20-22, 2020 in Suzhou, China. ICAMMCE2020 is Organized by AEIC Academic Exchange Information Centre. ICAMMCE 2020 is to bring together innovative academics and industrial experts in the field of materials, mechatronics and civil engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in materials, mechatronics and civil engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in materials, mechatronics and civil engineering and related.

    2. Publication

    All accepted full papers will be published in IOP Conference Series: Materials Science and Engineering (MSE)(ISSN:1757-8981) and it will be submitted to EI Compendex, Scopus for indexing.

    2)SCI Journal(Papers must not be less than 10 pages in length and should be submitted to service@keoaeic.org, and noted SCI-ICAMMCE2020.)

    (1) Advances in Civil Engineering(ISSN: 1687-8086, IF=1.104)

    (2) KSCE Journal of Civil Engineering(ISSN:1976-3808, IF=1.428)

    (3) Journal of Materials Science: Materials in Electronics(ISSN: 2005-4602, IF=1.779)

    * SCI Secretary: Ms. Huang-Tel/WeChat 13922157854

    * SCI Template: Template-SCI-EN.doc

    3. Important Dates

    Submission Deadline:February 5, 2020

    Notification Date:About 1-2 week after the submission

    Conference Date:March 20-22, 2020

    4. Submission Guides

    2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE2020).

    Download:

    Manuscript Template | 文章模板

    Please submit your papers as the following instructions:

    1. Please send the full paper & abstract to SUBMISSION SYSTEM

    2. Manuscript length should be within 4 pages

    (authors will be charged extra 50 USD/page if the manuscript length is more than 4 pages)

    5. Call For Papers

    2020 5th International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2020) aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Materials, Mechatronics and Civil Engineering.

    The topics of interest for submission include, but are not limited to:

    1. Materials Science and Materials Processing Engineering

    (1)Materials of Lighting Source

    (2)Semi-conductor Materials

    (3)Insulating Materials

    (4)Electronic Materials

    (5)Non-ferrous Metal Material

    (6)Iron and Steel

    (7)Composites

    (8)Micro / Nano Materials

    (9)Ceramic

    (11)Optical/Electronic/Magnetic Materials

    (12)New Functional Materials

    (13)Building Materials and Environmentally Friendly Materials New Energy Materials

    (14)Environmental Friendly Materials

    (15)Earthquake Materials and Design

    (16)Biomaterials

    (17)Smart/Intelligent Materials/Intelligent Systems

    (18)Polymeric Materials

    (19)Thin Films

    (20)Corrosion of Materials and Surface Treatment Technology

    (21)Mechanical Behavior & Fracture

    (21)Tooling Testing and Evaluation of Materials

    (22)Research and Development of Composite Materials

    (23)Research and Development of New materials

    (24)New materials, New Technology and New Products

    2. Electronics Engineering

    (1)3D Semiconductor Device Technology

    (2)Adaptive Signal Processing

    (3)Advanced Electromagnetics

    (4)Artificial Intelligence

    (5)Component Technology of MEMS

    (6)Compound Semiconductor Physics and Devices

    (7)Computer Engineering

    (8)Device Electronics for I.C

    (9)Electronics System-Level Based Design

    (10)Electronics & Nano Electronics

    (11)Electronics-Medical Electronics

    (12)Epitaxy and Light-emitting Diodes

    (13)Fiber Optics and Fiber Devices

    (14)Giznt Area Microelectronics

    (15)Intelligent Transportation Systems

    (16)Integrated Optics

    (17)Medicine and Biology Applications

    (18)Micro/Nano Systems and Networks

    (19)Mixed Signal Circuits

    (20)Mobile Computing

    (21)Mobile Robotics

    (22)Multimedia Services and Technologies

    (23)Networks Design, Protocols and Management

    (24)Optical Electronic Devices & Photonics

    (25)Radio-Frequency Integrated Circuits

    (26)Signal & Image Processing

    (27)VLSI Testing and Design for Testability

    3. Architecture Design

    (1)Architectural Design and its Theory

    (2)Mapping and GIS

    (3)Measurement Engineering

    (4)Computing Mechanics

    (5)Construction Technology

    (6)Computer Simulation and CAD / CAE

    (7)Building Technology Science

    (8)Urban Planning and Design

    (9)Landscape Design

    (10)Building Environment and Equipment Engineering

    (11)Eco-buildings

    (12)Project Management

    (13)Quality Engineering Supervision and Control

    (14)Engineering Management

    4. Civil Engineering and Construction Technology

    (1)Structural Engineering

    (2)Structural Monitoring and Control

    (3)Structural Repair, Transformation and Reinforcement

    (4)Structural Reliability and Durability

    (5)Geotechnics

    (6)Geological Engineering

    (7)Tunnel, Subway and Underground Facilities

    (8)Earthquake Engineering

    (9)Water Supply and Drainage

    (10)Coastal Engineering

    (11)Heating, Gas Supply, Ventilation and Air Conditioning Works

    (12)Disaster Prevention and Mitigation

    5. Mechanical and Electrical Engineering and Construction Machinery

    (1)Mechanical Manufacturing Process and Equipment

    (2)Mechanical Manufacturing Automation

    (3)Mechanical History

    (4)Mechanical Dcience

    (5)Mechanical Design

    (6)Tool Technology

    (7)Machine tool Technology

    (8)Fluid Drive and Control

    (9)Electronic Science and Engineering

    (10)Industrial Electronics and Automation

    (11)Telecommunications Services and Applications

    6. Other Related Topics

    6. Registration

    ItemsRegistration fee (By US Dollar)

    Regular Registration (4 pages)450 USD/per paper

    Additional Paper (Students)430 USD/ per paper

    Extra Pages (Begin at Page 5)50 USD/ per extra page

    Attendees without Papers180 USD / per person

    Purchase Extra Journal(加购论文集)---75 USD/book

    7. Schedule

    DateTimeActivity

    March 20, 202013:00-17:00Registration

    March 21, 202009:00-12:00Keynote Speech

    12:00-14:00Lunch Time

    14:00-17:30Oral Speech

    18:00-19:30Banquet

    March 22, 202009:00-18:00Academic

    Investigation

    8. Contact Us

    Conference Secretary: Yandrin Chan

    E-mail: ICAMMCE@163.com

    Tel: +86-13422186485

    WeChat: 13422186485

    Yandrin Chan WeChat qr code:


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.