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    IWODA 2020 - 2020 2nd International Workshop on Design Automation (IWoDA 2020)

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    Website http://www.iwoda.org/ | Edit Freely

    Category Design Automation

    Deadline: November 30, 2020 | Date: December 26, 2020-December 28, 2020

    Venue/Country: Beijing, China, China

    Updated: 2020-10-03 21:37:26 (GMT+9)

    Call For Papers - CFP

    Due to health concerns and associated travel restrictions being put in place in view of the COVID-19 coronavirus,The organizing committee of IWoDA 2020 has made to decision to change IWoDA 2020 to an online conference during same dates on December 26-28, 2020. The conference was originally scheduled to be held at Beijing, China. Please contact iwoda@hksra.org for online presentation registration and fees.

    ★2020 2nd International Workshop on Design Automation (IWoDA 2020)-- Ei Compendex & Scopus—Call for papers

    |Conference Date:December 26-28, 2020|Website: http://www.iwoda.org/

    ★IWoDA 2020 presents researchers, engineers, and academics with an unprecedented opportunity to associate and interact with some of the foremost experts in the field of Design Automation from around the globe. IWoDA 2020 aims to be the must-visit conference of the year for the field, and will be the ideal forum for the exchange of ideas and innovations that promise to change the face of the industry. For researchers, an engineers, or industry professionals, this conference could mark an important point in your career. 

    ★Publication and Indexing

    All accepted papers will be published in the digital conference proceedings which will send to be indexed by all major citation databases such as Ei Compendex, Scopus, Google Scholar, Cambridge Scientific Abstracts (CSA), Inspec, SCImago Journal & Country Rank (SJR), EBSCO, CrossRef, Thomson Reuters (WoS), etc.

    A selection of papers will be recommended to be published in journals.

    ★Keynote Speakers

    Prof. Ramesh K. Agarwal, Washington University in St. Louis, USA

    Prof. Leonid Fridman, National Autonomous University of Mexico (UNAM), Mexico

    Prof.Francesco Bullo, University of California, Santa Barbara, USA

    ★Call for papers(For more information, please click the official website: http://www.iwoda.org/cfp.html)

    The topics of interest include, but are not limited to:

    2D, 3D on-chip power delivery, network analysis and optimization

    Hardware and Software co-design, co-simulation and co-verification

    Advanced multimedia application

    Hardware for large-scale data analytics and processing

    Analog and mixed-signal modeling and simulation techniques

    Hardware Security

    Analog and mixed-signal RF synthesis

    High-frequency electromagnetic simulation of circuit

    Analog and mixed-signal RF test

    High-level synthesis tool and methodology

    Analog Design, Simulation,Verification and Test

    Human-computer interface

    Analog layout, verification and simulation techniques

    In-Package and On-Chip Communication

    Analysis and optimization

    Intellectual property (IP) core and platform-based SoC design

    Architectural low-power design technique

    Inter and intra -chip interconnect, network and interface

    Architecture, tool and methodology for secure hardware

    Interconnect planning and synthesis

    ★Paper Submission

    1. PDF version submit via CMT:https://cmt3.research.microsoft.com/IWODA2020

    2.Submit Via email directly to: iwoda@hksra.org

    ★CONTACT US

    Ms. Carina M.T Chan

    Email: iwoda@hksra.org

    Website:http://www.iwoda.org/


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.