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ICDEPI 2020 - 4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)

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Category Design Engineering ;Production Innovation ;Design Education

Deadline: March 25, 2020 | Date: July 09, 2020-July 11, 2020

Venue/Country: Kuala Lumpur, Malaysia, Malaysia

Updated: 2019-12-26 10:45:35 (GMT+9)

Call For Papers - CFP

Call for Papers

4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)

July, 9-11, 2020/Kuala Lumpur, Malaysia


4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Kuala Lumpur, Malaysia from July 9 to 11, 2020!

The conference is an international forum for the presentation of technological advances and research results in the fields of design engineering and product innovation.

●Publication Information

All papers of ICDEPI 2020 will be published in Conference Proceeding , which will be indexed by EI Compendex, Scopus, Conference Proceedings Citation Index – Science (CPCI-S)(Thomson Reuters, Web of Science), Inspec and other indexing organizations.

●Invited Speaker (Continuous updating)

Prof. Dongming Wei, Nazarbayev University, Kazakhstan

Dongming Wei is a full Professor in the Department of Mathematics of Nazarbayev University. His research portfolio includes nonlinear finite element analysis of engineering problems in solid and fluid mechanics, modeling of graphene based structural materials, modeling of human eye and cancer cells, modeling of soil foundations and landslides, modeling of porous medium flows at high Reynolds numbers, computational non-Newtonian thermal flows in extrusion dies, numerical solutions of nonlinear option price equations.

●Topics(for more topics:

Design Engineering

Design Processes

Design Theory and Research Methodology

Design Education

Production Innovation

Product Development and Design

Product Process Design and Management

Product Quality Management

●Paper Submission

Submission Email:

Submission System:

●Call for participants

1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us:

2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation you are welcome to join us and share your ideas!

3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to:

●Contact Us

Ms. Linda Lee


Tel:+852-30697937( Hong Kong)


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.