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ICDEPI 2020 - 4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)

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Category Design Engineering ;Production Innovation ;Design Education

Deadline: May 10, 2020 | Date: July 09, 2020-July 11, 2020

Venue/Country: Kuala Lumpur, Malaysia, Malaysia

Updated: 2020-03-16 18:43:03 (GMT+9)

Call For Papers - CFP

Call for Papers

4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)

July, 9-11, 2020/Kuala Lumpur, Malaysia


4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Kuala Lumpur, Malaysia from July 9 to 11, 2020!

The conference is an international forum for the presentation of technological advances and research results in the fields of design engineering and product innovation.

●Publication Information

All papers of ICDEPI 2020 will be published in Conference Proceeding , which will submitted to EI Compendex, Scopus, Conference Proceedings Citation Index – Science (CPCI-S)(Thomson Reuters, Web of Science), Inspec and other databases for review and indexing.

●Conference Speaker (Continuous updating)

Prof. Mohd Hamdi Bin Abd Shukor, University of Malaya, Malaysia

He is a Fellow of the Institution of Mechanical Engineering, UK, and a professional engineer registered with the Board of Engineers Malaysia. Prof Hamdi has devoted his career in nurturing research and innovation and has mentored over 130 postgraduate students, particularly in the field of advanced manufacturing, materials processing and biomaterials. He has authored more than 160 ISI journals and h-index of 27. He is also a director and founder of the University of Malaya’s Centre of Advanced Manufacturing & Materials Processing (AMMP Centre), in which has grown from modest-size team of researchers and engineers to an interdisciplinary research hub. Prof Hamdi has obtained recognition from various international and local organizations. Recently, he was appointed as the Vice Chancellor of The National University of Malaysia (UKM).

Prof. Dongming Wei, Nazarbayev University, Kazakhstan

Dongming Wei is a full Professor in the Department of Mathematics of Nazarbayev University. His research portfolio includes nonlinear finite element analysis of engineering problems in solid and fluid mechanics, modeling of graphene based structural materials, modeling of human eye and cancer cells, modeling of soil foundations and landslides, modeling of porous medium flows at high Reynolds numbers, computational non-Newtonian thermal flows in extrusion dies, numerical solutions of nonlinear option price equations.

Prof. Weimin Huang, Nanyang Technological University, Singapore

Dr Wei Min Huang is currently an Associate Professor at the School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore. He has 17 years of experience on shape memory materials (alloy, polymer, composite and hybrid) and technologies. He has published two books (Thin Film Shape Memory Alloys [co-ed., Cambridge University Press, 2009]; Polyurethane Shape Memory Polymer [co-au., CRC, 2011]) and over 100 papers in journals, such as Materials Today, Soft Matter, Journal of Materials Chemistry etc, and has been invited to review manuscripts from over 60 international journals and proposals from American Chemical Society etc. He is currently on the editorial board of four journals.

Prof. Parvathy Rajendran, Universiti Sains Malaysia, Malaysia

She has also been involved as a systems and flight test engineer in various UAV projects in the UK, which all successfully flown. Her appointment as the Head of System and Design Research Cluster and as the Laboratory Manager for UAV Laboratory in the School of Aerospace Engineering provides further recognition to her credibility. In 2016, she was awarded with the “Anugerah Pekerja Cemerlang (APC)” for excellence in work and the “Anugerah Sanggar Sanjung” for excellence in high impact publication from USM.

●Topics(for more topics:

Design Engineering

Design Processes

Design Theory and Research Methodology

Design Education

Production Innovation

Product Development and Design

Product Process Design and Management

Product Quality Management

●Paper Submission

Submission Email:

Submission System:

●Call for participants

1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us:

2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation you are welcome to join us and share your ideas!

3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to:

●Contact Us

Ms. Linda Lee


Tel:+852-30697937( Hong Kong)


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.