MSSD 2019 - 2019 International Conference on Material Science and Semiconductor Devices (MSSD2019)
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Website https://www.keoaeic.org/MSSD2019 |
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Category Conference on Material Science;Semiconductor Devices;MSSD2019
Deadline: November 08, 2019 | Date: November 15, 2019-November 17, 2019
Venue/Country: shenzhen, China
Updated: 2019-07-30 17:10:26 (GMT+9)
Call For Papers - CFP
important information:Website URL: https://www.keoaeic.org/MSSD2019Start Date / End Date: November 15-17, 2019Location: Shenzhen, China.Submission Deadline: September 20, 20191.About the conference:2019 International Conference on Material Science and Semiconductor Devices (MSSD2019) will be held on November 15-17, 2019 in Shenzhen, China. The aim is to provide an international platform for experts, engineers, researchers in material science and semiconductor devices to share research results and advanced technology. The conference also discusses the trend of academic development and helps to bridge the R&D results with industry. Another goal is to promote the establishing of business or research relations among global partners for future collaboration.We sincerely invite you to participate in MSSD 2019 and hope this event could meet and exceed your anticipation.2.Publication- Submit to the ConferenceAll accepted papers of MSSD 2019 will be published in the IOP Conference Series: Materials Science and Engineering(MSE) (ISSN:1757-8981), which will be submitted to EI Compendex (CPX), SCOPUS, CPCI for indexing.*All submissions must not be less than 4 pages in length and papers should be submitted to ICMSSDyeah.net.- Submit to the SCI journal*All submissions must not be less than 10 pages in length and papers should be submitted to servicekeoaeic.org and noted "SCI-ICMSSD".Journal 1 (IF≈2.2): Study on the structure of chemical species;Journal 2 (IF≈0.9): Energy-related technologies, science and equipments, thermals.Journal 3(IF≈1): Bionic and Nano-biomaterialsJournal 4(IF≈1.6): New technology and application to promote the development of Engineering Composite Materials.3.Important DatesSubmission Deadline:September 20, 2019Notification Date: 1-2 weeks after submissionRegistration Deadline:November 13, 2019Conference Date:November 15-17, 20194.Submission Guides- EI submissionPlease submit the full paper(word+pdf) and Paper Submission Form to ICMSSDyeah.net. You can download the EI template on the official website.- SCI submissionPlease submit the full paper(word+pdf) and Paper Submission Form to servicekeoaeic.org. You can download the SCI template on the official website.5.Call For PapersMaterial Science(1) Fundamentals of Materials Science (2) Material science and engineering (3) Applications of Materials Science and Technology More Related TopicsSemiconductor Devices (1) Semiconductor Materials and Applications / Semiconductor Processing;(2) Emerging Semiconductor Technologies;(3) Novel Semiconductor Devices and Applications;More Related TopicsOther related topics6.RegistrationItemsRegistration fee (By US Dollar)Regular Registration (4-6 pages)450 USD/per paperAdditional Paper (4-6 pages)430 USD/per paperExtra Pages (Begin at Page 7)50 USD/per extra pageAttendees without Papers230 USD/per personAttendees without Papers (Groups)200 USD/per person (≥ 3 persons)Purchase Extra Journal75 USD/book7.ScheduleScheduleNovember1513:00-17:00RegistrationNovember 1609:00-12:00Speeches of Keynote Speakers12:00-14:00Lunch14:00-17:30Oral Presentations18:00-19:30BanquetNovember1709:00-18:00Academic Investigation*A more detailed programme will be determined one month before the conference. Actual arrangements may be a little different from the table above because of the number of participants.8.Contact UsConference Secretary: Ms. XieE-mail: ICMSSDyeah.netTel: +86-13922157864 (cellphone)WeChat: 13922157864QQ: 1966347161Website URL: https://www.keoaeic.org/MSSD2019微信图片_20190730144949.jpg
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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