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    ICVMEE 2019 - 2019 5th International Conference on Vehicle, Mechanical and Electrical Engineering (ICVMEE 2019)

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    Website http://web.of.science.cfp.edu.pl/my/ | Want to Edit it Edit Freely

    Category 2019 5th International Conference on Vehicle, Mechanical and Electrical Engineering (ICVMEE 2019);2019年第五届汽车,机械与电子工程国际会议 (ICVMEE 2019)

    Deadline: September 28, 2019 | Date: September 29, 2019-September 30, 2019

    Venue/Country: Dalian, China

    Updated: 2019-03-27 15:15:46 (GMT+9)

    Call For Papers - CFP

    2019 5th International Conference on Vehicle, Mechanical and Electrical Engineering (ICVMEE 2019)

    2019年第五届汽车,机械与电子工程国际会议 (ICVMEE 2019)

    September 28-29, 2019 Dalian, China.

    The aim of ICVMEE is to provide a platform for researchers, engineers, and academicians, as well as industrial professionals, to present their research results and development activities in vehicle, mechanical, and electrical engineering, and its applied technology. It provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration. The focus of this ICVMEE includes all aspects of vehicle, mechanical and electrical engineering, especially focusing on the technologies for automotive chassis and automotive electronics.

    刊出详情:

    ICVMEE 2014

    Trans Tech Publications:https://www.scientific.net/AMM.721

    ICVMEE 2015

    DEStech Publications:

    https://www.destechpub.com/product/2nd-international-conference-vehicle-mechanical-electrical-engineering-icvmee-2015/

    ICVMEE 2016

    DEStech Publications:

    http://dpi-proceedings.com/index.php/dtetr/issue/view/53

    ICVMEE 2017

    DEStech Publications:

    http://dpi-proceedings.com/index.php/dtetr/issue/view/159

    Publication

    Accepted papers from ICVMEE 2019 which meet the Conference requirements would be published in conference proceedings by SCITEPRESS (Science and Technology Publications, Lda.) and submitted for indexation by CPCI, EI Compendex, DBLP, SCOPUS, Google Scholar.

    ICVMEE 2019会议所有被录用并注册的文章将出版到The SciTePress Digital Library (Science and Technology Publications, Lda),并送审EI Compendex and Scopus, and Thomson Reuters Conference Proceedings Citation Index (Web of Science), 所有注册的文章将被收录在SCITEPRESS Digital Library.

    征稿主题内容不限制以下方向:

    1.车辆工程与设计;

    2.交通运输工程,车辆和道路安全;

    3.机械与制造工程;

    4.系统建模和算法;

    5.系统测试,诊断,检测和监测,仪器和测量;

    6.电气与电子技术,电力系统工程;

    7.车辆和运输通信,信号处理;

    8.信息技术和网络应用;

    9.识别,视频和图像处理;

    10.车辆和运输材料,燃料电池和能源材料相关的应用技术

    1. 若干出版社的会议征稿,EI,cpci,cnki等检索(因出版社不同,文理不同,检索有所不同);

    2. 英文普刊征稿,谷歌学术等检索(无ei,sci检索);

    3. 部分会议主题的优秀稿件,可以推荐至SCI, EI检索的期刊发表(出版无会议信息)。

    4. 投稿作者翻译服务;

    5. 检索作者检索证明开具服务;

    联系

    QQ:1422679111

    WeChat/tel: 13212744212

    E-Mail:jiangleiatnjust.edu.cn


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.