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ICESS 2019 - The Fifth International Conference on Electronics and Software Science ICESS2019

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Website http://sdiwc.net/conferences/fifth-icess-2019/ | Edit Freely

Category Electronics; Software Science; Automobile Engineering; Communications; Japan International Conference 2019; Fifth ICESS

Deadline: July 02, 2019 | Date: August 02, 2019-August 04, 2019

Venue/Country: Takamatsu Sunport Hall Building, Japan

Updated: 2019-01-15 23:46:55 (GMT+9)

Call For Papers - CFP

The Fifth International Conference on Electronics and Software Science (ICESS2019)

Venue: Takamatsu Sunport Hall Building, Takamatsu, Japan

Dates: August 2-4, 2019

URL: http://sdiwc.net/conferences/fifth-icess-2019/

In collaboration with Takamatsu Convention and Visitors Bureau, and IEEJ: The Institute of Electrical Engineers of Japan.

Research topics are not limited to:

- Advanced Electronics

- Analog and Digital Circuit Design

- Broad band Communication

- Control and Robotics

- e-Healthcare System

- Ergonomics and Application

- Feedback Control Systems

- Information Systems and Network Security

- Machine Learning

- Mechatronics and Avionics

- Modeling and Classification

- Non Conventional Energy Resources

- Power Electronics and Energy Efficient Drives

- Remote Sensing

- Affective Computing

- Automobile Engineering

- Computer and Intelligent Communication

- Disaster Prevention Engineering

- Electromagnetics and Photonics

- High-Performance Computing

- RF and Microwave Engineering

- Server Virtualization

- Technology

- Software for Life Science

- System Modeling & Simulation

- VLSI technology & Nano Devices

The conference aims to enable researchers build connections between different digital applications and engineering. As well as to invite researchers from around the world to meet, greet and share collaborative minds as to present the research works.

IMPORTANT DATES

July 02, 2019 Submission Deadline

July 15, 2019 Notification of Acceptance (or 1–2 weeks from the submission date)

July 22, 2019 Camera Ready Submission

July 22, 2019 Registration Deadline


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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