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    ICFM 2019 - KEM--2019 The International Conference on Functional Materials (ICFM 2019)--Ei Compendex, Scopus

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    Category Functional Materials;Micro/Nano Materials;Composites

    Deadline: July 15, 2019 | Date: September 04, 2019-September 06, 2019

    Venue/Country: Tohoku University, Japan

    Updated: 2019-06-25 11:05:24 (GMT+9)

    Call For Papers - CFP

    * Welcome to ICFM 2019 *

    KEM--2019 The International Conference on Functional Materials (ICFM 2019)--Ei Compendex, Scopus, will be held in 【Tohoku University, Japan】 during 【September 4-6, 2019】.

    The conference aims to provide a forum for many of the leading researchers, scientists and engineers from across the field of Functional Materials.

    We welcome you to join us this year for a program that includes keynote speakers, oral presentations and poster sessions.

    Hope you find ICFM fruitfully and memorably.

    ● Proceedings

    The submitted full papers will be peer-reviewed, accepted and registered full papers will be published into Key Engineering Materials (ISSN: 1662-9795) published by TTP.

    It will be sent for major indexing, such as 【EI Compendex, Scopus】

    ● Keynote Speakers

    Prof. LU Li, National University of Singapore, Singapore

    Prof. Shu Yin, Tohoku University, Japan

    Prof. Jinshu Wang, Beijing University of Technology, China

    ● Invited Speaker

    Prof. Jiangfeng Ni, Soochow University, China

    ● Topics

    - Biomaterials

    - Building materials

    - Carbon based materials

    - Ceramic

    - Composites

    - Earthquake materials and design

    - Environmental friendly materials

    - High strength alloys

    - Intelligent materials systems

    - Iron and steel

    - Materials processing and handling

    - Metallurgical science

    - Metallurgical fundamentals and techniques

    - Micro/Nano materials

    - New functional materials

    - New energy materials

    - Non ferrous metal material

    - Optical, Electronic, Magnetic materials

    - Polymeric materials

    - Processing technology for functional materials

    - Smart and intelligent materials

    - Thin films Mechanical behavior and fracture

    - Tool testing and evaluation of materials

    ● Submission

    ● Venue

    Tohoku University, Japan

    Address: Katahira 2-1-1, Sendai, Miyagi, Japan

    ● Contact

    Ms. Frannie Lee

    T: +86 1397 222222 4


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.