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ITEEE 2019 - (EI Compendex+Scopus)2019 International Conference on Information Technology, Electrical and Electronic Engineering (ITEEE2019)

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Website http://www.iteee2019.org/ | Edit Freely

Category Information Technology, Electrical and Electronic Engineering

Deadline: December 18, 2018 | Date: January 20, 2019-January 21, 2019

Venue/Country: Sanya, China

Updated: 2018-12-05 13:51:35 (GMT+9)

Call For Papers - CFP

About ITEEE2019

2019 International Conference on Information Technology, Electrical and Electronic Engineering (ITEEE2019) will be held in Sanya, China during January 20-21, 2019.

ITEEE2019 will serve people as one of the most important international activities in Information Technology, Electrical and Electronic Engineering fields. ITEEE2019 has been supported by world-famous scientists and scholars, and will make a perfect opportunity for you to present your research and meet other scholars. With the target of building a high qualified forum, ITEEE2019 will spare no effort to make its participants access the most knowledge in related fields. It is very appreciated that you could join us by sending your paper. It is quite certain that you will have a good time with us!

All submitted conference papers will be blind peer reviewed by three competent reviewers. All accepted papers for ITEEE2019 will be published on the Journal of DEStech Transactions on Computer Science and Engineering (ISSN: 2475-8841), ISBN and DOI, and will be submitted for indexing in EI Compendex, Thomson Reuters Web of Science CPCI-S (ISTP indexing) and CNKI Scholar for worldwide online citation.

ITEEE2019 will also be online available in full text via the press platform.

Excellent papers will be selected and published on SCI and EI journals.

Download the Paper Format: http://www.iteee2019.org/Template.doc

Download the Submission Form: http://www.iteee2019.org/Submission_Form.xlsx

Please send your Paper(s) and Submission Form to ITEEE2019 via email: submit@iteee2019.org or iteee2019@sina.com, The email subject should be named "Submission+Name+Tel".

Regular papers are allowed to 5 pages. Extra pages(exceed 5 pages) will incur additional charges.

Authors are invited to submit a full paper, and papers should be written in English.

Topics of interest include, but are not limited to:

Topic 1: Information Engineering

Antennas & Propagation

Information indexing & retrieval

Cloud computing

Intelligent Robotics

Hybrid information technology

Vehicular communications

Information Management Systems and Services

Network Protocols

Internet and Intranet Technologies and Services

Information Theory and Coding Theory

Communication Protocols and Standards

Data communications

Wireless sensor networks

Information networks

Signal Processing, Pattern Recognition and Applications

Computer Crime Prevention and Detection

Nano/Mobile Technology

Information Technology & Globalization

Geographical Information Systems

Optical Fiber Communication

Microwave Engineering

Electronics´╝îInformation and Communication

Coding and Signal Processing

Privacy protection and the ethics issues

Network and Information Security

Communication and Networking

Information Theory, System, and Technology

Spread Spectrum Communications

Broadband Communication Systems

Wireless Communication

Communication and System Security

Optimization of Communication Systems

Cryptography and data security

Computer Science and Engineering

Computer simulation and modeling

Computer-aided design / manufacturing

Topic 2: Electrical Engineering

Circuits and Electronics

Analog & Mixed Signal Circuits and Signal Processing

Bioengineering Circuits and Systems

Circuits and Systems for Communications

Digital Circuits and Signal Processing

Emerging Technologies (Nano, MEMS)

Low-Power and Harvesting Technique

Multimedia Systems and Signal Processing

Neural Network Circuits and Systems

Nonlinear Circuits and Systems

Photonic and Optoelectronic Circuits

Sensing and Sensor Networks

Test and Reliability

VLSI Systems, Applications and Computer Aided Network Design

Topic 3: Electronics and Communications Engineering

QoS Provisioning and Architectures

Telecommunication Services and Applications

Wireless Networking

Optical Communications

Multimedia Communications

Network Performance

Innovative Networking Technologies

Network Security

Network Planning and Design

Software Technology in communication Engineering

Topic 4: Applied Electronics

Embedded Systems

Reconfigurable Computing

VLSI Design

Biomedical Electronics

Industrial Electronics and Automations

Robotics

Electronic Devices in Communications

Software Engineering in Electronics

Applications of Neural Networks

Industrial Automation and Control

Topic 5: Microwave Engineering

Antennas - Design, Modeling and Measurement

Microwave Circuits - Systems and Applications

Computational Electromagnetics

Radio Propagations

Integrated Optics

Topic 6: Mechatronics Engineering

Modeling and Design

Advanced Manufacturing

Advanced Motion Control

Intelligent Control

System Integration

Sensors and Actuators and Networks

Robotics, Mobile Platforms, Unmanned Vehicles

Automotive and Transportation Systems

Vibration and Noise Control

Micro Mechatronics

Mechatronics in Energy Systems

Fault detection and Diagnosis in Mechatronics Systems

Human-Machine Interface

Applications in Systems and Engineering

Topic 7: Coding and Signal Processing

Channel Coding

Space-Time Signal Processing MIMO and OFDM Systems

Signal Detection and Estimation

Audio/Speech Signal Processing

Image/Video Processing and Coding

Medical Imaging and Image Analys

Other Related


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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