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2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineering (AEMCME 2018)

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Category Electronic Materials, Computers and Materials Engineering

Deadline: August 30, 2018 | Date: September 14, 2018-September 16, 2018

Venue/Country: Singapore, Singapore

Updated: 2018-07-04 23:36:31 (GMT+9)

Call For Papers - CFP


All accepted papers of AEMCME 2018 will be published in IOP Conference Series: Materials Science and Engineering(MSE)(ISSN:17578981 EISSN:1757899X), and will be submitted to EI Compendex, Scopus for indexing.

Call For Papers

(I) Advanced Electronic Materials

(1) Dielectric material

(2) Semiconductor material

(3) Piezoelectric and ferroelectric materials

(4) Conductive metals and their alloys

(5) Magnetic material

(6) Optoelectronic materials

(7) Electromagnetic shielding materials

(II) Computers Engineering

(8) Operating Systems

(9) Quantum Computing Theory

(10) Scientific Computing

(11) Computer Programming

(12) Database Management Systems

(13) Evolutionary Computation

(14) Logic Programming

(15) Machine Learning

(16) Software Engineering

(17) Symbolic Mathematics

(18) Digital Signal Processing (DSP)

(19) Advanced Adaptive Signal Processing

(20) Computer Vision & VR

(21) Multimedia & Human-computer Interaction

(22) AI & Neural Networks

(23) Communication Signal processing

(24) SP for Internet and Wireless Communications

(III) Materials Engineering

(25) Composites

(26) Micro / Nano Materials

(27) Iron and Steel

(28) Ceramic

(29) Metal alloy Materials

(30) Biomaterials

(31) Optical/Electronic/Magnetic Materials

(32) Building Materials

(33) Energy Materials

(34) Environmental Friendly Materials

(35) Biomaterials

(36) Chemical Materials

(37) Thin Films

(38) 3D materials

(39) Intelligent Materials

(40) Cryogenic Materials

(41) Materials Physics and Chemistry

(42) Tooling Testing and Evaluation of Materials

Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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