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ESMT- 2019 - 2nd Annual International Conference on Engineering, Smart Materials and Technologies

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Category Engineering, Technology, Applied Sciences, Communication, Information Sciences; Smart Materials; Networking;

Deadline: April 05, 2019 | Date: April 20, 2019

Venue/Country: Osaka International Convention Center, Japan, Japan

Updated: 2018-07-03 21:49:11 (GMT+9)

Call For Papers - CFP

Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.


All papers for the conference will be published in the Journal volume, and one Excellent Paper will be selected from each oral session.

Main Tracks of the conferences but not limited to:

Mechanical & Industrial Engineering

Electrical and Electronics Engineering




Civil Engineering


Oil, Gas, Energy & Mining Engineering

Basic Sciences

Applied Sciences

Important Information

Conference Date: April 20-21, 2019

Abstract Submission Date: April 05, 2019

Full Paper Submission Date: April 10, 2019

Early Bird Date: March 20, 2019

Manuscript Id:

Conference Venue: Osaka International Convention Center, Japan

Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.