ESMT- 2019 - 2nd Annual International Conference on Engineering, Smart Materials and Technologies
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Website http://consortium-et.com/upcoming-events/esmt-annual-conference-2019/ |
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Category Engineering, Technology, Applied Sciences, Communication, Information Sciences; Smart Materials; Networking;
Deadline: April 05, 2019 | Date: April 20, 2019
Venue/Country: Osaka International Convention Center, Japan, Japan
Updated: 2018-07-03 21:49:11 (GMT+9)
Call For Papers - CFP
Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference.Publications:All papers for the conference will be published in the Journal volume, and one Excellent Paper will be selected from each oral session.Main Tracks of the conferences but not limited to:Mechanical & Industrial EngineeringElectrical and Electronics EngineeringPhysicsChemistryICTCivil EngineeringManagementOil, Gas, Energy & Mining EngineeringBasic SciencesApplied SciencesImportant InformationConference Date: April 20-21, 2019Abstract Submission Date: April 05, 2019Full Paper Submission Date: April 10, 2019Early Bird Date: March 20, 2019Manuscript Id: esmtconsortium-et.comConference Venue: Osaka International Convention Center, Japan
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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