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TICEAS 2019 - The International Conference on Engineering and Applied Sciences

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Category Biomedical Engineering;Chemical Engineering; Civil Engineering; Computing Science & IT Engineering; Electrical & Electronic Engineering; Environmental Engineering; Fundamental and Applied Sciences; Material Science and Engineering; Mechanical Engineering

Deadline: October 17, 2018 | Date: February 12, 2019-February 15, 2019

Venue/Country: Singapore, Singapore

Updated: 2018-04-25 17:44:53 (GMT+9)

Call For Papers - CFP

The International Conference on Engineering and Applied Sciences (TICEAS) is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of Biomedical Engineering, Chemical Engineering, Civil Engineering, Computing Science & IT Engineering, Electrical & Electronic Engineering, Environmental Engineering, Fundamental and Applied Sciences, Material Science and Engineering, Mechanical Engineering and all sub-fields.

2019 TICEAS will take place from February 12-15 in Singapore. All abstracts/papers should conform to the required format and be uploaded on the website. Submission shall pass the double blind paper review first in order to be presented in the conference.

More information please visit:


Biomedical Engineering

Chemical Engineering

Civil Engineering

Computing Science & IT Engineering

Electrical & Electronic Engineering

Environmental Engineering

Fundamental and Applied Sciences

Material Science and Engineering

Mechanical Engineering

Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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