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Therminic 2018

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Website http://therminic2018.eu/ | Edit Freely

Category Nanotechnology and smart materials; Systems Engineering; Thermal Issues; Electronics; Electronics Engineering; Simulations; Embedded Systems; Engineering; Thermal Investigations; Cooling concepts; Thermo-mechanical Reliability; Thermo-materials

Deadline: April 11, 2018 | Date: September 26, 2018-September 28, 2018

Venue/Country: Stockholm, Sweden

Updated: 2018-03-27 23:15:21 (GMT+9)

Call For Papers - CFP

THERMINIC is the major European Workshop for thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:

• Thermal Phenomena, Simulation and Experiment

• Electronics Cooling Concepts

• Thermo-Mechanical Reliability


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.