Therminic 2018
Website http://therminic2018.eu/ |
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Category Nanotechnology and smart materials; Systems Engineering; Thermal Issues; Electronics; Electronics Engineering; Simulations; Embedded Systems; Engineering; Thermal Investigations; Cooling concepts; Thermo-mechanical Reliability; Thermo-materials
Deadline: April 11, 2018 | Date: September 26, 2018-September 28, 2018
Venue/Country: Stockholm, Sweden
Updated: 2018-03-27 23:15:21 (GMT+9)
Call For Papers - CFP
THERMINIC is the major European Workshop for thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:• Thermal Phenomena, Simulation and Experiment• Electronics Cooling Concepts• Thermo-Mechanical ReliabilityKeywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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