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    ICICM 2018 - IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei Compendex and Scopus

    View: 814

    Website http://www.icicm.net/ | Want to Edit it Edit Freely

    Category Integrated Circuits;Microsystems;Low-power;RF devices & circuits

    Deadline: September 30, 2018 | Date: November 24, 2018-November 26, 2018

    Venue/Country: Shanghai, China

    Updated: 2018-08-20 17:51:42 (GMT+9)

    Call For Papers - CFP

    ==Publication: IEEE Conference Proceeding

    ==Indexed by: IEEE Xplore, Ei Compendex, and Scopus*

    ==Submission email:icicmatyoung.ac.cn (Or you still can submit to the submission system on website)

    ==Find the tempalte with the link:http://www.icicm.net/Template.doc

    ★Keynote Speakers & Invited Speakers

    Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA

    Prof. Gene Eu (Ching Yuh) Jan,National Taipei University, Taiwan

    Prof. Fei Yuan,Ryerson University,Canada

    Prof. Zhi-Jian Xie,North Carolina A&T State University, USA

    ★Advisory Chairs

    Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA

    Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan

    ★Conference Chairs

    Prof. Zhigong Wang, Southeast University, China

    Prof. Li Qiang, University of Electronic Science and Technology of China, China

    ★Conference Co-Chair

    Prof. Gene Eu Jan, National Taipei University, Taiwan

    ★Program Chairs

    Prof. Fei Yuan, Ryerson University, Canada

    Prof. Zhi-Jian Xie, North Carolina A&T State University, USA

    ★Steering Committee Chair

    Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

    ★Technical Committee

    Prof. Bo Yan, University of Electronic Science & Technology of China, China

    Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India

    Prof. Xiaoxiao Wang, BeiHang University, China

    Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China

    Prof. Jinzhao Wu, Guangxi University for Nationalities, China

    Prof. Shiwei Feng, Beijing University of Technology, China

    Assoc. Prof. Wei Ni, Hefei University of Technology, China

    Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China

    Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China

    Prof. Jinyan Wang, Peking University, China

    Prof. Zhi-Jian Xie, NC A&T State University, USA

    Prof. S. Ushakumari, College of Engineering Trivandrum, India

    Prof. Lu Tang, Southeast University, China

    Prof. Haizhi Song, University of Electronic Science and Technology of China, China

    Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China

    Prof. Shiwei Feng, Beijing University of Technology,China

    For more members, please visite conference website: http://www.icicm.net/committee.html

    ★★History

    Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

    Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

    Papers of ICICM2017 can be checked in IEEE Xplore now!

    Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

    ★TOPICS

    Digital, Analog, Mixed Signal IC and SOC design technology

    Silicon integrated circuits and manufacturing

    Low-power, RF devices & circuits

    IC Computer-Aided –Design technology, DFM

    Silicon/germanium devices and device physics

    Interconnect, Low K, High K and other process technologies

    Unconventional and nano-electronics

    Organic semiconductor devices and technologies

    Compound semiconductor devices and circuits

    Displays, sensors and MEMS

    Semiconductor materials and material characterization

    Packaging and testing technology

    Solar cell & other devices for new energy sources

    Modeling and simulation

    Equipment technology

    Reliability

    Displays, sensors and MEMS

    Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

    ★Support

    1, Technical Support from IEEE

    2, support from University of Electronic Science and Technology of China and Southeast University, China

    ★Conference Contact

    Ms Sissi Chan

    Email: icicmatyoung.ac.cn

    Tel: +86-28-87777577


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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