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2018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018)

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Website http://www.d2me.org/ | Edit Freely

Category Material Science and Processing;Engineering Materials

Deadline: June 20, 2018 | Date: September 27, 2018-September 29, 2018

Venue/Country: Phuket, Thailand

Updated: 2018-05-15 11:55:10 (GMT+9)

Call For Papers - CFP

2018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018)

September 27-29 |Phuket, Thailand

http://www.d2me.org/

2018 3rd International Conference on Design, Mechanical and Material Engineering (D2ME 2018) is co-organized by RMIT University, AUT University, Swinburne University of Technology, The Australian National University and Hong Kong Society of Mechanical Engineers. The conference will be held at Phuket, Thailand, from September 27-29, 2018 ! D2ME 2016 and D2ME 2017 have been successfully held at Oakland and Melbourne in 2016 and 2017.

The conference is an international forum for the presentation of technological advances and research results in the fields of Design, Mechanical and Material Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospected authors submit your new research papers to D2ME 2018, and share the valuable experiences with the scientist and scholars around the world.

●Publication and Indexing

All the registered and presented papers will be published in the volume of Conference Proceeding and MATEC web of conferences (ISSN:2261-236X),which will be indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other databases.

Selected papers with great extension will be recommended to publish in international journals.

●D2ME 2018 Speakers

Prof. Ooi Kim Tiow, Nanyang Technological University, Singapore

Dr Ooi Kim Tiow is a Professor in the School of Mechanical & Aerospace Engineering. He received BEng in 1986 and Ph.D. in 1989, both in Mechanical Engineering from University of Strathclyde, Scotland, U.K.

Prof. C. W. LIM,City University of Hong Kong.

Prof. Lim is also a visiting professor at various universities including the University of Western Sydney, Dalian University of Technology, etc. He has expertise in vibration of plate and shell structures, dynamics of smart piezoelectric structures, nanomechanics and symplectic elasticity. He is the Editor for Journal of Mechanics of Materials and Structures (JoMMS), Associate Editor (Asia-Pacific Region) for Journal of Vibration Engineering & Technologies (JVET), Associate Editor for International Journal of Bifurcation and Chaos (IJBC), International Subject Editor for Applied Mathematical Modelling (AMM), and also on the editorial board of some other international journals.

●Topics of interest for submission include, but are not limited to:

Material Science and Processing

Dynamical Systems

Engineering Materials

Dynamics and Vibration

Nanomaterial Engineering

Energy Engineering and Management

Design Methodology

Precision mechanics, mechatronics

Design and Development

More topics can be found at: http://www.d2me.org/cfp.html

●Paper Submission

1.You can choose to submit your paper directly to d2me@smehk.org

2.You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/D2ME2018

●Contact Us:

If you have any question, please feel free to contact our conference secretary.

Ms. Young Yang

Tel:+852-30697937

Welcome you to contact us by Email to d2me@smehk.org

http://www.d2me.org/


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.