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2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)

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Website http://www.icdepi.org/ | Edit Freely

Category Design Engineering;Production Innovation

Deadline: June 01, 2018 | Date: July 01, 2018-July 03, 2018

Venue/Country: Dalian, China

Updated: 2018-05-15 11:48:29 (GMT+9)

Call For Papers - CFP

2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)

July. 1-3, 2018 |Dalian, China

http://www.icdepi.org/

2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Dalian University of Technology, Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from July 1-3, 2018!

The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.

●Publication and Indexing

1.All papers of ATDMAE 2017 will be published in IOP Conference Series: Materials Science and Engineering(ISSN: 1757-899X), which will be indexed by SCOPUS, Ei Compendex and other academic databases.

2.High quality papers will be recommended to publish in International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO), ISSN 1779-6288( Online), indexed by SCOPUS, DOAJ, Google Scholar, ProQuest, Crossref, etc.

●2018 Keynote Speakers:

1.Prof.Huang Weimin, Nanyang Technological University, Singapore

2.Prof.Sam Zhang Shanyong, Southwest University, China

3.Prof.Shu Dong Wei, Nanyang Technological University, Singapore

4.Prof.Shunying Ji, Dalian university of Technology, China

5.Prof.Cees De Bont,Hong Kong Polytechnic University, Hong Kong

6.Prof.Henri Christiaans,Ulsan National Institute of Science & Technology, South Korea

●Topics of interest for submission include, but are not limited to:

Design Engineering

Design Processes

Design Theory and Research Methodology

Design Organization and Management

Product, Service and Systems Design

Design Information and Knowledge

Production Innovation

Product Development and Design

Product Process Design and Management

Product Quality Management

Intelligent Product

More topics can be found at: http://www.icdepi.org/cfp.html

●Paper Submission

1.You can choose to submit your paper directly to icdepi@smehk.org

2.You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDEPI2018

●Contact Us:

If you have any question, please feel free to contact our conference secretary.

Ms. Suzy Shih

Tel:+852-30697937

Welcome you to contact us by Email to icdepi@smehk.org

http://www.icdepi.org/


Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.