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WOSAR 2017 - The 9th International Workshop on Software Aging and Rejuvenation

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Category software aging;software rejuvenation;software reliability;dependability;

Deadline: July 30, 2017 | Date: October 23, 2017-October 26, 2017

Venue/Country: Toulouse, France

Updated: 2017-07-20 22:04:46 (GMT+9)

Call For Papers - CFP

WoSAR: The 9th International Workshop on Software Aging and Rejuvenation

October 23-26, 2017, Toulouse, France, co-located with ISSRE 2017

Software aging is a problem of progressive degradation of performance and

dependability in computer programs, especially those executing for long

period of time.

This phenomenon has been extensively studied since more than 20 years,

as it affects many systems, from embedded devices to server software to

critical systems.

Software rejuvenation, i.e. restart of application (components/threads/task),

VMs or machines, is the most prominent approach to combat software aging.

A variety of reactive and proactive rejuvenation techniques, scheduling

plans, scope and granularity, have been proposed for different application

categories and platforms.

WoSAR is the premier international venue to discuss the recent advances and

discoveries in theoretical and practical aspects of software aging and

rejuvenation research.


Full paper submission: EXTENDED JULY 30, 2017

Research paper notification: August 13, 2017

Submission of camera-ready copy: August 28, 2017


This call for papers addresses all researchers and practitioners with an interest

about performance and dependability degradation of software systems.

Topics addressed in the workshop include but are not limited to:

* Progressive degradation of performability / availability /

reliability / scalability / ?ilities?in software systems.

* Modeling and characterization of the software aging


* Design and evaluation of rejuvenation techniques.

* Analysis of aging-related faults/bugs, errors, and failures.

* Software test strategies for detecting aging-related bugs.

* Monitoring and detection of software aging effects (e.g.,

memory leaks, database index fragmentation, unterminated

processes/threads, accrual of round-off errors, ...).

* New classes of software aging effects.

* Software aging and rejuvenation in Big Data and IoT Apps.

* Analytical, empirical, and experimental studies of any of the

above topics.

* Analysis of real case studies.

For all the above topics, WoSAR is a unique forum to discuss the

software aging and rejuvenation impacts on systems from different

domains of applicability such as:

Cloud computing, Mobile, Embedded, Medical, Cyber-physical,

SCADA, Smart Cities, Transportation, Telecommunication,

Military, System of systems, and others.


Authors are invited to submit high quality unpublished research

work describing the results of theoretical and experimental

software aging and rejuvenation research.

All the accepted papers will be included in the IEEE Xplore Digital


Papers must be written in English and be formatted according to

the IEEE authoring guidelines (1). Full papers should not exceed

seven pages in IEEE style. Paper submission will be done

electronically through EasyChair (2).


Distinguished papers, after further revisions and approval, will

be published in a special issue of a selected reputable journal.


Honorary General Co-Chairs:

Alberto Avritzer, Sonatype, USA

Tadashi Dohi, Hiroshima University, Japan

Kishor S. Trivedi, Duke University, USA

General Co-Chairs:

Rivalino Matias, Federal University of Uberlandia, Brazil

Hiroyuki Okamura, Hiroshima University, Japan

Program Committee Co-Chairs:

Artur Andrzejak, Heidelberg University, Germany

Jianwen Xiang, Wuhan University of Technology, China

Publication Co-Chairs:

Roberto Pietrantuono, University of Naples Federico II, Italy

Jing Zhao, Harbin Engineering University, China

Publicity Co-Chairs:

Roberto Natella, University of Naples Federico II, Italy

Vasilis Koutras, University of the Aegean, Greece

Zheng Zheng, Beihang University, China

Finance Co-Chairs:

Xiaolin Chang, Beijing Jiaotong University, China

Fumio Machida, NEC Corporation, Japan

Web Master:

Junjun Zheng, Hiroshima University, Japan


Alberto Avritzer, Sonatype, USA

Daniel Sadoc Menasch¨¦, Federal University of Rio de Janeiro, Brazil

Dong Li, China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), China

Dongdong Zhao, Wuhan University of Technology, China

Francesco Longo, University of Messina, Italy

Fumio Machida, NEC LASD, Japan

Hiroshi Yamada, Tokyo University of Agriculture and Technology, Japan

Hiroyuki Okamura, Hiroshima University, Japan

Javier Alonso, Amazon, USA

Jianwen Xiang, Wuhan University of Technology, China

Jinghui Li, Huawei Technologies Corporation, China

Kalyan Vaidyanathan, Qualcomm, USA

Katinka Wolter, Freie Universit?t Berlin, Germany

Kenji Kono, Keio University, Japan

Kumiko Tadano, NEC LASD, Japan

Laura Carnevali, University of Florence, Italy

Marco Lucio Scarpa, University of Messina, Italy

Michael Grottke, SUPERCRUNCH by GfK, Germany

Miroslaw Malek, University of Lugano, Switzerland

Pasqualina Potena, SICS Swedish ICT V?ster?s AB, Sweden

Paulo Maciel, Univ. Fed. Pernambuco, Brazil

Philipp Reinecke, Hewlett Packard Labs Bristol

Roberto Natella, Universit¨¤ di Napoli Federico II, Italy

Roberto Pietrantuono, Universit¨¤ di Napoli Federico II, Italy

Stefano Russo, Universit¨¤ di Napoli Federico II, Italy

Tadashi Dohi, Hiroshima University, Japan

Victor Nicola, University of Twente, Netherlands

Zheng Zheng, Beihang University, China

Artur Andrzejak, Universit?t Heidelberg, Germany

Rivalino Matias, Federal University of Uberlandia, Brazil

Manoj Nambiar, Tata Consultancy Services Mumbai, India



Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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