IEEE BIGCOMP 2018 - 2018 IEEE International Conference on Big Data and Smart Computing
Website http://www.bigcomputing.org/ |
Category IEEE BIGCOMP 2018
Deadline: July 31, 2017 | Date: January 15, 2018-January 17, 2018
Venue/Country: Shanghai, China
Updated: 2017-04-11 17:17:41 (GMT+9)
Call For Papers - CFPBig data and smart computing are emerging research fields that have recently drawn much attention from computer science and information technology as well as from social sciences and other disciplines.The goal of the International Conference on Big Data and Smart Computing (BigComp), initiated by KIISE (Korean Institute of Information Scientists and Engineers), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in these emerging fields.Following the successes of the previous BigComp conferences in Bangkok, Thailand (2014), Jeju, Korea (2015), Hong Kong, China (2016), Jeju, Korea (2017), the 2018 International Conference on Big Data and Smart Computing (BigComp 2018) will be held in Shanghai, China.The conference is co-sponsored by IEEE and KIISE. BigComp 2018 invites authors to submit original research papers and original work-in-progress reports on big data and smart computing.Topic AreasThe topics of interest for BigComp2018 include (but are not limited to) the following:• Techniques, models and algorithms for big data• Machine learning and AI for big data• Web search and information retrieval• Models and tools for smart computing• Cloud and grid computing for big data• Security and privacy for big data• Smart devices and hardware• Big data applications: Bioinformatics, Multimedia, Smartphones, etc.• Tools and systems for big data• Data mining, graph mining and data science• Infrastructure and platform for smart computing• Big data analytics and social media• Hardware/software infrastructure for big data• Mobile communications and networks• Smart location-based servicesSubmissionPapers must be formatted in PDF according to the IEEE two-column format for conference proceedings and submitted through CMT. The direct link for paper submission is https://cmt3.research.microsoft.com/BC2018/.Papers can be either regular or short papers, where regular papers are limited to 8 pages and short ones to 4 pages. Details about the submission process including formatting instructions are at the conference website. All conference and workshop papers will be published in the IEEE Xplore Digital Library as conference proceedings.Journal PublicationSelected papers will be invited for publication in the following SCIE journals after further revision and extension.• World Wide Web (SCIE)• Peer-to-Peer Networking and Applications (SCIE)• Frontiers of Computer Science (SCIE)• Frontiers of Information Technology & Electronic Engineering (SCIE)• Chinese Journal of Electronics (SCIE)Best Paper AwardsBest Paper Awards will be conferred at the conference to the authors of selected outstanding papers.Important Dates• Workshop proposal submission due: June 30, 2017• Full paper submission due: July 31, 2017• Tutorial proposal submission due: August 30, 2017• Acceptance notification: October 30, 2017• Camera-ready copies due: November 15, 2017• Author registration due: November 20, 2017• Early registration due: December 15, 2017• Conference dates: January 15-17, 2018
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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